DE68921148T2 - Gehäuse für integrierte Schaltung hoher Dichte. - Google Patents

Gehäuse für integrierte Schaltung hoher Dichte.

Info

Publication number
DE68921148T2
DE68921148T2 DE68921148T DE68921148T DE68921148T2 DE 68921148 T2 DE68921148 T2 DE 68921148T2 DE 68921148 T DE68921148 T DE 68921148T DE 68921148 T DE68921148 T DE 68921148T DE 68921148 T2 DE68921148 T2 DE 68921148T2
Authority
DE
Germany
Prior art keywords
integrated circuit
high density
circuit package
density integrated
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68921148T
Other languages
English (en)
Other versions
DE68921148D1 (de
Inventor
Eric Benavides
Agnes Guilhot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Bull SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SA filed Critical Bull SA
Application granted granted Critical
Publication of DE68921148D1 publication Critical patent/DE68921148D1/de
Publication of DE68921148T2 publication Critical patent/DE68921148T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE68921148T 1988-11-08 1989-11-07 Gehäuse für integrierte Schaltung hoher Dichte. Expired - Fee Related DE68921148T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8814542A FR2638896B1 (fr) 1988-11-08 1988-11-08 Boitier de circuit integre de haute densite, support de circuit integre et carte d'interconnexion en resultant

Publications (2)

Publication Number Publication Date
DE68921148D1 DE68921148D1 (de) 1995-03-23
DE68921148T2 true DE68921148T2 (de) 1995-06-14

Family

ID=9371659

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68921148T Expired - Fee Related DE68921148T2 (de) 1988-11-08 1989-11-07 Gehäuse für integrierte Schaltung hoher Dichte.

Country Status (5)

Country Link
EP (1) EP0368740B1 (de)
JP (1) JPH0618225B2 (de)
DE (1) DE68921148T2 (de)
ES (1) ES2070923T3 (de)
FR (1) FR2638896B1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0678917B1 (de) * 1994-04-22 2003-06-25 Nec Corporation Trägerelement für Kühlvorrichtung und elektronisches Gehäuse mit einem solchen Element
FR2747235B1 (fr) * 1996-04-03 1998-07-10 Bull Sa Boitier de circuit integre
JP2904123B2 (ja) * 1996-05-10 1999-06-14 日本電気株式会社 多層フィルムキャリアの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680613A (en) * 1983-12-01 1987-07-14 Fairchild Semiconductor Corporation Low impedance package for integrated circuit die
KR940006585B1 (ko) * 1985-02-28 1994-07-22 소니 가부시키가이샤 반도체 회로장치
DE3706251A1 (de) * 1986-02-28 1987-09-03 Canon Kk Halbleitervorrichtung
FR2596607A1 (fr) * 1986-03-28 1987-10-02 Bull Sa Procede de montage d'un circuit integre sur une carte de circuits imprimes, boitier de circuit integre en resultant et ruban porteur de circuits integres pour la mise en oeuvre du procede
EP0282617A1 (de) * 1987-03-18 1988-09-21 Texas Instruments Deutschland Gmbh Integrierte Schaltung mit einer elektrisch leitenden Trägerplatte
EP0285277A1 (de) * 1987-03-31 1988-10-05 Amp Incorporated Chipträger mit Mitteln für Energiespeicherung

Also Published As

Publication number Publication date
EP0368740A1 (de) 1990-05-16
JPH0618225B2 (ja) 1994-03-09
JPH02183548A (ja) 1990-07-18
EP0368740B1 (de) 1995-02-15
FR2638896A1 (fr) 1990-05-11
ES2070923T3 (es) 1995-06-16
FR2638896B1 (fr) 1990-12-21
DE68921148D1 (de) 1995-03-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee