DE68914942D1 - Poly(arylensulfid)-Harzzusammensetzung. - Google Patents

Poly(arylensulfid)-Harzzusammensetzung.

Info

Publication number
DE68914942D1
DE68914942D1 DE68914942T DE68914942T DE68914942D1 DE 68914942 D1 DE68914942 D1 DE 68914942D1 DE 68914942 T DE68914942 T DE 68914942T DE 68914942 T DE68914942 T DE 68914942T DE 68914942 D1 DE68914942 D1 DE 68914942D1
Authority
DE
Germany
Prior art keywords
poly
resin composition
arylene sulfide
arylene
sulfide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68914942T
Other languages
English (en)
Other versions
DE68914942T2 (de
Inventor
Naoki Yamamoto
Hiroshi Mori
Akira Nakata
Takuya Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Publication of DE68914942D1 publication Critical patent/DE68914942D1/de
Application granted granted Critical
Publication of DE68914942T2 publication Critical patent/DE68914942T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE1989614942 1988-11-04 1989-11-02 Poly(arylensulfid)-Harzzusammensetzung. Expired - Fee Related DE68914942T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63278970A JPH02124976A (ja) 1988-11-04 1988-11-04 ポリアリーレンサルフアイド樹脂組成物

Publications (2)

Publication Number Publication Date
DE68914942D1 true DE68914942D1 (de) 1994-06-01
DE68914942T2 DE68914942T2 (de) 1994-12-01

Family

ID=17604603

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989614942 Expired - Fee Related DE68914942T2 (de) 1988-11-04 1989-11-02 Poly(arylensulfid)-Harzzusammensetzung.

Country Status (4)

Country Link
EP (1) EP0369244B1 (de)
JP (1) JPH02124976A (de)
CA (1) CA2001207A1 (de)
DE (1) DE68914942T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3237757B2 (ja) * 1989-12-28 2001-12-10 呉羽化学工業株式会社 電子部品封止用樹脂組成物および封止電子部品
US5288798A (en) * 1990-08-22 1994-02-22 Mitsubishi Rayon Co., Ltd. Polyarylene sulfide resin compositions
JP3114732B2 (ja) * 1990-10-11 2000-12-04 三菱レイヨン株式会社 ポリアリーレンサルファイド樹脂組成物
US5288817A (en) * 1990-10-11 1994-02-22 Mitsubishi Rayon Co., Ltd. Polyarylene sulfide resin compositions
US5652287A (en) * 1992-06-15 1997-07-29 Hoechst Celanese Corporation Ductile poly(arylene sulfide) resin compositions
TW269705B (de) * 1992-06-15 1996-02-01 Hoechst Celanese Corp
GB9814212D0 (en) * 1998-07-01 1998-09-02 Dow Corning Gmbh Polymer composition
US20130269977A1 (en) * 2012-04-13 2013-10-17 Ticona Llc Polyarylene Sulfide Composition Including a Functionalized Siloxane Polymer and a Non-Aromatic Impact Modifier
US20130273281A1 (en) * 2012-04-13 2013-10-17 Ticona Llc Polyarylene Sulfide Composition Including a Silane Coupling Agent and a Silicone Elastomer
TW201731960A (zh) * 2015-12-11 2017-09-16 堤康那責任有限公司 聚芳硫化物組合物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4581411A (en) * 1983-11-17 1986-04-08 Phillips Petroleum Company Rubbery compounds as modifiers for poly(arylene sulfide)
JPS6291560A (ja) * 1985-10-18 1987-04-27 Asahi Glass Co Ltd 潤滑性樹脂組成物
JPH075836B2 (ja) * 1986-02-24 1995-01-25 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
US4743639A (en) * 1986-06-18 1988-05-10 Phillips Petroleum Company Arylene sulfide polymers of improved impact strength
JPH0621169B2 (ja) * 1987-04-06 1994-03-23 ポリプラスチックス株式会社 改良されたポリフエニレンサルフアイド樹脂の製造方法

Also Published As

Publication number Publication date
DE68914942T2 (de) 1994-12-01
EP0369244B1 (de) 1994-04-27
JPH02124976A (ja) 1990-05-14
EP0369244A2 (de) 1990-05-23
CA2001207A1 (en) 1990-05-04
EP0369244A3 (en) 1990-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee