DE68907796D1 - Anlage zur beschichtung von halbleiterscheiben. - Google Patents

Anlage zur beschichtung von halbleiterscheiben.

Info

Publication number
DE68907796D1
DE68907796D1 DE8989109238T DE68907796T DE68907796D1 DE 68907796 D1 DE68907796 D1 DE 68907796D1 DE 8989109238 T DE8989109238 T DE 8989109238T DE 68907796 T DE68907796 T DE 68907796T DE 68907796 D1 DE68907796 D1 DE 68907796D1
Authority
DE
Germany
Prior art keywords
coating
semiconductor disc
disc
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989109238T
Other languages
English (en)
Other versions
DE68907796T2 (de
Inventor
John G Merullo
Gary B Tepolt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPX Corp
Original Assignee
General Signal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Signal Corp filed Critical General Signal Corp
Publication of DE68907796D1 publication Critical patent/DE68907796D1/de
Application granted granted Critical
Publication of DE68907796T2 publication Critical patent/DE68907796T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1023—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to velocity of target, e.g. to web advancement rate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE89109238T 1988-05-24 1989-05-23 Anlage zur Beschichtung von Halbleiterscheiben. Expired - Fee Related DE68907796T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/198,080 US4850299A (en) 1988-05-24 1988-05-24 Semiconductor wafer coating apparatus with angular oscillation means

Publications (2)

Publication Number Publication Date
DE68907796D1 true DE68907796D1 (de) 1993-09-02
DE68907796T2 DE68907796T2 (de) 1994-01-27

Family

ID=22731914

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89109238T Expired - Fee Related DE68907796T2 (de) 1988-05-24 1989-05-23 Anlage zur Beschichtung von Halbleiterscheiben.

Country Status (3)

Country Link
US (1) US4850299A (de)
EP (1) EP0343589B1 (de)
DE (1) DE68907796T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3276449B2 (ja) * 1993-05-13 2002-04-22 富士通株式会社 回転塗布方法
KR100307852B1 (ko) * 1993-11-12 2001-12-01 제리 에스터슨 평탄한기판의박막코팅방법및장치
US5912049A (en) 1997-08-12 1999-06-15 Micron Technology, Inc. Process liquid dispense method and apparatus
US7074726B2 (en) * 2002-01-31 2006-07-11 Dainippon Screen Mfg. Co., Ltd. Substrate treating method and substrate treating apparatus
FR3097142B1 (fr) * 2019-06-11 2022-05-27 Commissariat Energie Atomique Procédé de dépôt

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2950990A (en) * 1957-04-08 1960-08-30 Ibm Method for applying a uniform coating to a cylindrical body
JPS6053675B2 (ja) * 1978-09-20 1985-11-27 富士写真フイルム株式会社 スピンコ−テイング方法
JPS5727439A (en) * 1980-07-23 1982-02-13 Yoshiro Nakamatsu Spin coating system with speed variation
JPS5959265A (ja) * 1982-09-28 1984-04-05 Fujitsu Ltd スピンコ−テイング法

Also Published As

Publication number Publication date
EP0343589A1 (de) 1989-11-29
EP0343589B1 (de) 1993-07-28
DE68907796T2 (de) 1994-01-27
US4850299A (en) 1989-07-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee