DE6805874U - Gehaeuse eines halbleiterbauelements. - Google Patents

Gehaeuse eines halbleiterbauelements.

Info

Publication number
DE6805874U
DE6805874U DE6805874U DE6805874U DE6805874U DE 6805874 U DE6805874 U DE 6805874U DE 6805874 U DE6805874 U DE 6805874U DE 6805874 U DE6805874 U DE 6805874U DE 6805874 U DE6805874 U DE 6805874U
Authority
DE
Germany
Prior art keywords
housing
electrodes
deformable
tubular extension
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE6805874U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Praha DIZ AS
Original Assignee
CKD Praha DIZ AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Praha DIZ AS filed Critical CKD Praha DIZ AS
Publication of DE6805874U publication Critical patent/DE6805874U/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
DE6805874U 1967-11-09 1968-11-07 Gehaeuse eines halbleiterbauelements. Expired DE6805874U (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CS795067 1967-11-09
CS856967 1967-12-04
CS364968 1968-05-18

Publications (1)

Publication Number Publication Date
DE6805874U true DE6805874U (de) 1971-05-19

Family

ID=27179429

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19681807631 Pending DE1807631A1 (de) 1967-11-09 1968-11-07 Halbleiterbauelement
DE6805874U Expired DE6805874U (de) 1967-11-09 1968-11-07 Gehaeuse eines halbleiterbauelements.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19681807631 Pending DE1807631A1 (de) 1967-11-09 1968-11-07 Halbleiterbauelement

Country Status (6)

Country Link
US (1) US3553538A (en:Method)
CH (1) CH494471A (en:Method)
DE (2) DE1807631A1 (en:Method)
FR (1) FR1591379A (en:Method)
GB (1) GB1217963A (en:Method)
NL (1) NL6815953A (en:Method)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2118356A1 (de) * 1971-04-15 1972-10-26 Siemens AG, 1000 Berlin u. 8000 München Scheibenförmiges Halbleiterbauelement
DE2332896B2 (de) * 1973-06-28 1978-12-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung mit einem scheibenförmigen Gehäuse für ein Dioden- oder Thyristorelement
DE3421672A1 (de) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Wechsellastbestaendiges, schaltbares halbleiterbauelement

Also Published As

Publication number Publication date
DE1807631A1 (de) 1969-09-18
FR1591379A (en:Method) 1970-06-05
US3553538A (en) 1971-01-05
CH494471A (de) 1970-07-31
NL6815953A (en:Method) 1969-05-13
GB1217963A (en) 1971-01-06

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