DE60227015D1 - Method and device for diving lapping - Google Patents

Method and device for diving lapping

Info

Publication number
DE60227015D1
DE60227015D1 DE60227015T DE60227015T DE60227015D1 DE 60227015 D1 DE60227015 D1 DE 60227015D1 DE 60227015 T DE60227015 T DE 60227015T DE 60227015 T DE60227015 T DE 60227015T DE 60227015 D1 DE60227015 D1 DE 60227015D1
Authority
DE
Germany
Prior art keywords
solder
leads
circuit board
plate
diving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60227015T
Other languages
German (de)
Inventor
Michael Tombs
Charles Kent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pillarhouse International Ltd
Original Assignee
Pillarhouse International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pillarhouse International Ltd filed Critical Pillarhouse International Ltd
Application granted granted Critical
Publication of DE60227015D1 publication Critical patent/DE60227015D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Abstract

In a dip soldering process, solder 4 is pumped through a nozzle outlet 14. Leads 26 of a component 22 on a circuit board 16 are dipped into the surface 15 of the flowing solder to solder the leads 26 to a track on the underside 28 of the circuit board 16. To prevent solder bridging between the leads 26, a plate 30 is provided below the solder surface 15, and passes between the leads 26. When withdrawing the leads 26 from the solder, the solder surface 15 is dropped to the level of the plate 30, so that excess solder is drawn away from the leads, preventing solder bridging between the leads 26. Member 30 may be movable to rise through the solder surface 15 as the circuit board 16 is raised away from the surface. <IMAGE>
DE60227015T 2001-01-10 2002-01-10 Method and device for diving lapping Expired - Fee Related DE60227015D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0100626A GB2371006B (en) 2001-01-10 2001-01-10 Nozzle for soldering apparatus

Publications (1)

Publication Number Publication Date
DE60227015D1 true DE60227015D1 (en) 2008-07-24

Family

ID=9906572

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60227015T Expired - Fee Related DE60227015D1 (en) 2001-01-10 2002-01-10 Method and device for diving lapping
DE20200554U Expired - Lifetime DE20200554U1 (en) 2001-01-10 2002-01-10 Nozzle for a soldering device

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE20200554U Expired - Lifetime DE20200554U1 (en) 2001-01-10 2002-01-10 Nozzle for a soldering device

Country Status (5)

Country Link
US (1) US7650851B2 (en)
EP (1) EP1222988B1 (en)
AT (1) ATE397992T1 (en)
DE (2) DE60227015D1 (en)
GB (1) GB2371006B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050069668A1 (en) * 2003-09-30 2005-03-31 Daodang Hung Q. Disk lubricant tank insert to suppress lubricant surface waves
US7358856B2 (en) * 2004-03-18 2008-04-15 Savi Technology, Inc. Two-phase commit synchronizing seal state
JP4370225B2 (en) * 2004-08-19 2009-11-25 住友電装株式会社 Terminal mounting method on printed circuit board, terminal mounting printed circuit board formed by the method, and electrical junction box containing the terminal mounting printed circuit board
JP5884058B2 (en) * 2010-02-26 2016-03-15 パナソニックＩｐマネジメント株式会社 Soldering device
DE102013110731B3 (en) * 2013-09-27 2014-11-06 Ersa Gmbh Separator strip arrangement for soldering nozzle, and soldering nozzle device for selective wave soldering
DE102018105388A1 (en) * 2018-03-08 2019-09-12 Ersa Gmbh Soldering nozzle and soldering machine
US20190337075A1 (en) * 2018-05-01 2019-11-07 Artos Engineering Company Systems and devices for improved solder dispensing
JP7340388B2 (en) * 2019-08-21 2023-09-07 株式会社デンソーテン soldering equipment

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2770875A (en) * 1952-06-09 1956-11-20 Motorola Inc Soldering machine
US3056370A (en) * 1955-10-14 1962-10-02 Fry S Metal Foundries Ltd Apparatus for soldering
US3196829A (en) * 1963-02-21 1965-07-27 Fry S Metal Foundries Ltd Soldering machines
US3151592A (en) * 1963-05-20 1964-10-06 Howard W Wegener Sump and nozzle for soldering machines
US3303983A (en) * 1964-11-12 1967-02-14 Gen Dynamics Corp Ultrasonic soldering apparatus
US3565319A (en) * 1967-05-15 1971-02-23 Banner Ind Inc Apparatus for application of solder to circuit boards
US4527731A (en) * 1983-03-31 1985-07-09 At&T Technologies, Inc. Method and apparatus for applying stripes of solder to articles
US4545520A (en) * 1983-08-30 1985-10-08 At&T Technologies, Inc. Method and system for soldering insulation coated parts
EP0147000A1 (en) 1983-12-15 1985-07-03 Hollis Automation Inc. Mass wave soldering system I
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering
US4739919A (en) * 1987-06-15 1988-04-26 Northern Telecom Limited Masking of circuit boards for wave soldering
US4981249A (en) * 1988-08-31 1991-01-01 Matsushita Electric Industrial Co., Ltd. Automatic jet soldering apparatus
US5203489A (en) * 1991-12-06 1993-04-20 Electrovert Ltd. Gas shrouded wave soldering
US5227589A (en) * 1991-12-23 1993-07-13 Motorola, Inc. Plated-through interconnect solder thief
US5611480A (en) * 1992-03-03 1997-03-18 Pillarhouse International Limited Soldering process
US5679927A (en) * 1993-05-13 1997-10-21 Communications Technology Corporation Buried service wire closure
US5604333A (en) * 1994-11-30 1997-02-18 Intel Corporation Process and structure for a solder thief on circuit boards
DE19506874C1 (en) 1995-02-16 1996-04-25 Ersa Loettechnik Gmbh Wave soldering nozzle for soldering sub-assemblies
US5679929A (en) * 1995-07-28 1997-10-21 Solectron Corporqtion Anti-bridging pads for printed circuit boards and interconnecting substrates
JPH09107181A (en) 1995-08-07 1997-04-22 Nippon Superia Shiya:Kk Jet soldering device
JPH09323165A (en) 1996-06-04 1997-12-16 Sharp Corp Spouting solder vessel nozzle
JPH1070360A (en) * 1996-08-28 1998-03-10 Toshiba Corp Soldering device
GB9703790D0 (en) * 1997-02-24 1997-04-16 Pillarhouse Int Ltd Soldering apparatus
GB2360237B (en) * 2000-03-16 2003-09-03 Evenoak Ltd Nozzle for soldering apparatus

Also Published As

Publication number Publication date
DE20200554U1 (en) 2002-05-29
EP1222988A2 (en) 2002-07-17
GB2371006B (en) 2005-05-04
GB2371006A (en) 2002-07-17
GB0100626D0 (en) 2001-02-21
ATE397992T1 (en) 2008-07-15
EP1222988A3 (en) 2003-02-12
EP1222988B1 (en) 2008-06-11
US7650851B2 (en) 2010-01-26
US20020110636A1 (en) 2002-08-15

Similar Documents

Publication Publication Date Title
ATE7868T1 (en) DEVICE FOR DESOLDERING ELECTRONIC COMPONENTS FROM CIRCUIT BOARDS.
US4401253A (en) Mass soldering system
ATE100735T1 (en) DEVICE AND METHOD FOR COATING CIRCUIT BOARDS.
ATE209995T1 (en) ROSIN FREE, LOW VOC, SELF CLEANING FLUX AND USE
DE60227015D1 (en) Method and device for diving lapping
DE69000361D1 (en) DEVICE AND METHOD FOR SPRAYING A SINGLE SIDE OF A PRINTED CIRCUIT BOARD.
US20110139855A1 (en) Residual oxygen measurement and control in wave soldering process
MY126909A (en) Solder dross removal apparatus and method
DE50008673D1 (en) DEVICE FOR FITTING A SUBSTRATE WITH FLIP CHIPS
ATE242590T1 (en) METHOD FOR PRODUCING ETCHED CIRCUITS
EP1293283A3 (en) Method for local application of solder to preselected areas on a printed circuit board
DE3573974D1 (en) Device for soldering and desoldering surface-mounted components
WO2003075623A3 (en) Digital application of protective soldermask to printed circuit boards
DE69109253T2 (en) Method and device for leveling solder on printed circuit boards.
ATE341190T1 (en) METHOD AND DEVICE FOR PLACING FLAT SUBSTRATES INTO A RECEIVING CONTAINER
WO2002062515A3 (en) Automatic dross removal apparatus and method
JPS6473696A (en) Printed-circuit board
ATE111682T1 (en) METHOD AND ARRANGEMENT FOR SOLDERING SURFACE MOUNT DEVICES TO CIRCUIT BOARDS.
JPH072139Y2 (en) Spot soldering equipment
ATE199838T1 (en) METHOD FOR TREATING A LIQUID, IN PARTICULAR FOR SEPARATING DIFFERENT COMPONENTS CONTAINED IN THE LIQUID AND DEVICE THEREFOR
JPS57165169A (en) Soldering method for electrical parts
SU778966A1 (en) Apparatus for tinning printed-circuit boards
SU1558589A1 (en) Arrangement for soldering microcircuits in printed boards
JPS62144873A (en) Method and device for soldering
JPH0248137Y2 (en)

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee