DE60219722D1 - Tintenstrahlladungselektrode mit einer integrierten, flexiblen Kabelverbindungsstruktur - Google Patents

Tintenstrahlladungselektrode mit einer integrierten, flexiblen Kabelverbindungsstruktur

Info

Publication number
DE60219722D1
DE60219722D1 DE60219722T DE60219722T DE60219722D1 DE 60219722 D1 DE60219722 D1 DE 60219722D1 DE 60219722 T DE60219722 T DE 60219722T DE 60219722 T DE60219722 T DE 60219722T DE 60219722 D1 DE60219722 D1 DE 60219722D1
Authority
DE
Germany
Prior art keywords
integrated
ink jet
connection structure
flexible cable
cable connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60219722T
Other languages
English (en)
Other versions
DE60219722T2 (de
Inventor
Surinder Bahl
James E Harrison Jr
Richard W Sexton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Application granted granted Critical
Publication of DE60219722D1 publication Critical patent/DE60219722D1/de
Publication of DE60219722T2 publication Critical patent/DE60219722T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/07—Ink jet characterised by jet control
    • B41J2/075—Ink jet characterised by jet control for many-valued deflection
    • B41J2/08—Ink jet characterised by jet control for many-valued deflection charge-control type
    • B41J2/085—Charge means, e.g. electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
DE60219722T 2001-06-27 2002-06-26 Tintenstrahlladungsplatte mit integrierter flexibler Anschlussverbinderstruktur Expired - Lifetime DE60219722T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US894374 2001-06-27
US09/894,374 US6543885B2 (en) 2001-06-27 2001-06-27 Ink jet charge plate with integrated flexible lead connector structure

Publications (2)

Publication Number Publication Date
DE60219722D1 true DE60219722D1 (de) 2007-06-06
DE60219722T2 DE60219722T2 (de) 2008-01-17

Family

ID=25402984

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60219722T Expired - Lifetime DE60219722T2 (de) 2001-06-27 2002-06-26 Tintenstrahlladungsplatte mit integrierter flexibler Anschlussverbinderstruktur

Country Status (3)

Country Link
US (1) US6543885B2 (de)
EP (1) EP1275503B1 (de)
DE (1) DE60219722T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6767817B2 (en) * 2002-07-11 2004-07-27 Micron Technology, Inc. Asymmetric plating
US7156488B2 (en) * 2004-05-05 2007-01-02 Eastman Kodak Company Ink repellent coating on charge device to improve printer runability and printhead life
US20060082620A1 (en) * 2004-10-15 2006-04-20 Eastman Kodak Company Charge plate fabrication technique
US7204020B2 (en) * 2004-10-15 2007-04-17 Eastman Kodak Company Method for fabricating a charge plate for an inkjet printhead
US7805978B2 (en) * 2006-10-24 2010-10-05 Zevex, Inc. Method for making and using an air bubble detector
US7987722B2 (en) * 2007-08-24 2011-08-02 Zevex, Inc. Ultrasonic air and fluid detector
WO2009073859A1 (en) * 2007-12-07 2009-06-11 Zevex, Inc. Method of inducing transverse motion in langevin type transducers using split electroding of ceramic elements
WO2010091314A2 (en) * 2009-02-06 2010-08-12 Zevex, Inc. Air bubble detector
US8579414B2 (en) * 2009-12-23 2013-11-12 Xerox Corporation Self-assembling structures for electrostatic extraction of pigments from liquid inks for marking
US8486020B2 (en) 2010-08-11 2013-07-16 Zevex, Inc. Pressure sensor and method of use
JP2013538652A (ja) 2010-10-01 2013-10-17 ゼヴェクス・インコーポレーテッド 圧力センサーシールおよび使用方法
US9004886B2 (en) 2010-10-01 2015-04-14 Zevex, Inc. Pressure monitoring system for infusion pumps

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560991A (en) * 1983-07-27 1985-12-24 Eastman Kodak Company Electroformed charge electrode structure for ink jet printers
US5459500A (en) * 1992-03-25 1995-10-17 Scitex Digital Printing, Inc. Charge plate connectors and method of making
US5512117A (en) 1992-05-29 1996-04-30 Scitex Digital Printing, Inc. Charge plate fabrication process
GB9404741D0 (en) * 1994-03-10 1994-04-27 Domino Printing Sciences Plc Electrode assembly for a continuous ink jet printer
JP3543433B2 (ja) * 1995-02-15 2004-07-14 ブラザー工業株式会社 接点電極接続装置
US6274057B1 (en) * 1999-02-17 2001-08-14 Scitex Digital Printing, Inc. Method for etch formation of electrical contact posts on a charge plate used for ink jet printing
US6230402B1 (en) * 1999-02-17 2001-05-15 Scitex Digital Printing, Inc. Electrical contact termination for a flexible circuit

Also Published As

Publication number Publication date
DE60219722T2 (de) 2008-01-17
EP1275503A2 (de) 2003-01-15
EP1275503B1 (de) 2007-04-25
EP1275503A3 (de) 2003-09-10
US6543885B2 (en) 2003-04-08
US20030001932A1 (en) 2003-01-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition