DE60210980D1 - Verdrahtungsverfahren und gerät für eine ultraschallsonde - Google Patents

Verdrahtungsverfahren und gerät für eine ultraschallsonde

Info

Publication number
DE60210980D1
DE60210980D1 DE60210980T DE60210980T DE60210980D1 DE 60210980 D1 DE60210980 D1 DE 60210980D1 DE 60210980 T DE60210980 T DE 60210980T DE 60210980 T DE60210980 T DE 60210980T DE 60210980 D1 DE60210980 D1 DE 60210980D1
Authority
DE
Germany
Prior art keywords
lands
circuit board
wiring method
ultrasonic sound
flex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60210980T
Other languages
English (en)
Other versions
DE60210980T2 (de
Inventor
G Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE60210980D1 publication Critical patent/DE60210980D1/de
Publication of DE60210980T2 publication Critical patent/DE60210980T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/4461—Features of the scanning mechanism, e.g. for moving the transducer within the housing of the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Gynecology & Obstetrics (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Insulated Conductors (AREA)
DE60210980T 2001-07-31 2002-07-26 Verdrahtungsverfahren und gerät für eine ultraschallsonde Expired - Fee Related DE60210980T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US919238 1986-10-14
US09/919,238 US6582371B2 (en) 2001-07-31 2001-07-31 Ultrasound probe wiring method and apparatus
PCT/IB2002/003166 WO2003011141A1 (en) 2001-07-31 2002-07-26 Ultrasound probe wiring method and apparatus

Publications (2)

Publication Number Publication Date
DE60210980D1 true DE60210980D1 (de) 2006-06-01
DE60210980T2 DE60210980T2 (de) 2006-12-21

Family

ID=25441759

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60210980T Expired - Fee Related DE60210980T2 (de) 2001-07-31 2002-07-26 Verdrahtungsverfahren und gerät für eine ultraschallsonde

Country Status (6)

Country Link
US (3) US6582371B2 (de)
EP (1) EP1414350B1 (de)
JP (1) JP4429012B2 (de)
AT (1) ATE324069T1 (de)
DE (1) DE60210980T2 (de)
WO (1) WO2003011141A1 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2365127A (en) * 2000-07-20 2002-02-13 Jomed Imaging Ltd Catheter
US20020133077A1 (en) * 2001-03-14 2002-09-19 Edwardsen Stephen Dodge Transesophageal ultrasound probe having a rotating endoscope shaft
US7698909B2 (en) 2002-10-01 2010-04-20 Nellcor Puritan Bennett Llc Headband with tension indicator
CA2500651C (en) 2002-10-01 2011-07-12 Nellcor Puritan Bennett Incorporated Headband with tension indicator
CN100568021C (zh) * 2003-06-04 2009-12-09 皇家飞利浦电子股份有限公司 提高变换器可靠性的冗余引线接合
EP1634100A1 (de) 2003-06-05 2006-03-15 Koninklijke Philips Electronics N.V. Redundante kabelverbindungen zur erhöhung der wandlerverlässlichkeit
US7047056B2 (en) * 2003-06-25 2006-05-16 Nellcor Puritan Bennett Incorporated Hat-based oximeter sensor
US8412297B2 (en) 2003-10-01 2013-04-02 Covidien Lp Forehead sensor placement
US20050085731A1 (en) * 2003-10-21 2005-04-21 Miller David G. Ultrasound transducer finger probe
US20050113698A1 (en) * 2003-11-21 2005-05-26 Kjell Kristoffersen Ultrasound probe transceiver circuitry
US7527592B2 (en) * 2003-11-21 2009-05-05 General Electric Company Ultrasound probe sub-aperture processing
US7527591B2 (en) * 2003-11-21 2009-05-05 General Electric Company Ultrasound probe distributed beamformer
CA2545846C (en) * 2003-11-26 2014-09-23 Prisma Medical Technologies Llc Transesophageal ultrasound using a narrow probe
US7491172B2 (en) * 2004-01-13 2009-02-17 General Electric Company Connection apparatus and method for controlling an ultrasound probe
JP4575108B2 (ja) * 2004-10-15 2010-11-04 株式会社東芝 超音波プローブ
US20070016056A1 (en) * 2005-07-15 2007-01-18 Scott Kerwin Methods and systems for providing control components in an ultrasound system
US8764664B2 (en) 2005-11-28 2014-07-01 Vizyontech Imaging, Inc. Methods and apparatus for conformable medical data acquisition pad and configurable imaging system
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
WO2007112269A1 (en) * 2006-03-23 2007-10-04 Imacor, Llc Transesophageal ultrasound probe with thin and flexible wiring
JP4980653B2 (ja) * 2006-06-12 2012-07-18 オリンパスメディカルシステムズ株式会社 超音波探触子および超音波探触子を有する超音波内視鏡
US20080130415A1 (en) * 2006-11-07 2008-06-05 General Electric Company Compound flexible circuit and method for electrically connecting a transducer array
US8257274B2 (en) 2008-09-25 2012-09-04 Nellcor Puritan Bennett Llc Medical sensor and technique for using the same
US8364220B2 (en) 2008-09-25 2013-01-29 Covidien Lp Medical sensor and technique for using the same
US8556850B2 (en) 2008-12-31 2013-10-15 St. Jude Medical, Atrial Fibrillation Division, Inc. Shaft and handle for a catheter with independently-deflectable segments
US8676290B2 (en) 2010-05-11 2014-03-18 St. Jude Medical, Atrial Fibrillation Division, Inc. Multi-directional catheter control handle
US8515515B2 (en) 2009-03-25 2013-08-20 Covidien Lp Medical sensor with compressible light barrier and technique for using the same
US8781548B2 (en) 2009-03-31 2014-07-15 Covidien Lp Medical sensor with flexible components and technique for using the same
US9289154B2 (en) * 2009-08-19 2016-03-22 Insightec Ltd. Techniques for temperature measurement and corrections in long-term magnetic resonance thermometry
US9289147B2 (en) 2010-05-11 2016-03-22 St. Jude Medical, Atrial Fibrillation Division, Inc. Multi-directional flexible wire harness for medical devices
JP5511627B2 (ja) * 2010-10-28 2014-06-04 日立アロカメディカル株式会社 脊椎手術支援用超音波プローブ及びその製造方法
JP5826478B2 (ja) * 2010-10-28 2015-12-02 日立アロカメディカル株式会社 組織挿入型超音波プローブ
USD726905S1 (en) 2011-05-11 2015-04-14 St. Jude Medical, Atrial Fibrillation Division, Inc. Control handle for a medical device
US8711570B2 (en) 2011-06-21 2014-04-29 Apple Inc. Flexible circuit routing
US9017262B2 (en) * 2012-01-02 2015-04-28 General Electric Company Systems and methods for connection to a transducer in ultrasound probes
JP2014057136A (ja) * 2012-09-11 2014-03-27 Hitachi Aloka Medical Ltd 超音波探触子
WO2014123556A1 (en) * 2013-02-05 2014-08-14 Sound Technology Inc. Ultrasound device
WO2016198989A1 (en) 2015-06-11 2016-12-15 Koninklijke Philips N.V. Ultrasonic transducer array probe for shear wave imaging
WO2017002007A1 (en) 2015-06-29 2017-01-05 Koninklijke Philips N.V. Ultrasound system with asymmetric transmit signals
EP3369383A1 (de) * 2017-03-02 2018-09-05 Koninklijke Philips N.V. Ultraschallvorrichtung
JP6791799B2 (ja) * 2017-04-03 2020-11-25 オリンパス株式会社 超音波内視鏡

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3691628A (en) * 1969-10-31 1972-09-19 Gen Electric Method of fabricating composite integrated circuits
US3825999A (en) * 1972-12-26 1974-07-30 United Wiring And Mfg Co Inc Method of connecting electrical component
GB2123216B (en) * 1982-06-19 1985-12-18 Ferranti Plc Electrical circuit assemblies
US5207103A (en) * 1987-06-01 1993-05-04 Wise Kensall D Ultraminiature single-crystal sensor with movable member
US5044053A (en) * 1990-05-21 1991-09-03 Acoustic Imaging Technologies Corporation Method of manufacturing a curved array ultrasonic transducer assembly
US5085221A (en) * 1990-06-14 1992-02-04 Interspec, Inc. Ultrasonic imaging probe
NL9001755A (nl) 1990-08-02 1992-03-02 Optische Ind De Oude Delft Nv Endoscopische aftastinrichting.
EP0630056B1 (de) * 1993-05-28 1998-02-18 Toshiba Ave Co., Ltd Verwendung einer anisotropischen leitfähigen Schicht für die Verbindung von Anschlussleitern einer Leiterplatte mit den elektrischen Anschlusskontakten einer photoelektrischen Umwandlungsvorrichtung und Verfahren zur Montage dieser Vorrichtung
US5398689A (en) * 1993-06-16 1995-03-21 Hewlett-Packard Company Ultrasonic probe assembly and cable therefor
DE69516444T2 (de) 1994-03-11 2001-01-04 Intravascular Res Ltd Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung
JP3491415B2 (ja) * 1995-01-13 2004-01-26 セイコーエプソン株式会社 液晶表示装置の製造方法
JPH09139559A (ja) * 1995-11-13 1997-05-27 Minolta Co Ltd 回路基板の接続構造
US5857974A (en) * 1997-01-08 1999-01-12 Endosonics Corporation High resolution intravascular ultrasound transducer assembly having a flexible substrate
US6142930A (en) 1997-01-13 2000-11-07 Asahi Kogaku Kogyo Kabushiki Kaisha Electronic endoscope having compact construction
US5795299A (en) * 1997-01-31 1998-08-18 Acuson Corporation Ultrasonic transducer assembly with extended flexible circuits
US5947905A (en) * 1997-10-15 1999-09-07 Advanced Coronary Intervention, Inc. Ultrasound transducer array probe for intraluminal imaging catheter
US6784409B2 (en) * 2000-03-28 2004-08-31 Canon Kabushiki Kaisha Electronic device with encapsulant of photo-set resin and production process of same

Also Published As

Publication number Publication date
US7715204B2 (en) 2010-05-11
JP4429012B2 (ja) 2010-03-10
US20060036179A1 (en) 2006-02-16
EP1414350B1 (de) 2006-04-26
JP2005510263A (ja) 2005-04-21
US20030153834A1 (en) 2003-08-14
EP1414350A1 (de) 2004-05-06
US20030028105A1 (en) 2003-02-06
DE60210980T2 (de) 2006-12-21
US6582371B2 (en) 2003-06-24
ATE324069T1 (de) 2006-05-15
WO2003011141A1 (en) 2003-02-13
US6952870B2 (en) 2005-10-11

Similar Documents

Publication Publication Date Title
DE60210980D1 (de) Verdrahtungsverfahren und gerät für eine ultraschallsonde
DE60336738D1 (de) Schnittstellenhalbleiterschaltanordnung für eine usb verbindung
FI20050767A (fi) Monikerroksinen langoituslevy ja menetelmä sen valmistamiseksi
ATE531131T1 (de) Verfahren und vorrichtung zum verteilen mehrerer signaleingänge an mehrere integrierte schaltungen
DE60014062D1 (de) Flexibles mikrosystem und herstellungstechniken
ES2169687A1 (es) Unidad electronica de control con elemento de activacion y elemento detratamiento de control.
ATE321008T1 (de) Substrat für mikrobearbeitete ultraschallwandleranordnung, das die seitenübertragung von schallenergie begrenzt
DE50102275D1 (de) Verteilereinrichtung und kassettenelement einer datensignal-verarbeitungsanlage und datensignal-verarbeitungsanlage
ATE406082T1 (de) Schnittstelle für lampenbetriebsgeräte mit niedrigen standby-verlusten
ATE548890T1 (de) Leiterplattenentwurf
ATE551885T1 (de) Elektronisches gerät und verfahren zum untersuchen einer leiterplatte
TW200710810A (en) Signal transmission circuit, electro-optical device, and electronic apparatus
ATE361474T1 (de) Testen von elektronischen schaltungen
DE60203483D1 (de) Elektronische Schaltung für geschalteten Leistungsverstärker und Verfahren zum Schalten der Ausgangsstufe eines geschalteten Verstärkers
MY122960A (en) Method and apparatus for testing electronic devices
TW200617978A (en) Memory device and method for testing the same
ATE386419T1 (de) Leiterplattenanordnung
DE60238147D1 (de) Verfahren zur selbstanordnung elektronischer schaltkreise und damit hergestellte schaltungen
WO2001084883A3 (en) Planar speaker wiring layout
TW200603487A (en) Connecting design of a flexible circuit board
DE60141144D1 (de) Methode und vorrichtung zum messen von parametern eines elektronischen bauelementes
DE60105764D1 (de) Elektronischer chip für einen tragbaren gegenstand
DE50300222D1 (de) Modulreihung und Adaptermodul
TW200514226A (en) Input/output structure and integrated circuit using the same
TW200511913A (en) Electronic part mounting apparatus, electronic part mounting method and electronic circuit apparatus

Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee