DE60206121D1 - Federstruktur - Google Patents
FederstrukturInfo
- Publication number
- DE60206121D1 DE60206121D1 DE60206121T DE60206121T DE60206121D1 DE 60206121 D1 DE60206121 D1 DE 60206121D1 DE 60206121 T DE60206121 T DE 60206121T DE 60206121 T DE60206121 T DE 60206121T DE 60206121 D1 DE60206121 D1 DE 60206121D1
- Authority
- DE
- Germany
- Prior art keywords
- spring structure
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Wire Bonding (AREA)
- Magnetic Heads (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US976394 | 2001-10-12 | ||
US09/976,394 US6794737B2 (en) | 2001-10-12 | 2001-10-12 | Spring structure with stress-balancing layer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60206121D1 true DE60206121D1 (de) | 2005-10-20 |
DE60206121T2 DE60206121T2 (de) | 2006-05-04 |
Family
ID=25524048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60206121T Expired - Lifetime DE60206121T2 (de) | 2001-10-12 | 2002-10-02 | Federstruktur |
Country Status (4)
Country | Link |
---|---|
US (1) | US6794737B2 (de) |
EP (1) | EP1304768B1 (de) |
JP (1) | JP4427239B2 (de) |
DE (1) | DE60206121T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100470708B1 (ko) | 2003-05-22 | 2005-03-10 | 삼성전자주식회사 | 금속막의 내부응력을 이용한 박막 벌크 음향 공진기제조방법 및 그에 의한 공진기 |
FR2859201B1 (fr) * | 2003-08-29 | 2007-09-21 | Commissariat Energie Atomique | Dispositif micromecanique comportant un element suspendu rattache a un support par un pilier et procede de fabrication d'un tel dispositif |
US7410590B2 (en) * | 2003-12-19 | 2008-08-12 | Palo Alto Research Center Incorporated | Transferable micro spring structure |
WO2005104717A2 (en) * | 2004-04-23 | 2005-11-10 | Research Triangle Institute | Flexible electrostatic actuator |
US7262495B2 (en) * | 2004-10-07 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | 3D interconnect with protruding contacts |
US7550855B2 (en) * | 2005-12-02 | 2009-06-23 | Palo Alto Research Center Incorporated | Vertically spaced plural microsprings |
US20090140433A1 (en) * | 2007-11-30 | 2009-06-04 | Alces Technology, Inc. | MEMS chip-to-chip interconnects |
TWI404428B (zh) * | 2009-11-25 | 2013-08-01 | Ind Tech Res Inst | 聲學感測器 |
US8579414B2 (en) | 2009-12-23 | 2013-11-12 | Xerox Corporation | Self-assembling structures for electrostatic extraction of pigments from liquid inks for marking |
US8519534B2 (en) | 2010-09-22 | 2013-08-27 | Palo Alto Research Center Incorporated | Microsprings partially embedded in a laminate structure and methods for producing same |
US8441808B2 (en) | 2010-09-22 | 2013-05-14 | Palo Alto Research Center Incorporated | Interposer with microspring contacts |
CN102305256B (zh) * | 2011-09-06 | 2013-06-12 | 复旦大学 | 一种金属微米/纳米弹簧及其制备方法和应用 |
US8525353B2 (en) | 2011-12-19 | 2013-09-03 | Palo Alto Research Center Incorporated | Microspring structures adapted for target device cooling |
CN104555908A (zh) * | 2014-12-04 | 2015-04-29 | 复旦大学 | 一种微弹簧的加工方法 |
US11434130B2 (en) * | 2019-12-31 | 2022-09-06 | Texas Instruments Incorporated | Surface micromachined structures |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3842189A (en) * | 1973-01-08 | 1974-10-15 | Rca Corp | Contact array and method of making the same |
US5613861A (en) * | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
US6236491B1 (en) * | 1999-05-27 | 2001-05-22 | Mcnc | Micromachined electrostatic actuator with air gap |
US6290510B1 (en) * | 2000-07-27 | 2001-09-18 | Xerox Corporation | Spring structure with self-aligned release material |
US6528250B1 (en) * | 2000-09-09 | 2003-03-04 | Akzo Nobel N.V. | Equine infectious anemia challenge model for testing vaccines, diagnostics and treatments |
US6560861B2 (en) * | 2001-07-11 | 2003-05-13 | Xerox Corporation | Microspring with conductive coating deposited on tip after release |
-
2001
- 2001-10-12 US US09/976,394 patent/US6794737B2/en not_active Expired - Lifetime
-
2002
- 2002-10-02 EP EP02256864A patent/EP1304768B1/de not_active Expired - Lifetime
- 2002-10-02 DE DE60206121T patent/DE60206121T2/de not_active Expired - Lifetime
- 2002-10-08 JP JP2002294382A patent/JP4427239B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1304768A3 (de) | 2004-02-04 |
US6794737B2 (en) | 2004-09-21 |
JP2003218292A (ja) | 2003-07-31 |
EP1304768B1 (de) | 2005-09-14 |
JP4427239B2 (ja) | 2010-03-03 |
DE60206121T2 (de) | 2006-05-04 |
US20030071330A1 (en) | 2003-04-17 |
EP1304768A2 (de) | 2003-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |