DE60201558D1 - Widerstandsmaterial - Google Patents

Widerstandsmaterial

Info

Publication number
DE60201558D1
DE60201558D1 DE2002601558 DE60201558T DE60201558D1 DE 60201558 D1 DE60201558 D1 DE 60201558D1 DE 2002601558 DE2002601558 DE 2002601558 DE 60201558 T DE60201558 T DE 60201558T DE 60201558 D1 DE60201558 D1 DE 60201558D1
Authority
DE
Germany
Prior art keywords
resistance material
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE2002601558
Other languages
English (en)
Other versions
DE60201558T2 (de
Inventor
Craig S Allen
John Schemenaur
David D Senk
Marc Langlois
Xiaodong Hu
Jan Tzyy-Jiuan Hwang
Jud Ready
Trifon Tomav
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Application granted granted Critical
Publication of DE60201558D1 publication Critical patent/DE60201558D1/de
Publication of DE60201558T2 publication Critical patent/DE60201558T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/08—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by vapour deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/06—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/261—In terms of molecular thickness or light wave length
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Vapour Deposition (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Catalysts (AREA)
DE2002601558 2001-07-06 2002-07-04 Widerstandsmaterial Expired - Fee Related DE60201558T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30337901P 2001-07-06 2001-07-06
US303379P 2001-07-06

Publications (2)

Publication Number Publication Date
DE60201558D1 true DE60201558D1 (de) 2004-11-18
DE60201558T2 DE60201558T2 (de) 2005-12-08

Family

ID=23171816

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2002601558 Expired - Fee Related DE60201558T2 (de) 2001-07-06 2002-07-04 Widerstandsmaterial

Country Status (7)

Country Link
US (2) US6846370B2 (de)
EP (1) EP1278215B1 (de)
JP (1) JP2003051401A (de)
KR (1) KR20030005033A (de)
CN (1) CN1257511C (de)
DE (1) DE60201558T2 (de)
TW (1) TW594803B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1261241A1 (de) * 2001-05-17 2002-11-27 Shipley Co. L.L.C. Widerstand und Leiterplatte, die den Widerstand in ihre Struktur einbettet
US7084724B2 (en) * 2002-12-31 2006-08-01 The Regents Of The University Of California MEMS fabrication on a laminated substrate
JP5867477B2 (ja) * 2013-10-11 2016-02-24 トヨタ自動車株式会社 自動変速機
CN104164585B (zh) * 2014-08-06 2016-08-24 贵研铂业股份有限公司 铂基高弹性合金及其制备方法
CN109837423A (zh) * 2017-11-28 2019-06-04 丹阳市延陵镇优越合金厂 一种电阻材料
CN114678158B (zh) * 2022-05-30 2022-08-16 西安宏星电子浆料科技股份有限公司 一种电阻浆料、电阻及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3630969A (en) * 1969-10-24 1971-12-28 Du Pont Resistor compositions containing pyrochlore-related oxides and platinum
US3629781A (en) * 1969-12-04 1971-12-21 Sprague Electric Co Cylindrically molded metal film resistor
US3833410A (en) * 1971-12-30 1974-09-03 Trw Inc High stability thin film alloy resistors
US5037670A (en) * 1989-11-01 1991-08-06 Cts Corporation Method of manufacturing a low sheet resistance article
JPH10189886A (ja) * 1996-12-26 1998-07-21 Sony Corp 誘電体キャパシタおよび強誘電体メモリ
US6562021B1 (en) * 1997-12-22 2003-05-13 Micrus Corporation Variable stiffness electrically conductive composite, resistive heating catheter shaft
US6210592B1 (en) * 1998-04-29 2001-04-03 Morton International, Inc. Deposition of resistor materials directly on insulating substrates
US6368665B1 (en) 1998-04-29 2002-04-09 Microcoating Technologies, Inc. Apparatus and process for controlled atmosphere chemical vapor deposition

Also Published As

Publication number Publication date
TW594803B (en) 2004-06-21
EP1278215A2 (de) 2003-01-22
DE60201558T2 (de) 2005-12-08
JP2003051401A (ja) 2003-02-21
EP1278215A3 (de) 2003-09-17
KR20030005033A (ko) 2003-01-15
CN1419245A (zh) 2003-05-21
CN1257511C (zh) 2006-05-24
US6994757B2 (en) 2006-02-07
EP1278215B1 (de) 2004-10-13
US6846370B2 (en) 2005-01-25
US20030121883A1 (en) 2003-07-03
US20040231757A1 (en) 2004-11-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8381 Inventor (new situation)

Inventor name: ALLEN, CRAIG S., SHREWSBURY, MASSACHUSETTS 015, US

Inventor name: SCHEMENAUR, JOHN, MARLBOROUGH, MASSACHUSETTS 0, US

Inventor name: SENK, DAVID D., MISSION VIEJO, CALIFORNIA 9269, US

Inventor name: LANGLOIS, MARC, ATLANTA, GEORGIA 30345, US

Inventor name: HU, XIADONG, KATY, TEX., US

Inventor name: HWANG, JAN TZYY-JIUAN, ALPHARETTA, GEORGIA 300, US

Inventor name: READY, JUD, ATLANTA, GEORGIA 30318, US

Inventor name: TOMAV, TRIFON, DULUTH, GEORGIA 30096, US

8339 Ceased/non-payment of the annual fee