DE602008001593D1 - Verfahren und Vorrichtung zur Trennung einer Struktur - Google Patents

Verfahren und Vorrichtung zur Trennung einer Struktur

Info

Publication number
DE602008001593D1
DE602008001593D1 DE602008001593T DE602008001593T DE602008001593D1 DE 602008001593 D1 DE602008001593 D1 DE 602008001593D1 DE 602008001593 T DE602008001593 T DE 602008001593T DE 602008001593 T DE602008001593 T DE 602008001593T DE 602008001593 D1 DE602008001593 D1 DE 602008001593D1
Authority
DE
Germany
Prior art keywords
separating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008001593T
Other languages
English (en)
Inventor
Marc Zussy
Cioccio Lea Di
Christophe Morales
Hubert Moriceau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602008001593D1 publication Critical patent/DE602008001593D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49822—Disassembling by applying force
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53274—Means to disassemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53683—Spreading parts apart or separating them from face to face engagement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/54—Miscellaneous apparatus
DE602008001593T 2007-12-28 2008-12-23 Verfahren und Vorrichtung zur Trennung einer Struktur Active DE602008001593D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0760437A FR2925978B1 (fr) 2007-12-28 2007-12-28 Procede et dispositif de separation d'une structure.

Publications (1)

Publication Number Publication Date
DE602008001593D1 true DE602008001593D1 (de) 2010-08-05

Family

ID=39672090

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008001593T Active DE602008001593D1 (de) 2007-12-28 2008-12-23 Verfahren und Vorrichtung zur Trennung einer Struktur

Country Status (5)

Country Link
US (1) US8302278B2 (de)
EP (1) EP2075105B8 (de)
JP (1) JP5280177B2 (de)
DE (1) DE602008001593D1 (de)
FR (1) FR2925978B1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8950459B2 (en) * 2009-04-16 2015-02-10 Suss Microtec Lithography Gmbh Debonding temporarily bonded semiconductor wafers
US8764026B2 (en) * 2009-04-16 2014-07-01 Suss Microtec Lithography, Gmbh Device for centering wafers
US9064686B2 (en) 2010-04-15 2015-06-23 Suss Microtec Lithography, Gmbh Method and apparatus for temporary bonding of ultra thin wafers
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
FR3001083A1 (fr) * 2013-01-17 2014-07-18 Soitec Silicon On Insulator Dispositif de separation de deux substrats
EP2824697A1 (de) 2013-07-10 2015-01-14 Mechatronic Systemtechnik GmbH Vorrichtung zum Entfernen eines ringförmigen Verstärkungsrands von einem geschliffenen Halbleiterwafer
KR102285804B1 (ko) * 2013-08-30 2021-08-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 적층의 가공 장치 및 가공 방법
JP6223795B2 (ja) * 2013-11-28 2017-11-01 日東電工株式会社 板の剥離方法
WO2016104122A1 (ja) * 2014-12-26 2016-06-30 旭硝子株式会社 積層体の剥離開始部作成方法、及び剥離開始部作成装置並びに電子デバイスの製造方法
JP6345611B2 (ja) * 2015-02-04 2018-06-20 東京エレクトロン株式会社 剥離装置、剥離システム、剥離方法、プログラム、および情報記憶媒体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2458977A1 (fr) * 1979-06-13 1981-01-02 Cii Honeywell Bull Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat
JPS5852770B2 (ja) * 1980-01-31 1983-11-25 大東精機株式会社 揺動型帯鋸盤
JPH09263500A (ja) * 1996-01-22 1997-10-07 Komatsu Electron Metals Co Ltd 貼り合わせｓｏｉウェーハの剥がし治具
US5938882A (en) * 1997-09-30 1999-08-17 Harris Corporation Method for removing microelectronic circuits from substrates and tool used in removal
JP2000150456A (ja) * 1998-11-06 2000-05-30 Canon Inc 試料の分離装置及び分離方法
JP2002075915A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
FR2823373B1 (fr) * 2001-04-10 2005-02-04 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe
FR2834381B1 (fr) * 2002-01-03 2004-02-27 Soitec Silicon On Insulator Dispositif de coupe de couche d'un substrat, et procede associe
JP4319859B2 (ja) * 2003-05-29 2009-08-26 リンテック株式会社 脆質部材の剥離方法
FR2906933B1 (fr) * 2006-10-06 2009-02-13 Commissariat Energie Atomique Dispositif de separation d'une structure empilee et procede associe

Also Published As

Publication number Publication date
JP2009173010A (ja) 2009-08-06
EP2075105B8 (de) 2010-07-28
US8302278B2 (en) 2012-11-06
EP2075105A1 (de) 2009-07-01
US20090165277A1 (en) 2009-07-02
JP5280177B2 (ja) 2013-09-04
FR2925978A1 (fr) 2009-07-03
FR2925978B1 (fr) 2010-01-29
EP2075105B1 (de) 2010-06-23

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERG, FR