DE602007013744D1 - Herstellung von Stempeln, Masken und Schablonen zur Herstellung von Halbleiterbauelementen - Google Patents

Herstellung von Stempeln, Masken und Schablonen zur Herstellung von Halbleiterbauelementen

Info

Publication number
DE602007013744D1
DE602007013744D1 DE602007013744T DE602007013744T DE602007013744D1 DE 602007013744 D1 DE602007013744 D1 DE 602007013744D1 DE 602007013744 T DE602007013744 T DE 602007013744T DE 602007013744 T DE602007013744 T DE 602007013744T DE 602007013744 D1 DE602007013744 D1 DE 602007013744D1
Authority
DE
Germany
Prior art keywords
production
substrate
layer
sensitive material
stamps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007013744T
Other languages
English (en)
Inventor
Jelm Franse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singulus Mastering BV
Original Assignee
Singulus Mastering BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singulus Mastering BV filed Critical Singulus Mastering BV
Publication of DE602007013744D1 publication Critical patent/DE602007013744D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0277Electrolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/263Preparing and using a stamper, e.g. pressing or injection molding substrates
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/004Recording, reproducing or erasing methods; Read, write or erase circuits therefor
    • G11B7/0045Recording
    • G11B7/00454Recording involving phase-change effects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Electron Beam Exposure (AREA)
DE602007013744T 2007-07-25 2007-07-25 Herstellung von Stempeln, Masken und Schablonen zur Herstellung von Halbleiterbauelementen Active DE602007013744D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07113132A EP2019333B1 (de) 2007-07-25 2007-07-25 Herstellung von Stempeln, Masken und Schablonen zur Herstellung von Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
DE602007013744D1 true DE602007013744D1 (de) 2011-05-19

Family

ID=38657636

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007013744T Active DE602007013744D1 (de) 2007-07-25 2007-07-25 Herstellung von Stempeln, Masken und Schablonen zur Herstellung von Halbleiterbauelementen

Country Status (7)

Country Link
US (1) US20100129735A1 (de)
EP (1) EP2019333B1 (de)
KR (1) KR20100057620A (de)
CN (1) CN101779164A (de)
AT (1) ATE504861T1 (de)
DE (1) DE602007013744D1 (de)
WO (1) WO2009013028A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103576440B (zh) * 2013-10-11 2017-01-25 西安神光安瑞光电科技有限公司 梅花型掩膜版以及利用梅花型掩膜版制造图形化衬底的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8802081A (nl) * 1988-08-23 1990-03-16 Nagron Precision Tooling Werkwijze voor het vervaardigen van een drager met optisch leesbare, digitale informatie.
JPH0495243A (ja) * 1990-08-08 1992-03-27 Matsushita Electric Ind Co Ltd 光ディスク原盤の作成装置
JP3465301B2 (ja) * 1993-06-28 2003-11-10 ソニー株式会社 光ディスク作成用原盤の作成方法
JPH07320305A (ja) * 1994-05-26 1995-12-08 Hitachi Ltd 光ディスクの製造方法
US6075650A (en) * 1998-04-06 2000-06-13 Rochester Photonics Corporation Beam shaping optics for diverging illumination, such as produced by laser diodes
TW478032B (en) * 1999-11-04 2002-03-01 Seiko Epson Corp Method and device for laser plotting, hologram master and the manufacturing method thereof
US6638692B1 (en) * 2001-07-16 2003-10-28 Imation Corp. Replicated regions on optical disks
EP1449206A2 (de) * 2001-11-16 2004-08-25 Koninklijke Philips Electronics N.V. Verfahren zur herstellung einer matrize, originalplatte, trägerstruktur, und verwendung einer solchen matrize
WO2006045332A1 (en) * 2004-10-27 2006-05-04 Singulus Mastering B.V. Mastering process with phase-change materials
US20060286355A1 (en) * 2005-06-15 2006-12-21 Imation Corp. Drive recordable master media
US20080257871A1 (en) * 2007-04-20 2008-10-23 Leiser Judson M Ablation device

Also Published As

Publication number Publication date
US20100129735A1 (en) 2010-05-27
EP2019333A1 (de) 2009-01-28
EP2019333B1 (de) 2011-04-06
CN101779164A (zh) 2010-07-14
WO2009013028A1 (en) 2009-01-29
ATE504861T1 (de) 2011-04-15
KR20100057620A (ko) 2010-05-31

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