DE602007011881D1 - Manufacturing method for an electronic device - Google Patents
Manufacturing method for an electronic deviceInfo
- Publication number
- DE602007011881D1 DE602007011881D1 DE602007011881T DE602007011881T DE602007011881D1 DE 602007011881 D1 DE602007011881 D1 DE 602007011881D1 DE 602007011881 T DE602007011881 T DE 602007011881T DE 602007011881 T DE602007011881 T DE 602007011881T DE 602007011881 D1 DE602007011881 D1 DE 602007011881D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- electronic device
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007009264A JP4860494B2 (en) | 2007-01-18 | 2007-01-18 | Manufacturing method of electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007011881D1 true DE602007011881D1 (en) | 2011-02-24 |
Family
ID=39322541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007011881T Active DE602007011881D1 (en) | 2007-01-18 | 2007-11-20 | Manufacturing method for an electronic device |
Country Status (7)
Country | Link |
---|---|
US (1) | US7605021B2 (en) |
EP (1) | EP1947917B1 (en) |
JP (1) | JP4860494B2 (en) |
KR (1) | KR100945771B1 (en) |
CN (1) | CN100584152C (en) |
DE (1) | DE602007011881D1 (en) |
TW (1) | TWI351243B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5029026B2 (en) * | 2007-01-18 | 2012-09-19 | 富士通株式会社 | Manufacturing method of electronic device |
CN102738055B (en) * | 2011-04-13 | 2015-07-01 | 颀中科技(苏州)有限公司 | Flip chip packaging system and raise clamp thereof |
WO2013172847A1 (en) * | 2012-05-17 | 2013-11-21 | Intel Corporation | Film insert molding for device manufacture |
JP6679244B2 (en) * | 2015-08-27 | 2020-04-15 | 富士通株式会社 | RFID tag |
CN111612118A (en) * | 2019-02-26 | 2020-09-01 | 法国圣-戈班玻璃公司 | Coated glazing with improved readability and method for manufacturing same |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5261155A (en) * | 1991-08-12 | 1993-11-16 | International Business Machines Corporation | Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders |
JP3030201B2 (en) * | 1994-04-26 | 2000-04-10 | 富士通株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
US6870272B2 (en) * | 1994-09-20 | 2005-03-22 | Tessera, Inc. | Methods of making microelectronic assemblies including compliant interfaces |
US6099678A (en) * | 1995-12-26 | 2000-08-08 | Hitachi Chemical Company Ltd. | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device |
JP3402232B2 (en) | 1998-12-25 | 2003-05-06 | 株式会社デンソー | IC card manufacturing method |
JP3447602B2 (en) * | 1999-02-05 | 2003-09-16 | シャープ株式会社 | Method for manufacturing semiconductor device |
JP2000357859A (en) * | 1999-06-14 | 2000-12-26 | Seiko Epson Corp | Equipment and method for conductive film sticking |
JP2001044239A (en) * | 1999-07-29 | 2001-02-16 | Matsushita Electric Ind Co Ltd | Method of mounting mixture of electronic component and member for use in mixture mounting process |
JP3451373B2 (en) | 1999-11-24 | 2003-09-29 | オムロン株式会社 | Manufacturing method of data carrier capable of reading electromagnetic wave |
JP4445624B2 (en) * | 1999-12-28 | 2010-04-07 | パナソニック株式会社 | Method of bonding IC chip to film-like circuit board and IC chip bonded body |
JP3659133B2 (en) * | 2000-06-23 | 2005-06-15 | セイコーエプソン株式会社 | Manufacturing method of semiconductor device |
JP2004221334A (en) * | 2003-01-15 | 2004-08-05 | Seiko Epson Corp | Method for forming metallic element, method for manufacturing semiconductor device and method for manufacturing electronic device, semiconductor device and electronic device, and electronic apparatus |
JP4010962B2 (en) * | 2003-02-20 | 2007-11-21 | 三井金属鉱業株式会社 | Apparatus and method for transporting film carrier tape for mounting electronic components |
JP2006049591A (en) * | 2004-08-05 | 2006-02-16 | Disco Abrasive Syst Ltd | Fracture method and fracture equipment of adhesive film stuck on wafer |
JP3992038B2 (en) * | 2004-11-16 | 2007-10-17 | セイコーエプソン株式会社 | Electronic element mounting method, electronic device manufacturing method, circuit board, electronic device |
-
2007
- 2007-01-18 JP JP2007009264A patent/JP4860494B2/en not_active Expired - Fee Related
- 2007-11-13 US US11/983,867 patent/US7605021B2/en not_active Expired - Fee Related
- 2007-11-13 TW TW096142820A patent/TWI351243B/en not_active IP Right Cessation
- 2007-11-20 DE DE602007011881T patent/DE602007011881D1/en active Active
- 2007-11-20 EP EP07121156A patent/EP1947917B1/en not_active Expired - Fee Related
- 2007-12-07 KR KR1020070126914A patent/KR100945771B1/en not_active IP Right Cessation
- 2007-12-07 CN CN200710195964A patent/CN100584152C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008177352A (en) | 2008-07-31 |
KR20080068530A (en) | 2008-07-23 |
CN101227797A (en) | 2008-07-23 |
US7605021B2 (en) | 2009-10-20 |
CN100584152C (en) | 2010-01-20 |
JP4860494B2 (en) | 2012-01-25 |
TW200833204A (en) | 2008-08-01 |
EP1947917A3 (en) | 2009-11-11 |
EP1947917B1 (en) | 2011-01-12 |
EP1947917A2 (en) | 2008-07-23 |
TWI351243B (en) | 2011-10-21 |
US20080176361A1 (en) | 2008-07-24 |
KR100945771B1 (en) | 2010-03-08 |
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