DE602007008712D1 - Sonde und verfahren zum prüfen - Google Patents

Sonde und verfahren zum prüfen

Info

Publication number
DE602007008712D1
DE602007008712D1 DE602007008712T DE602007008712T DE602007008712D1 DE 602007008712 D1 DE602007008712 D1 DE 602007008712D1 DE 602007008712 T DE602007008712 T DE 602007008712T DE 602007008712 T DE602007008712 T DE 602007008712T DE 602007008712 D1 DE602007008712 D1 DE 602007008712D1
Authority
DE
Germany
Prior art keywords
checking
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007008712T
Other languages
English (en)
Inventor
Robert A Nordstrom
William Q Law
Mark W Nightingale
Einar O Traa
Ira G Pollock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of DE602007008712D1 publication Critical patent/DE602007008712D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE602007008712T 2006-05-04 2007-05-03 Sonde und verfahren zum prüfen Active DE602007008712D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/418,994 US8067718B2 (en) 2006-05-04 2006-05-04 Method and apparatus for probing
PCT/US2007/068191 WO2007131141A2 (en) 2006-05-04 2007-05-03 Method and apparatus for probing

Publications (1)

Publication Number Publication Date
DE602007008712D1 true DE602007008712D1 (de) 2010-10-07

Family

ID=38606640

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007008712T Active DE602007008712D1 (de) 2006-05-04 2007-05-03 Sonde und verfahren zum prüfen

Country Status (6)

Country Link
US (1) US8067718B2 (de)
EP (1) EP2013633B1 (de)
JP (1) JP4866995B2 (de)
CN (1) CN101438177B (de)
DE (1) DE602007008712D1 (de)
WO (1) WO2007131141A2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1402434B1 (it) 2010-06-10 2013-09-04 St Microelectronics Srl Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati
US9817032B2 (en) * 2012-05-23 2017-11-14 Semiconductor Energy Laboratory Co., Ltd. Measurement device
CN103713308A (zh) * 2012-10-09 2014-04-09 苏州雷泰医疗科技有限公司 用于剂量探测验证的平板探测器及采用它的图像探测装置
US9335364B2 (en) * 2013-02-01 2016-05-10 Keithley Instruments, Inc. SMU RF transistor stability arrangement
US9279851B2 (en) 2013-05-02 2016-03-08 GlobalFoundries, Inc. Structures and methods for testing integrated circuits and via chains therein
US9268938B1 (en) 2015-05-22 2016-02-23 Power Fingerprinting Inc. Systems, methods, and apparatuses for intrusion detection and analytics using power characteristics such as side-channel information collection
US10859609B2 (en) 2016-07-06 2020-12-08 Power Fingerprinting Inc. Methods and apparatuses for characteristic management with side-channel signature analysis
CN108414869B (zh) * 2018-06-11 2023-09-29 南京尤尼泰信息科技有限公司 一种适用于多种规格晶振的测试系统
US10886588B2 (en) 2018-09-26 2021-01-05 Keysight Technologies, Inc. High dynamic range probe using pole-zero cancellation
CN113671340B (zh) * 2021-10-21 2022-02-22 佛山市联动科技股份有限公司 一种IGBT的Switch参数测试装置
US20240221924A1 (en) * 2022-12-30 2024-07-04 Cilag Gmbh International Detection of knock-off or counterfeit surgical devices

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872408A (en) * 1974-05-03 1975-03-18 Lindsay Specialty Prod Ltd Signal directional tap
US3934213A (en) * 1974-06-28 1976-01-20 International Business Machines Corporation Broad band directional coupling circuit
US4795989A (en) * 1988-02-11 1989-01-03 Honeywell, Inc. MMW microstrip coupler having movable test probe
US5058198A (en) * 1989-03-31 1991-10-15 Am Communications, Inc. Radio frequency tap unit which can be reconfigured with minimal disruption of service
JP3381283B2 (ja) * 1991-12-24 2003-02-24 株式会社デンソー 可変リアクタンス回路およびこれを用いた可変整合回路
US5425052A (en) * 1992-08-14 1995-06-13 Harris Corporation High impedance directional signal separator for extracting and separating respective signalling components of a wireline full-duplex digital data link
US5477159A (en) * 1992-10-30 1995-12-19 Hewlett-Packard Company Integrated circuit probe fixture with detachable high frequency probe carrier
US6066994A (en) * 1998-05-18 2000-05-23 Amplifier Research Corporation Broadband directional coupler including amplifying, sampling and combining circuits
US6337571B2 (en) * 1998-11-13 2002-01-08 Tektronix, Inc. Ultra-high-frequency current probe in surface-mount form factor
US6242933B1 (en) * 1999-10-04 2001-06-05 St Assembly Test Services Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing
JP2001116795A (ja) * 1999-10-18 2001-04-27 Mitsubishi Electric Corp テスト用ソケット、およびテスト用ソケットに用いる接続シート
CN1366798A (zh) * 2000-04-25 2002-08-28 松下电工株式会社 用作高频电路多层印刷电路板的具有内层电路的叠层体及测量该叠层体电路阻抗的方法和设备
US6624721B1 (en) * 2000-10-13 2003-09-23 Tektronix, Inc. Apparatus for acquiring a signal from an intermediate point on a series impedance source terminated unidirectional transmission line
US6552523B2 (en) * 2001-05-24 2003-04-22 Tektronix, Inc. Combination low capacitance probe tip and socket for a measurement probe
US6956448B1 (en) * 2002-12-17 2005-10-18 Itt Manufacturing Enterprises, Inc. Electromagnetic energy probe with integral impedance matching
US6894516B1 (en) * 2003-11-20 2005-05-17 International Business Machines Corporation Method and apparatus for implementing very high density probing (VHDP) of printed circuit board signals

Also Published As

Publication number Publication date
JP2009536357A (ja) 2009-10-08
CN101438177B (zh) 2012-05-23
WO2007131141A3 (en) 2007-12-27
WO2007131141A2 (en) 2007-11-15
JP4866995B2 (ja) 2012-02-01
US8067718B2 (en) 2011-11-29
CN101438177A (zh) 2009-05-20
EP2013633A2 (de) 2009-01-14
US20070257025A1 (en) 2007-11-08
EP2013633B1 (de) 2010-08-25

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