DE602007003385D1 - Beschichtungen und verfahren zur hemmung von zinnwhiskerwachstum - Google Patents

Beschichtungen und verfahren zur hemmung von zinnwhiskerwachstum

Info

Publication number
DE602007003385D1
DE602007003385D1 DE602007003385T DE602007003385T DE602007003385D1 DE 602007003385 D1 DE602007003385 D1 DE 602007003385D1 DE 602007003385 T DE602007003385 T DE 602007003385T DE 602007003385 T DE602007003385 T DE 602007003385T DE 602007003385 D1 DE602007003385 D1 DE 602007003385D1
Authority
DE
Germany
Prior art keywords
interested
coatings
inhibiting
wax growth
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007003385T
Other languages
English (en)
Inventor
Merrill M Jackson
David Humphrey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE602007003385D1 publication Critical patent/DE602007003385D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DE602007003385T 2006-08-18 2007-08-16 Beschichtungen und verfahren zur hemmung von zinnwhiskerwachstum Active DE602007003385D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/506,541 US20070284700A1 (en) 2006-06-07 2006-08-18 Coatings and methods for inhibiting tin whisker growth
PCT/US2007/076066 WO2008022236A1 (en) 2006-08-18 2007-08-16 Coatings and methods for inhibiting tin whisker growth

Publications (1)

Publication Number Publication Date
DE602007003385D1 true DE602007003385D1 (de) 2009-12-31

Family

ID=38692061

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007003385T Active DE602007003385D1 (de) 2006-08-18 2007-08-16 Beschichtungen und verfahren zur hemmung von zinnwhiskerwachstum

Country Status (4)

Country Link
US (1) US20070284700A1 (de)
EP (1) EP2051850B1 (de)
DE (1) DE602007003385D1 (de)
WO (1) WO2008022236A1 (de)

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US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
CN102365713B (zh) 2009-03-27 2015-11-25 应用纳米技术控股股份有限公司 增强光和/或激光烧结的缓冲层
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
US8551263B1 (en) * 2009-12-15 2013-10-08 Emc Corporation Method for reducing whisker growth
WO2014011578A1 (en) 2012-07-09 2014-01-16 Applied Nanotech Holdings, Inc. Photosintering of micron-sized copper particles
US8907225B1 (en) * 2013-04-11 2014-12-09 The United States Of America As Represented By The Secretary Of The Navy Structures and methods related to detection, sensing, and/or mitigating undesirable structures or intrusion events on structures
US10178756B1 (en) * 2014-10-29 2019-01-08 National Technology & Engineering Solutions Of Sandia, Llc Multifunctional composite coatings for metal whisker mitigation
CN105297137B (zh) * 2015-11-17 2018-03-02 中国科学院金属研究所 一种从薄膜表面可控制备单晶锡纳米线/微米线的方法

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US3670091A (en) * 1971-05-20 1972-06-13 Sqrague Electric Co Encapsulated electrical components with protective pre-coat containing collapsible microspheres
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US4959278A (en) * 1988-06-16 1990-09-25 Nippon Mining Co., Ltd. Tin whisker-free tin or tin alloy plated article and coating technique thereof
US4888057A (en) * 1988-06-29 1989-12-19 Her Majesty The Queen As Represented By The Minister Of National Defence Of Her Majesty's Canadian Government Inorganic intumescent fire protective coatings
US5320737A (en) * 1989-08-10 1994-06-14 Olin Corporation Treatment to reduce solder plating whisker formation
US5032421A (en) * 1990-08-21 1991-07-16 Amp Incorporated Metal coating method
US5393573A (en) * 1991-07-16 1995-02-28 Microelectronics And Computer Technology Corporation Method of inhibiting tin whisker growth
US5206088A (en) * 1991-11-13 1993-04-27 Development Products, Inc. Ablative-intumescent system
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JP3302240B2 (ja) * 1995-11-28 2002-07-15 シャープ株式会社 薄膜トランジスタ及びその製造方法
US20010051209A1 (en) * 1996-10-11 2001-12-13 Richard Silberglitt Suppresion of voltage breakdown and field emission from surfaces
US6083633A (en) * 1997-06-16 2000-07-04 Olin Corporation Multi-layer diffusion barrier for a tin coated electrical connector
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US20030180621A1 (en) * 2000-08-30 2003-09-25 Isao Matsumoto Non-sintered type thin electrode for battery, battery using same and process for same
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Also Published As

Publication number Publication date
US20070284700A1 (en) 2007-12-13
EP2051850A1 (de) 2009-04-29
EP2051850B1 (de) 2009-11-18
WO2008022236A1 (en) 2008-02-21

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