DE602006020418D1 - Verringertes Übersprechen in gedruckten Leiterplatten mittels Verdrillung von Leiterbahnen - Google Patents
Verringertes Übersprechen in gedruckten Leiterplatten mittels Verdrillung von LeiterbahnenInfo
- Publication number
- DE602006020418D1 DE602006020418D1 DE602006020418T DE602006020418T DE602006020418D1 DE 602006020418 D1 DE602006020418 D1 DE 602006020418D1 DE 602006020418 T DE602006020418 T DE 602006020418T DE 602006020418 T DE602006020418 T DE 602006020418T DE 602006020418 D1 DE602006020418 D1 DE 602006020418D1
- Authority
- DE
- Germany
- Prior art keywords
- pcb
- wires
- wire
- printed circuit
- twisting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09245—Crossing layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
- Communication Cables (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06290932A EP1865757B1 (de) | 2006-06-06 | 2006-06-06 | Verringertes Übersprechen in gedruckten Leiterplatten mittels Verdrillung von Leiterbahnen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006020418D1 true DE602006020418D1 (de) | 2011-04-14 |
Family
ID=37075640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006020418T Active DE602006020418D1 (de) | 2006-06-06 | 2006-06-06 | Verringertes Übersprechen in gedruckten Leiterplatten mittels Verdrillung von Leiterbahnen |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1865757B1 (de) |
AT (1) | ATE500719T1 (de) |
DE (1) | DE602006020418D1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101383704B1 (ko) * | 2008-01-18 | 2014-04-10 | 삼성디스플레이 주식회사 | 회로 기판 및 이를 포함하는 표시 장치 |
JP6366608B2 (ja) * | 2013-01-22 | 2018-08-01 | ネオプロテオミクス アクチボラグ | 癌診断における血小板バイオマーカー |
CN115209615A (zh) * | 2022-08-15 | 2022-10-18 | 维沃移动通信有限公司 | 电子设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3761842A (en) * | 1972-06-01 | 1973-09-25 | Bell Telephone Labor Inc | Twisted pair flat conductor cable with means to equalize impedance and propagation velocity |
US3757028A (en) * | 1972-09-18 | 1973-09-04 | J Schlessel | Terference printed board and similar transmission line structure for reducing in |
US5430247A (en) * | 1993-08-31 | 1995-07-04 | Motorola, Inc. | Twisted-pair planar conductor line off-set structure |
JP3528484B2 (ja) * | 1996-12-27 | 2004-05-17 | モレックス インコーポレーテッド | 擬似ツイストペア平型柔軟ケーブル |
US6396000B1 (en) * | 2000-09-11 | 2002-05-28 | Hewlett-Packard Co. | Printed circuit board and method for reducing radio frequency interference emissions from conductive traces on a printed circuit board |
-
2006
- 2006-06-06 EP EP06290932A patent/EP1865757B1/de not_active Not-in-force
- 2006-06-06 AT AT06290932T patent/ATE500719T1/de not_active IP Right Cessation
- 2006-06-06 DE DE602006020418T patent/DE602006020418D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP1865757A1 (de) | 2007-12-12 |
ATE500719T1 (de) | 2011-03-15 |
EP1865757B1 (de) | 2011-03-02 |
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