DE602006005755D1 - Method for adhering polishing pad and jig for adhering same - Google Patents

Method for adhering polishing pad and jig for adhering same

Info

Publication number
DE602006005755D1
DE602006005755D1 DE602006005755T DE602006005755T DE602006005755D1 DE 602006005755 D1 DE602006005755 D1 DE 602006005755D1 DE 602006005755 T DE602006005755 T DE 602006005755T DE 602006005755 T DE602006005755 T DE 602006005755T DE 602006005755 D1 DE602006005755 D1 DE 602006005755D1
Authority
DE
Germany
Prior art keywords
adhering
jig
polishing pad
same
adhering same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006005755T
Other languages
German (de)
Inventor
Yoshio Nakamura
Harumichi Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Publication of DE602006005755D1 publication Critical patent/DE602006005755D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B24D9/085—Devices for mounting sheets on a backing plate

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE602006005755T 2005-10-17 2006-10-12 Method for adhering polishing pad and jig for adhering same Active DE602006005755D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005301330A JP4796813B2 (en) 2005-10-17 2005-10-17 Polishing pad attaching method and polishing pad attaching jig

Publications (1)

Publication Number Publication Date
DE602006005755D1 true DE602006005755D1 (en) 2009-04-30

Family

ID=37671203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006005755T Active DE602006005755D1 (en) 2005-10-17 2006-10-12 Method for adhering polishing pad and jig for adhering same

Country Status (8)

Country Link
US (1) US7306510B2 (en)
EP (1) EP1775068B1 (en)
JP (1) JP4796813B2 (en)
KR (1) KR20070042077A (en)
CN (1) CN1951634B (en)
DE (1) DE602006005755D1 (en)
MY (1) MY137884A (en)
TW (1) TW200716304A (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086960B1 (en) * 2010-03-02 2011-11-29 주식회사 엘지실트론 Adhering and Conditioning apparatus of edge polishing pad and edge polishing equipment including the same
CN101927279B (en) * 2010-08-23 2013-04-10 陈世江 Straightener for revising hydraulic pressure evenness
JP5759888B2 (en) * 2011-12-28 2015-08-05 東洋ゴム工業株式会社 Polishing pad
CN102581762A (en) * 2012-04-01 2012-07-18 北京华进创威电子有限公司 Crystal processing surface grinding platform
CN103522161B (en) * 2013-10-21 2016-05-11 上海理工大学 Metal wire rod burnishing device
CN106346368A (en) * 2016-10-28 2017-01-25 无锡龙翔印业有限公司 Water circulating hardware polishing machine capable of recycling metal powder
DE102016222063A1 (en) 2016-11-10 2018-05-17 Siltronic Ag Method for polishing both sides of a semiconductor wafer
DE102017217490A1 (en) 2017-09-29 2019-04-04 Siltronic Ag Method for polishing both sides of a semiconductor wafer
DE102018216304A1 (en) 2018-09-25 2020-03-26 Siltronic Ag Process for polishing a semiconductor wafer
CN111805337A (en) * 2020-06-28 2020-10-23 丽水市莲都区升嘉文凯模具厂 Deburring device for bearing ring
EP4000806A1 (en) 2020-11-16 2022-05-25 Siltronic AG Method for polishing semiconductor wafers on both sides between a lower polishing plate and an upper polishing plate
EP4000802A1 (en) 2020-11-17 2022-05-25 Siltronic AG Method for polishing semiconductor wafers on both sides between a lower polishing plate and an upper polishing plate
EP4212280A1 (en) 2022-01-12 2023-07-19 Siltronic AG Method of applying a polishing cloth to a polishing plate
CN114959865B (en) * 2022-07-01 2023-08-08 天朗科技有限公司 Steel plate polishing device and polishing method
EP4306262A1 (en) 2022-07-13 2024-01-17 Siltronic AG Method for polishing semiconductor wafers on both sides between a lower polishing plate and an upper polishing plate
EP4321298A1 (en) 2022-08-12 2024-02-14 Siltronic AG Device and method for pressing an upper polishing cloth against an upper polishing plate of a machine for simultaneously polishing a front side and a back side of a semiconductor wafer
CN115847276A (en) * 2022-12-15 2023-03-28 西安奕斯伟材料科技有限公司 Pin ring for double-side polishing equipment and double-side polishing machine

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953151A (en) * 1982-09-16 1984-03-27 Toshiba Corp Method and apparatus for attaching abrasive cloth to grinding machine
US5775983A (en) * 1995-05-01 1998-07-07 Applied Materials, Inc. Apparatus and method for conditioning a chemical mechanical polishing pad
JP3100905B2 (en) * 1995-08-24 2000-10-23 松下電器産業株式会社 Method and apparatus for polishing semiconductor substrate
KR100202659B1 (en) * 1996-07-09 1999-06-15 구본준 Apparatus for chemical mechanical polishing semiconductor wafer
JP4308344B2 (en) * 1998-07-24 2009-08-05 不二越機械工業株式会社 Double-side polishing equipment
US6520895B2 (en) * 1999-09-07 2003-02-18 Nikon Corporation Polishing device and polishing pad component exchange device and method
JP2001232561A (en) * 1999-12-16 2001-08-28 Mitsubishi Materials Silicon Corp Polishing method for semiconductor wafer by use of both face polishing device
EP1215011A1 (en) * 2000-12-14 2002-06-19 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for mounting a backing film to a polish head
US7125326B2 (en) * 2004-06-14 2006-10-24 Ebara Technologies Incorporated Apparatus and method for removing a CMP polishing pad from a platen
JP4307411B2 (en) * 2005-06-15 2009-08-05 三益半導体工業株式会社 Polishing pad pasting method and workpiece manufacturing method
JP4777727B2 (en) * 2005-09-05 2011-09-21 不二越機械工業株式会社 Polishing pad pasting method and polishing pad pasting jig

Also Published As

Publication number Publication date
US20070087671A1 (en) 2007-04-19
MY137884A (en) 2009-03-31
CN1951634A (en) 2007-04-25
JP4796813B2 (en) 2011-10-19
EP1775068B1 (en) 2009-03-18
JP2007105854A (en) 2007-04-26
EP1775068A1 (en) 2007-04-18
KR20070042077A (en) 2007-04-20
CN1951634B (en) 2010-09-08
TW200716304A (en) 2007-05-01
US7306510B2 (en) 2007-12-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition