DE602006002564D1 - Ultraschallreinigungsvorrichtung zur Reinigung des Randbereiches eines Werkstückes - Google Patents
Ultraschallreinigungsvorrichtung zur Reinigung des Randbereiches eines WerkstückesInfo
- Publication number
- DE602006002564D1 DE602006002564D1 DE602006002564T DE602006002564T DE602006002564D1 DE 602006002564 D1 DE602006002564 D1 DE 602006002564D1 DE 602006002564 T DE602006002564 T DE 602006002564T DE 602006002564 T DE602006002564 T DE 602006002564T DE 602006002564 D1 DE602006002564 D1 DE 602006002564D1
- Authority
- DE
- Germany
- Prior art keywords
- workpiece
- edge region
- cleaning
- cleaning device
- ultrasonic cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000004506 ultrasonic cleaning Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005204863A JP4691638B2 (ja) | 2005-07-13 | 2005-07-13 | 超音波洗浄装置 |
JP2005347109A JP4848556B2 (ja) | 2005-11-30 | 2005-11-30 | 洗浄用超音波振動子 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006002564D1 true DE602006002564D1 (de) | 2008-10-16 |
Family
ID=37401517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006002564T Active DE602006002564D1 (de) | 2005-07-13 | 2006-07-11 | Ultraschallreinigungsvorrichtung zur Reinigung des Randbereiches eines Werkstückes |
Country Status (4)
Country | Link |
---|---|
US (1) | US7942158B2 (de) |
EP (1) | EP1743715B1 (de) |
KR (1) | KR101052399B1 (de) |
DE (1) | DE602006002564D1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150107619A1 (en) * | 2013-10-22 | 2015-04-23 | Taiwan Semiconductor Manufacturing Company Limited | Wafer particle removal |
US20170260441A1 (en) * | 2016-03-11 | 2017-09-14 | Conocophillips Company | Preflush chemicals for scale inhibitor squeeze |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4834124A (en) * | 1987-01-09 | 1989-05-30 | Honda Electronics Co., Ltd. | Ultrasonic cleaning device |
KR0175278B1 (ko) * | 1996-02-13 | 1999-04-01 | 김광호 | 웨이퍼 세정장치 |
JPH11257851A (ja) * | 1998-03-10 | 1999-09-24 | Tokyo Electron Ltd | 乾燥装置及び乾燥方法 |
US6202658B1 (en) * | 1998-11-11 | 2001-03-20 | Applied Materials, Inc. | Method and apparatus for cleaning the edge of a thin disc |
US6523553B1 (en) * | 1999-03-30 | 2003-02-25 | Applied Materials, Inc. | Wafer edge cleaning method and apparatus |
JP3978296B2 (ja) * | 1999-08-05 | 2007-09-19 | 株式会社カイジョー | 基板端面用超音波励振装置及びこれを備えた基板端面用超音波洗浄装置 |
JP2001079013A (ja) * | 1999-09-13 | 2001-03-27 | Olympus Optical Co Ltd | 超音波処置装置 |
US6679272B2 (en) * | 2001-08-03 | 2004-01-20 | Verteq, Inc. | Megasonic probe energy attenuator |
KR100445259B1 (ko) * | 2001-11-27 | 2004-08-21 | 삼성전자주식회사 | 세정방법 및 이를 수행하기 위한 세정 장치 |
KR100526192B1 (ko) * | 2003-05-28 | 2005-11-03 | 삼성전자주식회사 | 웨이퍼 세정장치 및 세정방법 |
JP3981064B2 (ja) * | 2003-10-22 | 2007-09-26 | 株式会社カイジョー | 両面式超音波シャワー洗浄装置 |
JP4522329B2 (ja) * | 2005-06-24 | 2010-08-11 | 株式会社Sokudo | 基板処理装置 |
-
2006
- 2006-07-07 US US11/482,444 patent/US7942158B2/en not_active Expired - Fee Related
- 2006-07-11 EP EP06014410A patent/EP1743715B1/de not_active Not-in-force
- 2006-07-11 DE DE602006002564T patent/DE602006002564D1/de active Active
- 2006-07-12 KR KR1020060065354A patent/KR101052399B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20070008441A (ko) | 2007-01-17 |
US20070012343A1 (en) | 2007-01-18 |
US7942158B2 (en) | 2011-05-17 |
EP1743715B1 (de) | 2008-09-03 |
KR101052399B1 (ko) | 2011-07-28 |
EP1743715A1 (de) | 2007-01-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE502005003454D1 (de) | Vorrichtung zur feststellung des zustands eines russpartikelfilters | |
EP1845862A4 (de) | Ultraschallschneidvorrichtung | |
GB2425480B (en) | Improved ultrasonic surgical tool | |
ATE403447T1 (de) | Überwachung eines reinigungsverfahrens | |
DE602006018193D1 (de) | Vorrichtung zur behandlung schmutziger flüssigkeiten | |
EP1962552A4 (de) | Ultraschallwandler | |
DE502006006062D1 (de) | Reinigungsvorrichtung | |
BRPI0500576B1 (pt) | dispositivo de soldagem por ultra-som | |
EP1837052A4 (de) | Integrales wandlergerät für die ultraschallbehandlung | |
BRPI0819395A2 (pt) | "ferramenta de limpeza" | |
ATE394126T1 (de) | Reinigungsindikator zur überwachung eines reinigungsvorgangs | |
DE602006009141D1 (de) | Einrichtung zur Begrenzung des Vorschubes eines Bohrwerkzeugs bei einem Bohrvorgang | |
DE602006021261D1 (de) | Oberflächenwellenvorrichtung | |
DE602005011823D1 (de) | Vorrichtung zur Befestigung eines Referenzelementes | |
DE602006014463D1 (de) | Vorrichtung zur Bestimmung eines Kollisionsobjekts | |
ITRE20050060A1 (it) | Aspiratore portatile per lavori di pulizia | |
DE602007000224D1 (de) | Vorrichtung zum Entfernen des Blockrauschens | |
DK1998658T3 (da) | Rengøringsredskab | |
DE602006002564D1 (de) | Ultraschallreinigungsvorrichtung zur Reinigung des Randbereiches eines Werkstückes | |
DE502007000704D1 (de) | Vorrichtung zur reinigung von oberflächen von druckzylindern mithilfe eines reinigungstuches | |
DE112006001338A5 (de) | Verfahren zum Betreiben eines Flächenreinigungskopfes und Flächenreinigungskopf zur Durchführung des Verfahrens | |
EP1928321A4 (de) | Ultraschallsonde | |
DE602006005522D1 (de) | Verfahren zur Ultraschallprüfung des Schattenbereichs eines eingetauchten Teils | |
GB0511009D0 (en) | Clip for ultrasound probe | |
NO20050651D0 (no) | Renseanordning |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |