DE602005015348D1 - Targetanordnung zum Einbauen/Ausbauen und Herstellungsmethode - Google Patents
Targetanordnung zum Einbauen/Ausbauen und HerstellungsmethodeInfo
- Publication number
- DE602005015348D1 DE602005015348D1 DE602005015348T DE602005015348T DE602005015348D1 DE 602005015348 D1 DE602005015348 D1 DE 602005015348D1 DE 602005015348 T DE602005015348 T DE 602005015348T DE 602005015348 T DE602005015348 T DE 602005015348T DE 602005015348 D1 DE602005015348 D1 DE 602005015348D1
- Authority
- DE
- Germany
- Prior art keywords
- sub
- plane
- removal
- installation
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05028296A EP1801846B1 (de) | 2005-12-23 | 2005-12-23 | Targetanordnung zum Einbauen/Ausbauen und Herstellungsmethode |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005015348D1 true DE602005015348D1 (de) | 2009-08-20 |
Family
ID=36177741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005015348T Active DE602005015348D1 (de) | 2005-12-23 | 2005-12-23 | Targetanordnung zum Einbauen/Ausbauen und Herstellungsmethode |
Country Status (7)
Country | Link |
---|---|
US (1) | US8540850B2 (de) |
EP (1) | EP1801846B1 (de) |
JP (1) | JP4943829B2 (de) |
KR (1) | KR20070066982A (de) |
AT (1) | ATE436087T1 (de) |
DE (1) | DE602005015348D1 (de) |
SG (1) | SG133490A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101046520B1 (ko) | 2007-09-07 | 2011-07-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 챔버 상의 부산물 막 증착을 제어하기 위한 pecvd 시스템에서의 소스 가스 흐름 경로 제어 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2602807B2 (ja) * | 1985-09-27 | 1997-04-23 | 株式会社島津製作所 | スパツタ用ターゲツトアセンブリ |
JPH06136533A (ja) * | 1992-10-16 | 1994-05-17 | Toyo Ink Mfg Co Ltd | スハ゜ッタリンク゛ターケ゛ット |
US5529673A (en) | 1995-02-17 | 1996-06-25 | Sony Corporation | Mechanically joined sputtering target and adapter therefor |
DE19508406A1 (de) | 1995-03-09 | 1996-09-12 | Leybold Ag | Kathodenanordnung für eine Vorrichtung zum Zerstäuben eines Target-Paares |
US5512150A (en) * | 1995-03-09 | 1996-04-30 | Hmt Technology Corporation | Target assembly having inner and outer targets |
US5626226A (en) * | 1995-08-09 | 1997-05-06 | Imperial Schrade Corp. | Tamper-resistant, point-of-sale, article display package |
US5674367A (en) | 1995-12-22 | 1997-10-07 | Sony Corporation | Sputtering target having a shrink fit mounting ring |
DE59709021D1 (de) * | 1996-07-22 | 2003-01-30 | Unaxis Balzers Ag | Targetanordnung mit einer kreisförmigen platte |
US6068742A (en) * | 1996-07-22 | 2000-05-30 | Balzers Aktiengesellschaft | Target arrangement with a circular plate, magnetron for mounting the target arrangement, and process for coating a series of circular disc-shaped workpieces by means of said magnetron source |
TWI224626B (en) * | 2001-04-24 | 2004-12-01 | Tosoh Smd Inc | Method of optimizing a sputtering target profile for the purpose of extending target utilization life and targets made by such method |
US6743340B2 (en) | 2002-02-05 | 2004-06-01 | Applied Materials, Inc. | Sputtering of aligned magnetic materials and magnetic dipole ring used therefor |
-
2005
- 2005-12-23 AT AT05028296T patent/ATE436087T1/de not_active IP Right Cessation
- 2005-12-23 EP EP05028296A patent/EP1801846B1/de not_active Not-in-force
- 2005-12-23 DE DE602005015348T patent/DE602005015348D1/de active Active
-
2006
- 2006-11-22 SG SG200608014-7A patent/SG133490A1/en unknown
- 2006-12-14 US US11/639,034 patent/US8540850B2/en active Active
- 2006-12-19 JP JP2006341512A patent/JP4943829B2/ja not_active Expired - Fee Related
- 2006-12-22 KR KR1020060132641A patent/KR20070066982A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
SG133490A1 (en) | 2007-07-30 |
EP1801846B1 (de) | 2009-07-08 |
JP2007173237A (ja) | 2007-07-05 |
KR20070066982A (ko) | 2007-06-27 |
US8540850B2 (en) | 2013-09-24 |
US20070144899A1 (en) | 2007-06-28 |
ATE436087T1 (de) | 2009-07-15 |
EP1801846A1 (de) | 2007-06-27 |
JP4943829B2 (ja) | 2012-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |