DE602005005733D1 - Fügeverfahren mittels eines Au-Sn-Hartlötmaterials, dessen Dicke u.a. abhängig von dem Sn-Gehalt ist - Google Patents

Fügeverfahren mittels eines Au-Sn-Hartlötmaterials, dessen Dicke u.a. abhängig von dem Sn-Gehalt ist

Info

Publication number
DE602005005733D1
DE602005005733D1 DE602005005733T DE602005005733T DE602005005733D1 DE 602005005733 D1 DE602005005733 D1 DE 602005005733D1 DE 602005005733 T DE602005005733 T DE 602005005733T DE 602005005733 T DE602005005733 T DE 602005005733T DE 602005005733 D1 DE602005005733 D1 DE 602005005733D1
Authority
DE
Germany
Prior art keywords
depends
content
brazing material
material whose
joining method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005005733T
Other languages
English (en)
Other versions
DE602005005733T2 (de
Inventor
Kenichi Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Publication of DE602005005733D1 publication Critical patent/DE602005005733D1/de
Application granted granted Critical
Publication of DE602005005733T2 publication Critical patent/DE602005005733T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/004—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a metal of the iron group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE602005005733T 2004-02-20 2005-02-10 Fügeverfahren mittels eines Au-Sn-Hartlötmaterials, dessen Dicke u.a. abhängig von dem Sn-Gehalt ist Active DE602005005733T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004044600 2004-02-20
JP2004044600 2004-02-20

Publications (2)

Publication Number Publication Date
DE602005005733D1 true DE602005005733D1 (de) 2008-05-15
DE602005005733T2 DE602005005733T2 (de) 2009-05-28

Family

ID=34858067

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005005733T Active DE602005005733T2 (de) 2004-02-20 2005-02-10 Fügeverfahren mittels eines Au-Sn-Hartlötmaterials, dessen Dicke u.a. abhängig von dem Sn-Gehalt ist

Country Status (3)

Country Link
US (1) US7114644B2 (de)
EP (1) EP1591191B1 (de)
DE (1) DE602005005733T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4285753B2 (ja) * 2004-06-21 2009-06-24 田中貴金属工業株式会社 ハーメチックシールカバー及びその製造方法
US8110022B2 (en) * 2009-04-16 2012-02-07 Genesis Fueltech, Inc. Hydrogen purifier module and method for forming the same
JP5708692B2 (ja) 2013-03-28 2015-04-30 Tdk株式会社 電子デバイス用の接合構造及び電子デバイス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH1934H1 (en) * 1992-05-01 2001-01-02 Lucent Technologies, Inc. Gold-tin solder suitable for self-aligning applications
US5234153A (en) * 1992-08-28 1993-08-10 At&T Bell Laboratories Permanent metallic bonding method
JP3086086B2 (ja) * 1992-10-19 2000-09-11 田中貴金属工業株式会社 回路端子へのリードピンの接合方法
JP3271475B2 (ja) * 1994-08-01 2002-04-02 株式会社デンソー 電気素子の接合材料および接合方法
TWI248384B (en) * 2000-06-12 2006-02-01 Hitachi Ltd Electronic device
JP2001176999A (ja) * 2000-11-27 2001-06-29 Tanaka Kikinzoku Kogyo Kk 電子部品の気密封止方法
JP4416373B2 (ja) * 2002-03-08 2010-02-17 株式会社日立製作所 電子機器
US7187496B2 (en) * 2002-03-14 2007-03-06 Tdk Corporation Manufacturing method of optical device, optical device, manufacturing method of faraday rotator, and optical communication system
JP2004031696A (ja) * 2002-06-26 2004-01-29 Kyocera Corp 熱電モジュール及びその製造方法
JP4014549B2 (ja) * 2003-09-18 2007-11-28 富士電機システムズ株式会社 ヒートシンク及びその製造方法

Also Published As

Publication number Publication date
EP1591191A1 (de) 2005-11-02
US7114644B2 (en) 2006-10-03
US20050184135A1 (en) 2005-08-25
EP1591191B1 (de) 2008-04-02
DE602005005733T2 (de) 2009-05-28

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition