DE602005005616D1 - Integrierter Drucksensor und Herstellungsverfahren - Google Patents

Integrierter Drucksensor und Herstellungsverfahren

Info

Publication number
DE602005005616D1
DE602005005616D1 DE602005005616T DE602005005616T DE602005005616D1 DE 602005005616 D1 DE602005005616 D1 DE 602005005616D1 DE 602005005616 T DE602005005616 T DE 602005005616T DE 602005005616 T DE602005005616 T DE 602005005616T DE 602005005616 D1 DE602005005616 D1 DE 602005005616D1
Authority
DE
Germany
Prior art keywords
substrate
pressure sensor
compensation
sensors
integrated pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005005616T
Other languages
English (en)
Other versions
DE602005005616T2 (de
Inventor
Hamid R Borzabadi
Dennis M Koglin
Stephen P Long
Timothy A Vas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of DE602005005616D1 publication Critical patent/DE602005005616D1/de
Application granted granted Critical
Publication of DE602005005616T2 publication Critical patent/DE602005005616T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/069—Protection against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
    • G01L9/045—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges with electric temperature compensating means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE602005005616T 2005-01-03 2005-12-12 Integrierter Drucksensor und Herstellungsverfahren Active DE602005005616T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28343 2005-01-03
US11/028,343 US7117747B2 (en) 2005-01-03 2005-01-03 Integrated pressure sensor and method of manufacture

Publications (2)

Publication Number Publication Date
DE602005005616D1 true DE602005005616D1 (de) 2008-05-08
DE602005005616T2 DE602005005616T2 (de) 2009-05-07

Family

ID=36192883

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005005616T Active DE602005005616T2 (de) 2005-01-03 2005-12-12 Integrierter Drucksensor und Herstellungsverfahren

Country Status (4)

Country Link
US (1) US7117747B2 (de)
EP (1) EP1677089B1 (de)
AT (1) ATE390623T1 (de)
DE (1) DE602005005616T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7174773B2 (en) * 2005-04-19 2007-02-13 Delphi Technologies, Inc. Leak-testing technique for differential pressure sensor array
US7950286B2 (en) * 2008-12-19 2011-05-31 Honeywell International Inc. Multi-range pressure sensor apparatus and method utilizing a single sense die and multiple signal paths
US10330513B2 (en) * 2009-05-27 2019-06-25 Honeywell International Inc. Multi-dynamic-range sensor
US8656772B2 (en) 2010-03-22 2014-02-25 Honeywell International Inc. Flow sensor with pressure output signal
US8695417B2 (en) 2011-01-31 2014-04-15 Honeywell International Inc. Flow sensor with enhanced flow range capability
US8446220B2 (en) 2011-05-09 2013-05-21 Honeywell International Inc. Method and apparatus for increasing the effective resolution of a sensor
US8770034B2 (en) 2011-09-06 2014-07-08 Honeywell International Inc. Packaged sensor with multiple sensors elements
US9052217B2 (en) 2012-11-09 2015-06-09 Honeywell International Inc. Variable scale sensor
US11378468B2 (en) * 2016-08-12 2022-07-05 Brightsentinel Limited Sensor module and process for producing same

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3886799A (en) 1973-09-24 1975-06-03 Nat Semiconductor Corp Semiconductor pressure transducer employing temperature compensation circuits and novel heater circuitry
JPS56118374A (en) 1980-02-22 1981-09-17 Hitachi Ltd Semiconductor strain gauge
JPS56142430A (en) 1980-03-24 1981-11-06 Morita Mfg Co Ltd Biting pressure sensor
JPS5931404A (ja) 1982-08-16 1984-02-20 Hitachi Ltd 圧力センサ回路
JPH01199476A (ja) 1987-10-28 1989-08-10 Komatsu Ltd 圧力センサ
US5062302A (en) * 1988-04-29 1991-11-05 Schlumberger Industries, Inc. Laminated semiconductor sensor with overpressure protection
JPH0777266B2 (ja) 1988-12-28 1995-08-16 株式会社豊田中央研究所 半導体歪み検出装置
US5431057A (en) 1990-02-12 1995-07-11 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Integratable capacitative pressure sensor
JP3203788B2 (ja) * 1992-07-24 2001-08-27 オムロン株式会社 物理量センサ及びその製造方法
US5581038A (en) 1994-04-04 1996-12-03 Sentir, Inc. Pressure measurement apparatus having a reverse mounted transducer and overpressure guard
US5507171A (en) 1994-04-15 1996-04-16 Ssi Technologies, Inc. Electronic circuit for a transducer
EP0702221A3 (de) * 1994-09-14 1997-05-21 Delco Electronics Corp Auf einem Chip integrierter Sensor
US5700981A (en) * 1996-02-08 1997-12-23 Micron Communications, Inc. Encapsulated electronic component and method for encapsulating an electronic component
US5981314A (en) * 1996-10-31 1999-11-09 Amkor Technology, Inc. Near chip size integrated circuit package
JP3299715B2 (ja) * 1998-04-01 2002-07-08 長野計器株式会社 チップの電位取出構造および製造方法
DE19825761C2 (de) 1998-06-09 2001-02-08 Fraunhofer Ges Forschung Vorrichtung zum Erfassen einer Dehnung und/oder einer Stauchung eines Körpers
US6229404B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Crystal oscillator
DE10022124B4 (de) * 2000-05-06 2010-01-14 Wabco Gmbh Elektronisches Steuergerät
KR20030053501A (ko) 2000-07-13 2003-06-28 미쓰비시덴키 가부시키가이샤 압력 센서
WO2002096166A1 (en) * 2001-05-18 2002-11-28 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates
JP3891037B2 (ja) * 2002-05-21 2007-03-07 株式会社デンソー 半導体圧力センサおよび半導体圧力センサ用の半導体ウェハ
US6710461B2 (en) * 2002-06-06 2004-03-23 Lightuning Tech. Inc. Wafer level packaging of micro electromechanical device
DE10231727A1 (de) 2002-07-13 2004-01-22 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechende Messanordnung
US6833645B2 (en) * 2002-11-18 2004-12-21 Harris Corporation Micro-electromechanical voltage converter
JP2004177343A (ja) * 2002-11-28 2004-06-24 Fujikura Ltd 圧力センサ
JP2005180930A (ja) * 2003-12-16 2005-07-07 Ricoh Co Ltd 半導体センサ装置及びその製造方法

Also Published As

Publication number Publication date
US20060144156A1 (en) 2006-07-06
DE602005005616T2 (de) 2009-05-07
ATE390623T1 (de) 2008-04-15
EP1677089B1 (de) 2008-03-26
US7117747B2 (en) 2006-10-10
EP1677089A1 (de) 2006-07-05

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