DE602005001153D1 - Manufacturing method for an isothermal plate assembly of predetermined shape - Google Patents
Manufacturing method for an isothermal plate assembly of predetermined shapeInfo
- Publication number
- DE602005001153D1 DE602005001153D1 DE602005001153T DE602005001153T DE602005001153D1 DE 602005001153 D1 DE602005001153 D1 DE 602005001153D1 DE 602005001153 T DE602005001153 T DE 602005001153T DE 602005001153 T DE602005001153 T DE 602005001153T DE 602005001153 D1 DE602005001153 D1 DE 602005001153D1
- Authority
- DE
- Germany
- Prior art keywords
- predetermined shape
- manufacturing
- plate assembly
- plate
- isothermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Abstract
An isothermal plate assembly (1) with predetermined shape and method for manufacturing the same are proposed. An upper plate (11) and a lower plate (12) with predetermined shape are provided and an accommodation space (13) is defined therebetween. A flattened heat pipe (2) is bent into the predetermined shape and placed into the accommodation space (13). A binding agent is applied on the face between the heat pipe (2), the upper plate (11) and the lower plate (12). The upper plate (11) and the lower plate (12) are assembled and then a hot melting process is executed. The resultant product is then cooled to form a finished isothermal plate assembly (1) with predetermind shape.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05000861A EP1681527B1 (en) | 2005-01-17 | 2005-01-17 | Method for manufacturing an isothermal plate assembly with predetemined shape |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602005001153D1 true DE602005001153D1 (en) | 2007-06-28 |
DE602005001153T2 DE602005001153T2 (en) | 2008-01-24 |
Family
ID=34933339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005001153T Active DE602005001153T2 (en) | 2005-01-17 | 2005-01-17 | Manufacturing method for an isothermal plate assembly of predetermined shape |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1681527B1 (en) |
AT (1) | ATE362604T1 (en) |
DE (1) | DE602005001153T2 (en) |
DK (1) | DK1681527T3 (en) |
ES (1) | ES2287814T3 (en) |
PL (1) | PL1681527T3 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2657338B2 (en) * | 2016-09-02 | 2019-01-29 | Eidopia S L | Opto-thermal system based on two-dimensional thermal plates |
EP4165358A1 (en) * | 2020-06-11 | 2023-04-19 | Signify Holding B.V. | Vapor chamber assembly |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2947000C2 (en) * | 1978-11-22 | 1985-04-18 | Pioneer Electronic Corp., Tokio/Tokyo | Housings for electronic devices |
US4461343A (en) * | 1982-01-28 | 1984-07-24 | Mcdonnell Douglas Corporation | Plated heat pipe |
DE3543673A1 (en) * | 1985-12-11 | 1987-06-19 | Sueddeutsche Kuehler Behr | Apparatus for heating |
US4880052A (en) * | 1989-02-27 | 1989-11-14 | Thermacore, Inc. | Heat pipe cooling plate |
JPH04366394A (en) * | 1991-06-11 | 1992-12-18 | Akutoronikusu Kk | Hybrid type heat pipe flat plate structure |
US6133631A (en) * | 1997-05-30 | 2000-10-17 | Hewlett-Packard Company | Semiconductor package lid with internal heat pipe |
JP2981505B2 (en) * | 1998-04-10 | 1999-11-22 | ダイヤモンド電機株式会社 | Heat pipe processing method |
JP2001165584A (en) * | 1999-12-02 | 2001-06-22 | Tokai Rubber Ind Ltd | Sheet type heat pipe |
JP2001241869A (en) * | 2000-02-24 | 2001-09-07 | Toshiba Corp | Heat pipe structure |
US6679318B2 (en) * | 2002-01-19 | 2004-01-20 | Allan P Bakke | Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability |
-
2005
- 2005-01-17 DE DE602005001153T patent/DE602005001153T2/en active Active
- 2005-01-17 AT AT05000861T patent/ATE362604T1/en not_active IP Right Cessation
- 2005-01-17 DK DK05000861T patent/DK1681527T3/en active
- 2005-01-17 PL PL05000861T patent/PL1681527T3/en unknown
- 2005-01-17 ES ES05000861T patent/ES2287814T3/en active Active
- 2005-01-17 EP EP05000861A patent/EP1681527B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP1681527A1 (en) | 2006-07-19 |
EP1681527B1 (en) | 2007-05-16 |
ES2287814T3 (en) | 2007-12-16 |
DE602005001153T2 (en) | 2008-01-24 |
DK1681527T3 (en) | 2007-09-10 |
ATE362604T1 (en) | 2007-06-15 |
PL1681527T3 (en) | 2007-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |