DE602004029484D1 - Lötaugengitter-array-sockel mit diversen kontakten - Google Patents

Lötaugengitter-array-sockel mit diversen kontakten

Info

Publication number
DE602004029484D1
DE602004029484D1 DE602004029484T DE602004029484T DE602004029484D1 DE 602004029484 D1 DE602004029484 D1 DE 602004029484D1 DE 602004029484 T DE602004029484 T DE 602004029484T DE 602004029484 T DE602004029484 T DE 602004029484T DE 602004029484 D1 DE602004029484 D1 DE 602004029484D1
Authority
DE
Germany
Prior art keywords
array base
various contacts
floor grille
grille array
floor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004029484T
Other languages
English (en)
Inventor
Shlomo D Novotny
Istvan Novak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oracle America Inc
Original Assignee
Oracle America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oracle America Inc filed Critical Oracle America Inc
Publication of DE602004029484D1 publication Critical patent/DE602004029484D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE602004029484T 2003-10-14 2004-10-13 Lötaugengitter-array-sockel mit diversen kontakten Expired - Lifetime DE602004029484D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/685,069 US6923656B2 (en) 2003-10-14 2003-10-14 Land grid array socket with diverse contacts
PCT/US2004/033659 WO2005039266A2 (en) 2003-10-14 2004-10-13 Land grid array socket with diverse contacts

Publications (1)

Publication Number Publication Date
DE602004029484D1 true DE602004029484D1 (de) 2010-11-18

Family

ID=34423089

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004029484T Expired - Lifetime DE602004029484D1 (de) 2003-10-14 2004-10-13 Lötaugengitter-array-sockel mit diversen kontakten

Country Status (4)

Country Link
US (1) US6923656B2 (de)
EP (1) EP1676473B1 (de)
DE (1) DE602004029484D1 (de)
WO (1) WO2005039266A2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
US7090507B2 (en) * 2004-02-27 2006-08-15 Tyco Electronics Corporation Socket having substrate locking feature
US7347698B2 (en) * 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
WO2005091998A2 (en) 2004-03-19 2005-10-06 Neoconix, Inc. Electrical connector in a flexible host
TWM279071U (en) * 2005-02-25 2005-10-21 Hon Hai Prec Ind Co Ltd Electrical connector
US7419383B2 (en) * 2005-09-29 2008-09-02 Intel Corporation Self-balanced dual L-shaped socket
US20070252283A1 (en) * 2006-04-28 2007-11-01 Keller Christopher L High speed, high density board to board interconnect
JP5788166B2 (ja) * 2010-11-02 2015-09-30 新光電気工業株式会社 接続端子構造及びその製造方法、並びにソケット
US8727808B2 (en) 2011-07-13 2014-05-20 Tyco Electronics Corporation Electrical connector assembly for interconnecting an electronic module and an electrical component
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
TWM453277U (zh) * 2012-09-17 2013-05-11 Hon Hai Prec Ind Co Ltd 電連接器及其組合
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
TWI600359B (zh) * 2015-11-27 2017-09-21 鴻海精密工業股份有限公司 電子產品
US10741951B2 (en) * 2017-11-13 2020-08-11 Te Connectivity Corporation Socket connector assembly for an electronic package
US11129290B2 (en) * 2019-05-20 2021-09-21 TE Connectivity Services Gmbh Power delivery module for an electronic package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3355353B2 (ja) * 1993-08-20 2002-12-09 ケル株式会社 電気コネクタ
US5483099A (en) * 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US6217342B1 (en) 1997-10-30 2001-04-17 Intercon Systems, Inc. Interposer assembly
US6597190B2 (en) * 2000-09-29 2003-07-22 Intel Corporation Method and apparatus for testing electronic devices
US6604950B2 (en) 2001-04-26 2003-08-12 Teledyne Technologies Incorporated Low pitch, high density connector
US6793505B2 (en) * 2002-03-26 2004-09-21 Intel Corporation Ganged land grid array socket contacts for improved power delivery
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery

Also Published As

Publication number Publication date
EP1676473B1 (de) 2010-10-06
US6923656B2 (en) 2005-08-02
US20050079744A1 (en) 2005-04-14
EP1676473A2 (de) 2006-07-05
WO2005039266A3 (en) 2005-09-15
WO2005039266A2 (en) 2005-04-28

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