DE602004024486D1 - Trägervorrichtung für einen Sensor - Google Patents

Trägervorrichtung für einen Sensor

Info

Publication number
DE602004024486D1
DE602004024486D1 DE200460024486 DE602004024486T DE602004024486D1 DE 602004024486 D1 DE602004024486 D1 DE 602004024486D1 DE 200460024486 DE200460024486 DE 200460024486 DE 602004024486 T DE602004024486 T DE 602004024486T DE 602004024486 D1 DE602004024486 D1 DE 602004024486D1
Authority
DE
Germany
Prior art keywords
sensor
carrier device
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200460024486
Other languages
English (en)
Inventor
Francois Coursaget
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electronics and Defense SAS
Original Assignee
Sagem Defense Securite SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem Defense Securite SA filed Critical Sagem Defense Securite SA
Publication of DE602004024486D1 publication Critical patent/DE602004024486D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Aiming, Guidance, Guns With A Light Source, Armor, Camouflage, And Targets (AREA)
DE200460024486 2003-10-01 2004-09-23 Trägervorrichtung für einen Sensor Active DE602004024486D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0311486A FR2860637B1 (fr) 2003-10-01 2003-10-01 Dispositif de support d'un detecteur

Publications (1)

Publication Number Publication Date
DE602004024486D1 true DE602004024486D1 (de) 2010-01-21

Family

ID=34307311

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200460024486 Active DE602004024486D1 (de) 2003-10-01 2004-09-23 Trägervorrichtung für einen Sensor

Country Status (3)

Country Link
EP (1) EP1521513B1 (de)
DE (1) DE602004024486D1 (de)
FR (1) FR2860637B1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102184610B (zh) * 2011-04-29 2013-05-08 深圳市豪恩安全科技有限公司 一种被动红外探测器、安防系统及安装方法
CN113063057B (zh) * 2021-03-30 2024-02-02 中国飞机强度研究所 一种安装支架

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5382797A (en) * 1990-12-21 1995-01-17 Santa Barbara Research Center Fast cooldown cryostat for large infrared focal plane arrays
FR2671230B1 (fr) * 1990-12-28 1993-04-16 Telecommunications Sa Doigt de refroidissement d'un circuit semi-conducteur et dispositif cryogenique pourvu d'un tel doigt.

Also Published As

Publication number Publication date
FR2860637B1 (fr) 2005-12-02
FR2860637A1 (fr) 2005-04-08
EP1521513A1 (de) 2005-04-06
EP1521513B1 (de) 2009-12-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition