DE602004019983D1 - Verfahren zur herstellung von kamm-ansteuereinrichtungen unter verwendung von ätzpuffern - Google Patents

Verfahren zur herstellung von kamm-ansteuereinrichtungen unter verwendung von ätzpuffern

Info

Publication number
DE602004019983D1
DE602004019983D1 DE602004019983T DE602004019983T DE602004019983D1 DE 602004019983 D1 DE602004019983 D1 DE 602004019983D1 DE 602004019983 T DE602004019983 T DE 602004019983T DE 602004019983 T DE602004019983 T DE 602004019983T DE 602004019983 D1 DE602004019983 D1 DE 602004019983D1
Authority
DE
Germany
Prior art keywords
combusation
appliances
production
coating buffers
buffers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004019983T
Other languages
English (en)
Inventor
Jeffrey A Ridley
James A Neus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE602004019983D1 publication Critical patent/DE602004019983D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/00698—Electrical characteristics, e.g. by doping materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/033—Comb drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
DE602004019983T 2003-12-22 2004-12-21 Verfahren zur herstellung von kamm-ansteuereinrichtungen unter verwendung von ätzpuffern Active DE602004019983D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/746,219 US7012322B2 (en) 2003-12-22 2003-12-22 Method for reducing harmonic distortion in comb drive devices
PCT/US2004/042944 WO2005064780A1 (en) 2003-12-22 2004-12-21 Method for producing comb drive devices using etch buffers

Publications (1)

Publication Number Publication Date
DE602004019983D1 true DE602004019983D1 (de) 2009-04-23

Family

ID=34679220

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004019983T Active DE602004019983D1 (de) 2003-12-22 2004-12-21 Verfahren zur herstellung von kamm-ansteuereinrichtungen unter verwendung von ätzpuffern

Country Status (6)

Country Link
US (2) US7012322B2 (de)
EP (1) EP1733468B1 (de)
CA (1) CA2562682A1 (de)
DE (1) DE602004019983D1 (de)
TW (1) TW200532802A (de)
WO (1) WO2005064780A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI293787B (en) * 2004-11-12 2008-02-21 Nat Applied Res Lab Nat Chip Implementation Ct Cmos-mems process
US7709344B2 (en) * 2005-11-22 2010-05-04 International Business Machines Corporation Integrated circuit fabrication process using gas cluster ion beam etching
US7516661B2 (en) * 2006-02-23 2009-04-14 Honeywell International Inc. Z offset MEMS device
US7928631B2 (en) 2006-03-31 2011-04-19 Alcatel-Lucent Usa Inc. Stable electro-mechanical comb drive actuators
US8151641B2 (en) 2009-05-21 2012-04-10 Analog Devices, Inc. Mode-matching apparatus and method for micromachined inertial sensors
US9212908B2 (en) 2012-04-26 2015-12-15 Analog Devices, Inc. MEMS gyroscopes with reduced errors
US9869552B2 (en) 2015-03-20 2018-01-16 Analog Devices, Inc. Gyroscope that compensates for fluctuations in sensitivity
CN109256979B (zh) * 2018-09-15 2020-01-21 西安知微传感技术有限公司 一种具有自洁功能的梳齿驱动器
US10923594B2 (en) * 2018-12-20 2021-02-16 Globalfoundries U.S. Inc. Methods to reduce or prevent strain relaxation on PFET devices and corresponding novel IC products
CN118041270A (zh) * 2022-11-04 2024-05-14 广州乐仪投资有限公司 半导体结构的制备方法、半导体结构及电子设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5969848A (en) * 1997-07-03 1999-10-19 The Regents Of The University Of California Micromachined electrostatic vertical actuator
US6143583A (en) * 1998-06-08 2000-11-07 Honeywell, Inc. Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
US6363183B1 (en) * 2000-01-04 2002-03-26 Seungug Koh Reconfigurable and scalable intergrated optic waveguide add/drop multiplexing element using micro-opto-electro-mechanical systems and methods of fabricating thereof
DE50101190D1 (de) * 2000-01-31 2004-01-29 Sercalo Microtechnology Ltd Schalteranordnung für strahlungsleiter
CA2413965C (en) * 2000-06-21 2011-01-11 Input/Output, Inc. Accelerometer with folded beams
US6544655B1 (en) * 2000-08-08 2003-04-08 Honeywell International Inc. Methods for reducing the curvature in boron-doped silicon micromachined structures
WO2002019509A2 (en) 2000-08-28 2002-03-07 Honeywell International Inc. Comb drive assembly having comb drive fingers with varying cross-sections and methods of making same
US6582985B2 (en) * 2000-12-27 2003-06-24 Honeywell International Inc. SOI/glass process for forming thin silicon micromachined structures
US6995067B2 (en) * 2003-02-06 2006-02-07 Lam Research Corporation Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency

Also Published As

Publication number Publication date
EP1733468A1 (de) 2006-12-20
CA2562682A1 (en) 2005-07-14
US20060113644A1 (en) 2006-06-01
TW200532802A (en) 2005-10-01
US7396476B2 (en) 2008-07-08
EP1733468B1 (de) 2009-03-11
WO2005064780A1 (en) 2005-07-14
US20050136621A1 (en) 2005-06-23
US7012322B2 (en) 2006-03-14

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Legal Events

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8364 No opposition during term of opposition