DE60135191D1 - Vorläufer zur MOCVD in Lösungsmittelmischungen - Google Patents
Vorläufer zur MOCVD in LösungsmittelmischungenInfo
- Publication number
- DE60135191D1 DE60135191D1 DE60135191T DE60135191T DE60135191D1 DE 60135191 D1 DE60135191 D1 DE 60135191D1 DE 60135191 T DE60135191 T DE 60135191T DE 60135191 T DE60135191 T DE 60135191T DE 60135191 D1 DE60135191 D1 DE 60135191D1
- Authority
- DE
- Germany
- Prior art keywords
- mocvd
- precursor
- solvent mixtures
- mixtures
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/409—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or lead and B representing a refractory metal, nickel, scandium or a lanthanide
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/649,381 US6503314B1 (en) | 2000-08-28 | 2000-08-28 | MOCVD ferroelectric and dielectric thin films depositions using mixed solvents |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60135191D1 true DE60135191D1 (de) | 2008-09-18 |
Family
ID=24604536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60135191T Expired - Lifetime DE60135191D1 (de) | 2000-08-28 | 2001-08-24 | Vorläufer zur MOCVD in Lösungsmittelmischungen |
Country Status (6)
Country | Link |
---|---|
US (1) | US6503314B1 (de) |
EP (1) | EP1184485B1 (de) |
JP (1) | JP4007573B2 (de) |
KR (1) | KR100441549B1 (de) |
DE (1) | DE60135191D1 (de) |
TW (1) | TWI257435B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6664116B2 (en) * | 2001-12-12 | 2003-12-16 | Sharp Laboratories Of America, Inc. | Seed layer processes for MOCVD of ferroelectric thin films on high-k gate oxides |
US6887523B2 (en) * | 2002-12-20 | 2005-05-03 | Sharp Laboratories Of America, Inc. | Method for metal oxide thin film deposition via MOCVD |
JP4643196B2 (ja) * | 2003-07-25 | 2011-03-02 | 三星電子株式会社 | 金属化合物膜の蒸着方法 |
KR101001741B1 (ko) * | 2003-08-18 | 2010-12-15 | 삼성전자주식회사 | 반도체 장치의 커패시터 및 그 제조 방법과 커패시터를구비하는 메모리 장치 |
US7157111B2 (en) * | 2003-09-30 | 2007-01-02 | Sharp Laboratories Of America, Inc. | MOCVD selective deposition of C-axis oriented PB5GE3O11 thin films on In2O3 oxides |
WO2005121400A1 (ja) * | 2004-06-10 | 2005-12-22 | Mitsubishi Materials Corporation | 有機金属化学蒸着法用溶液原料及び該原料を用いて作製された複合酸化物系誘電体薄膜 |
KR100636023B1 (ko) | 2005-08-02 | 2006-10-18 | 삼성전자주식회사 | 유기금속 전구체 및 이를 이용한 박막 제조방법 |
US7771913B2 (en) | 2006-04-04 | 2010-08-10 | Shin-Etsu Chemical Co., Ltd. | Resist composition and patterning process using the same |
JP5514437B2 (ja) * | 2007-12-28 | 2014-06-04 | 三菱マテリアル株式会社 | 誘電体薄膜の製造方法。 |
JP6225544B2 (ja) * | 2013-07-31 | 2017-11-08 | 株式会社デンソー | 圧電素子の製造方法 |
WO2019166318A1 (en) * | 2018-03-02 | 2019-09-06 | Asml Netherlands B.V. | Method and apparatus for forming a patterned layer of material |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5453494A (en) | 1990-07-06 | 1995-09-26 | Advanced Technology Materials, Inc. | Metal complex source reagents for MOCVD |
US5820664A (en) | 1990-07-06 | 1998-10-13 | Advanced Technology Materials, Inc. | Precursor compositions for chemical vapor deposition, and ligand exchange resistant metal-organic precursor solutions comprising same |
US5225561A (en) | 1990-07-06 | 1993-07-06 | Advanced Technology Materials, Inc. | Source reagent compounds for MOCVD of refractory films containing group IIA elements |
US5783716A (en) * | 1996-06-28 | 1998-07-21 | Advanced Technology Materials, Inc. | Platinum source compositions for chemical vapor deposition of platinum |
US6010744A (en) * | 1997-12-23 | 2000-01-04 | Advanced Technology Materials, Inc. | Method for nucleation controlled chemical vapor deposition of metal oxide ferroelectric thin films |
US6410343B1 (en) * | 1999-04-28 | 2002-06-25 | Sharp Laboratories Of America, Inc. | C-axis oriented lead germanate film and deposition method |
US6190925B1 (en) * | 1999-04-28 | 2001-02-20 | Sharp Laboratories Of America, Inc. | Epitaxially grown lead germanate film and deposition method |
US6590243B2 (en) * | 1999-04-28 | 2003-07-08 | Sharp Laboratories Of America, Inc. | Ferroelastic lead germanate thin film and deposition method |
-
2000
- 2000-08-28 US US09/649,381 patent/US6503314B1/en not_active Expired - Fee Related
-
2001
- 2001-07-24 JP JP2001223659A patent/JP4007573B2/ja not_active Expired - Fee Related
- 2001-08-22 KR KR10-2001-0050722A patent/KR100441549B1/ko not_active IP Right Cessation
- 2001-08-24 EP EP01307249A patent/EP1184485B1/de not_active Expired - Lifetime
- 2001-08-24 DE DE60135191T patent/DE60135191D1/de not_active Expired - Lifetime
- 2001-08-24 TW TW090120891A patent/TWI257435B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6503314B1 (en) | 2003-01-07 |
JP2002121675A (ja) | 2002-04-26 |
TWI257435B (en) | 2006-07-01 |
JP4007573B2 (ja) | 2007-11-14 |
KR20020017984A (ko) | 2002-03-07 |
EP1184485B1 (de) | 2008-08-06 |
KR100441549B1 (ko) | 2004-07-23 |
EP1184485A1 (de) | 2002-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |