DE60037806D1 - Prozesskammer mit einer reflektierenden heizplatte - Google Patents

Prozesskammer mit einer reflektierenden heizplatte

Info

Publication number
DE60037806D1
DE60037806D1 DE60037806T DE60037806T DE60037806D1 DE 60037806 D1 DE60037806 D1 DE 60037806D1 DE 60037806 T DE60037806 T DE 60037806T DE 60037806 T DE60037806 T DE 60037806T DE 60037806 D1 DE60037806 D1 DE 60037806D1
Authority
DE
Germany
Prior art keywords
process chamber
base plate
heating plate
insulator
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60037806T
Other languages
English (en)
Other versions
DE60037806T2 (de
Inventor
Jae Yun Lee
Lovell C Chase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
ASML Holding NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV filed Critical ASML Holding NV
Application granted granted Critical
Publication of DE60037806D1 publication Critical patent/DE60037806D1/de
Publication of DE60037806T2 publication Critical patent/DE60037806T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Baking, Grill, Roasting (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
  • Thermal Insulation (AREA)
DE60037806T 1999-06-16 2000-06-16 Prozesskammer mit einer reflektierenden heizplatte Expired - Lifetime DE60037806T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US13956099P 1999-06-16 1999-06-16
US139560P 1999-06-16
US20361200P 2000-05-10 2000-05-10
US203612P 2000-05-10
US593270 2000-06-13
US09/593,270 US6416318B1 (en) 1999-06-16 2000-06-13 Process chamber assembly with reflective hot plate and pivoting lid
PCT/US2000/016635 WO2000077833A2 (en) 1999-06-16 2000-06-16 Process chamber assembly with reflective hot plate

Publications (2)

Publication Number Publication Date
DE60037806D1 true DE60037806D1 (de) 2008-03-06
DE60037806T2 DE60037806T2 (de) 2009-01-15

Family

ID=27385360

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60037806T Expired - Lifetime DE60037806T2 (de) 1999-06-16 2000-06-16 Prozesskammer mit einer reflektierenden heizplatte

Country Status (8)

Country Link
US (1) US6416318B1 (de)
EP (1) EP1186007B1 (de)
JP (1) JP4045098B2 (de)
KR (2) KR100564889B1 (de)
AT (1) ATE384333T1 (de)
AU (1) AU5619000A (de)
DE (1) DE60037806T2 (de)
WO (1) WO2000077833A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6838115B2 (en) * 2000-07-12 2005-01-04 Fsi International, Inc. Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices
US20030173346A1 (en) * 2002-03-18 2003-09-18 Renken Wayne Glenn System and method for heating and cooling wafer at accelerated rates
AU2003257112A1 (en) * 2002-09-10 2004-04-30 Fsi International, Inc. Thermal process station with heated lid
US6891134B2 (en) * 2003-02-10 2005-05-10 Asml Netherlands B.V. Integrally formed bake plate unit for use in wafer fabrication system
US6994544B2 (en) * 2004-01-30 2006-02-07 Texas Instruments Incorporated Wafer scale thermal stress fixture and method
KR100601979B1 (ko) * 2004-12-30 2006-07-18 삼성전자주식회사 반도체 웨이퍼의 베이킹 장치
JP4707593B2 (ja) * 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 熱処理装置と基板吸着方法
US9581255B2 (en) 2012-07-23 2017-02-28 Henning, Inc. Multiple proportion delivery systems and methods

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60119711A (ja) 1983-12-02 1985-06-27 Hitachi Ltd 気相反応装置
JPH07114185B2 (ja) 1986-11-05 1995-12-06 日本電気株式会社 基板加熱装置
JPS63260146A (ja) 1987-04-17 1988-10-27 Nippon Maikuronikusu:Kk 半導体ウエハ測定装置
JPH01310555A (ja) * 1988-06-08 1989-12-14 Mitsubishi Electric Corp ウエハ収納ケース
US5011794A (en) * 1989-05-01 1991-04-30 At&T Bell Laboratories Procedure for rapid thermal annealing of implanted semiconductors
JP3044735B2 (ja) 1990-03-30 2000-05-22 ソニー株式会社 スパッタリング装置
US5223113A (en) 1990-07-20 1993-06-29 Tokyo Electron Limited Apparatus for forming reduced pressure and for processing object
JP2890087B2 (ja) * 1993-06-10 1999-05-10 東京エレクトロン株式会社 処理装置
TW444922U (en) 1994-09-29 2001-07-01 Tokyo Electron Ltd Heating device and the processing device using the same
DE19622322C2 (de) 1995-06-15 1999-02-25 Toshiba Ceramics Co Vorrichtung zum Züchten aus der Dampfphase
US5885353A (en) * 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
US5756157A (en) * 1996-10-02 1998-05-26 Silicon Valley Group Method for processing flat panel displays and large wafers
US6050446A (en) 1997-07-11 2000-04-18 Applied Materials, Inc. Pivoting lid assembly for a chamber
US6086362A (en) * 1998-05-20 2000-07-11 Applied Komatsu Technology, Inc. Multi-function chamber for a substrate processing system

Also Published As

Publication number Publication date
JP4045098B2 (ja) 2008-02-13
KR20020019088A (ko) 2002-03-09
EP1186007A2 (de) 2002-03-13
US6416318B1 (en) 2002-07-09
KR100537230B1 (ko) 2005-12-16
AU5619000A (en) 2001-01-02
ATE384333T1 (de) 2008-02-15
KR20050053735A (ko) 2005-06-08
WO2000077833A3 (en) 2001-07-12
KR100564889B1 (ko) 2006-03-30
DE60037806T2 (de) 2009-01-15
JP2003502838A (ja) 2003-01-21
WO2000077833A2 (en) 2000-12-21
EP1186007B1 (de) 2008-01-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition