DE60032277D1 - Verfahren und Apparat zur Überwachung von Spannkräften in einem elektrostatischen Scheibenhalter - Google Patents

Verfahren und Apparat zur Überwachung von Spannkräften in einem elektrostatischen Scheibenhalter

Info

Publication number
DE60032277D1
DE60032277D1 DE60032277T DE60032277T DE60032277D1 DE 60032277 D1 DE60032277 D1 DE 60032277D1 DE 60032277 T DE60032277 T DE 60032277T DE 60032277 T DE60032277 T DE 60032277T DE 60032277 D1 DE60032277 D1 DE 60032277D1
Authority
DE
Germany
Prior art keywords
disk holder
tension forces
electrostatic disk
monitoring tension
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032277T
Other languages
English (en)
Inventor
Karl P Leeser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE60032277D1 publication Critical patent/DE60032277D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
DE60032277T 1999-04-19 2000-04-19 Verfahren und Apparat zur Überwachung von Spannkräften in einem elektrostatischen Scheibenhalter Expired - Lifetime DE60032277D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/294,260 US6430022B2 (en) 1999-04-19 1999-04-19 Method and apparatus for controlling chucking force in an electrostatic

Publications (1)

Publication Number Publication Date
DE60032277D1 true DE60032277D1 (de) 2007-01-25

Family

ID=23132609

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60032277T Expired - Lifetime DE60032277D1 (de) 1999-04-19 2000-04-19 Verfahren und Apparat zur Überwachung von Spannkräften in einem elektrostatischen Scheibenhalter

Country Status (3)

Country Link
US (1) US6430022B2 (de)
EP (1) EP1047126B1 (de)
DE (1) DE60032277D1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US7049585B2 (en) 2000-07-27 2006-05-23 Ebara Corporation Sheet beam-type testing apparatus
US6853953B2 (en) * 2001-08-07 2005-02-08 Tokyo Electron Limited Method for characterizing the performance of an electrostatic chuck
JP2003110012A (ja) * 2001-09-28 2003-04-11 Nissin Electric Co Ltd 基板保持方法およびその装置
JP4323232B2 (ja) * 2002-12-04 2009-09-02 芝浦メカトロニクス株式会社 静電吸着方法、静電吸着装置及び貼り合せ装置
TWI304158B (en) * 2003-01-15 2008-12-11 Asml Netherlands Bv Detection assembly and lithographic projection apparatus provided with such a detection assembly
EP1500984B1 (de) * 2003-07-23 2014-02-26 ASML Netherlands B.V. Artikelhalter für einen lithographischen Apparat
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005353988A (ja) * 2004-06-14 2005-12-22 Canon Inc 板状体搬送方法、搬送装置及び露光装置
US7244311B2 (en) * 2004-10-13 2007-07-17 Lam Research Corporation Heat transfer system for improved semiconductor processing uniformity
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor
JP5044395B2 (ja) * 2005-05-20 2012-10-10 筑波精工株式会社 静電保持装置及びそれを用いた静電ピンセット
US7869184B2 (en) * 2005-11-30 2011-01-11 Lam Research Corporation Method of determining a target mesa configuration of an electrostatic chuck
CN100362644C (zh) * 2005-12-07 2008-01-16 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘
US8149562B2 (en) * 2007-03-09 2012-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. System for decharging a wafer or substrate after dechucking from an electrostatic chuck
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
US8143904B2 (en) 2008-10-10 2012-03-27 Lam Research Corporation System and method for testing an electrostatic chuck
US8879233B2 (en) 2009-05-15 2014-11-04 Entegris, Inc. Electrostatic chuck with polymer protrusions
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
JP5459907B2 (ja) * 2010-01-27 2014-04-02 東京エレクトロン株式会社 基板載置装置の評価装置、及びその評価方法、並びにそれに用いる評価用基板
CN102986017B (zh) 2010-05-28 2015-09-16 恩特格林斯公司 高表面电阻率静电吸盘
US8581217B2 (en) 2010-10-08 2013-11-12 Advanced Ion Beam Technology, Inc. Method for monitoring ion implantation
US20120281333A1 (en) * 2011-05-06 2012-11-08 Advanced Ion Beam Technology, Inc. Temperature-controllable electrostatic chuck
JP6219251B2 (ja) * 2014-09-17 2017-10-25 東芝メモリ株式会社 半導体製造装置
DE102016001865A1 (de) 2016-02-17 2017-08-17 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Detektionsschaltung, elektrostatische Halteeinrichtung und Verfahren zur Erfassung eines Bauteils an einer elektrostatischen Halteeinrichtung
US11114327B2 (en) 2017-08-29 2021-09-07 Applied Materials, Inc. ESC substrate support with chucking force control
JP7450366B2 (ja) * 2019-11-11 2024-03-15 キヤノントッキ株式会社 基板保持装置、基板処理装置、基板保持方法、反転方法、成膜方法、電子デバイスの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
US5325261A (en) 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5436790A (en) * 1993-01-15 1995-07-25 Eaton Corporation Wafer sensing and clamping monitor
US5557215A (en) * 1993-05-12 1996-09-17 Tokyo Electron Limited Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus
US5453703A (en) * 1993-11-29 1995-09-26 Semitest Inc. Method for determining the minority carrier surface recombination lifetime constant (ts of a specimen of semiconductor material
US5670066A (en) * 1995-03-17 1997-09-23 Lam Research Corporation Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated
US6198616B1 (en) * 1998-04-03 2001-03-06 Applied Materials, Inc. Method and apparatus for supplying a chucking voltage to an electrostatic chuck within a semiconductor wafer processing system
WO1999060613A2 (en) * 1998-05-21 1999-11-25 Applied Materials, Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system

Also Published As

Publication number Publication date
EP1047126B1 (de) 2006-12-13
EP1047126A2 (de) 2000-10-25
US20020008954A1 (en) 2002-01-24
EP1047126A3 (de) 2004-01-21
US6430022B2 (en) 2002-08-06

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Legal Events

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