DE60029483D1 - Nicht-invasive elektrische messung von halbleiterscheiben - Google Patents

Nicht-invasive elektrische messung von halbleiterscheiben

Info

Publication number
DE60029483D1
DE60029483D1 DE60029483T DE60029483T DE60029483D1 DE 60029483 D1 DE60029483 D1 DE 60029483D1 DE 60029483 T DE60029483 T DE 60029483T DE 60029483 T DE60029483 T DE 60029483T DE 60029483 D1 DE60029483 D1 DE 60029483D1
Authority
DE
Germany
Prior art keywords
semiconductor wafer
front surface
semiconducting material
electrical
electric measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60029483T
Other languages
English (en)
Other versions
DE60029483T2 (de
Inventor
G Mazur
J Hillard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solid State Measurements Inc
Original Assignee
Solid State Measurements Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solid State Measurements Inc filed Critical Solid State Measurements Inc
Publication of DE60029483D1 publication Critical patent/DE60029483D1/de
Application granted granted Critical
Publication of DE60029483T2 publication Critical patent/DE60029483T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
DE60029483T 1999-10-19 2000-10-19 Nicht-invasive elektrische messung von halbleiterscheiben Expired - Lifetime DE60029483T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15822299P 1999-10-19 1999-10-19
US158222P 1999-10-19
PCT/US2000/041315 WO2001029568A1 (en) 1999-10-19 2000-10-19 Non-invasive electrical measurement of semiconductor wafers

Publications (2)

Publication Number Publication Date
DE60029483D1 true DE60029483D1 (de) 2006-08-31
DE60029483T2 DE60029483T2 (de) 2007-02-15

Family

ID=22567165

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60029483T Expired - Lifetime DE60029483T2 (de) 1999-10-19 2000-10-19 Nicht-invasive elektrische messung von halbleiterscheiben

Country Status (7)

Country Link
US (1) US6492827B1 (de)
EP (1) EP1256006B1 (de)
JP (1) JP4102068B2 (de)
AT (1) ATE333652T1 (de)
AU (1) AU2117101A (de)
DE (1) DE60029483T2 (de)
WO (1) WO2001029568A1 (de)

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JP3279294B2 (ja) * 1998-08-31 2002-04-30 三菱電機株式会社 半導体装置のテスト方法、半導体装置のテスト用プローブ針とその製造方法およびそのプローブ針を備えたプローブカード
US7182672B2 (en) * 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
US6842029B2 (en) * 2002-04-11 2005-01-11 Solid State Measurements, Inc. Non-invasive electrical measurement of semiconductor wafers
US6632691B1 (en) * 2002-04-11 2003-10-14 Solid State Measurements, Inc. Apparatus and method for determining doping concentration of a semiconductor wafer
US6894519B2 (en) * 2002-04-11 2005-05-17 Solid State Measurements, Inc. Apparatus and method for determining electrical properties of a semiconductor wafer
US6856145B2 (en) * 2002-06-04 2005-02-15 The Ohio State University Direct, low frequency capacitance measurement for scanning capacitance microscopy
US7012438B1 (en) 2002-07-10 2006-03-14 Kla-Tencor Technologies Corp. Methods and systems for determining a property of an insulating film
US6612161B1 (en) * 2002-07-23 2003-09-02 Fidelica Microsystems, Inc. Atomic force microscopy measurements of contact resistance and current-dependent stiction
US7248062B1 (en) 2002-11-04 2007-07-24 Kla-Tencor Technologies Corp. Contactless charge measurement of product wafers and control of corona generation and deposition
US6957154B2 (en) * 2003-02-03 2005-10-18 Qcept Technologies, Inc. Semiconductor wafer inspection system
US6972582B2 (en) * 2003-02-10 2005-12-06 Solid State Measurements, Inc. Apparatus and method for measuring semiconductor wafer electrical properties
JP4387125B2 (ja) * 2003-06-09 2009-12-16 東京エレクトロン株式会社 検査方法及び検査装置
US6900652B2 (en) * 2003-06-13 2005-05-31 Solid State Measurements, Inc. Flexible membrane probe and method of use thereof
US6879176B1 (en) * 2003-11-04 2005-04-12 Solid State Measurements, Inc. Conductance-voltage (GV) based method for determining leakage current in dielectrics
US20050225345A1 (en) * 2004-04-08 2005-10-13 Solid State Measurements, Inc. Method of testing semiconductor wafers with non-penetrating probes
US7023231B2 (en) * 2004-05-14 2006-04-04 Solid State Measurements, Inc. Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
US7633305B2 (en) * 2004-09-13 2009-12-15 Shin-Etsu Handotai Co., Ltd. Method for evaluating semiconductor wafer and apparatus for evaluating semiconductor wafer
US7304490B2 (en) * 2004-11-05 2007-12-04 Solid State Measurements, Inc. In-situ wafer and probe desorption using closed loop heating
US7001785B1 (en) 2004-12-06 2006-02-21 Veeco Instruments, Inc. Capacitance probe for thin dielectric film characterization
US20060139041A1 (en) * 2004-12-23 2006-06-29 Nystrom Michael J System and method of testing and utilizing a fluid stream
JP2006194699A (ja) * 2005-01-12 2006-07-27 Tokyo Cathode Laboratory Co Ltd プロービング装置
US7282941B2 (en) * 2005-04-05 2007-10-16 Solid State Measurements, Inc. Method of measuring semiconductor wafers with an oxide enhanced probe
US7893703B2 (en) 2005-08-19 2011-02-22 Kla-Tencor Technologies Corp. Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer
JP4973133B2 (ja) * 2005-11-10 2012-07-11 株式会社Ｓｕｍｃｏ エピタキシャル層の前処理方法およびエピタキシャル層の評価方法並びにエピタキシャル層の評価装置
KR100707585B1 (ko) * 2005-12-29 2007-04-13 동부일렉트로닉스 주식회사 Ｍｏｓ 트랜지스터 소자의 정전용량-전압 특성을 이용한캐리어 농도 분포 측정 자동화 시스템 및 방법
US7679381B2 (en) * 2006-01-23 2010-03-16 Maxmile Technologies, Llc Method and apparatus for nondestructively evaluating light-emitting materials
US20070170934A1 (en) * 2006-01-23 2007-07-26 Maxmile Technologies, Llc Method and Apparatus for Nondestructive Evaluation of Semiconductor Wafers
US20070249073A1 (en) * 2006-04-20 2007-10-25 Solid State Measurement, Inc. Method for determining the electrically active dopant density profile in ultra-shallow junction (USJ) structures
US20100148813A1 (en) * 2006-07-18 2010-06-17 Multiprobe, Inc. Apparatus and method for combined micro-scale and nano-scale c-v, q-v, and i-v testing of semiconductor materials
US20080290889A1 (en) * 2007-05-24 2008-11-27 Solid State Measurements, Inc. Method of destructive testing the dielectric layer of a semiconductor wafer or sample
TWI398650B (zh) * 2009-04-20 2013-06-11 Chroma Ate Inc 用以控制點測機之檢測電流導通的裝置及方法
ES2364063B2 (es) * 2011-02-22 2013-01-29 Universidad Politécnica de Madrid Banco de pruebas para caracterizar la respuesta de materiales y dispositivos utilizados como sensores, transductores o como generadores de energía en aplicaciones de tráfico vial.
US10879094B2 (en) * 2016-11-23 2020-12-29 Applied Materials, Inc. Electrostatic chucking force measurement tool for process chamber carriers

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Publication number Priority date Publication date Assignee Title
BE759342A (fr) 1969-11-24 1971-05-24 Westinghouse Electric Corp Appareil et methode pour la determination automatique de la resistance d'etalement, la resistivite et la concentration d'impuretes dans des corps semi-conducteurs
US3995216A (en) 1975-04-28 1976-11-30 International Business Machines Corporation Technique for measuring surface states in metal-insulator-semiconductor structures
US4325025A (en) 1980-05-22 1982-04-13 International Business Machines Corporation Automated channel doping measuring circuit
US5023561A (en) 1990-05-04 1991-06-11 Solid State Measurements, Inc. Apparatus and method for non-invasive measurement of electrical properties of a dielectric layer in a semiconductor wafer
DE4109908C2 (de) * 1991-03-26 1994-05-05 Erich Reitinger Anordnung zur Prüfung von Halbleiter-Wafern
US5500607A (en) * 1993-12-22 1996-03-19 International Business Machines Corporation Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer
US5485097A (en) * 1994-08-08 1996-01-16 Advanced Micro Devices, Inc. Method of electrically measuring a thin oxide thickness by tunnel voltage
US5723981A (en) * 1994-08-29 1998-03-03 Imec Vzw Method for measuring the electrical potential in a semiconductor element
TW341664B (en) 1995-05-12 1998-10-01 Ibm Photovoltaic oxide charge measurement probe technique
US5872017A (en) 1997-01-24 1999-02-16 Seh America, Inc. In-situ epitaxial passivation for resistivity measurement
DE69837690T2 (de) * 1997-07-24 2007-12-27 Mitsubishi Denki K.K. Gerät zur Entfernung von an einer Prüfspitzenendfläche haftenden Fremdstoffen

Also Published As

Publication number Publication date
US6492827B1 (en) 2002-12-10
WO2001029568A1 (en) 2001-04-26
EP1256006A4 (de) 2005-05-11
AU2117101A (en) 2001-04-30
JP4102068B2 (ja) 2008-06-18
EP1256006B1 (de) 2006-07-19
EP1256006A1 (de) 2002-11-13
JP2003512737A (ja) 2003-04-02
ATE333652T1 (de) 2006-08-15
DE60029483T2 (de) 2007-02-15

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