DE60014549D1 - Layers or prepregs with high permeability, their production and use in printed circuit boards - Google Patents

Layers or prepregs with high permeability, their production and use in printed circuit boards

Info

Publication number
DE60014549D1
DE60014549D1 DE60014549T DE60014549T DE60014549D1 DE 60014549 D1 DE60014549 D1 DE 60014549D1 DE 60014549 T DE60014549 T DE 60014549T DE 60014549 T DE60014549 T DE 60014549T DE 60014549 D1 DE60014549 D1 DE 60014549D1
Authority
DE
Germany
Prior art keywords
prepregs
layers
production
printed circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60014549T
Other languages
German (de)
Other versions
DE60014549T2 (en
Inventor
Nobuyuki Ikeguchi
Masahiro Shimoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31324499A external-priority patent/JP2001131309A/en
Priority claimed from JP2000092815A external-priority patent/JP2001279005A/en
Priority claimed from JP2000092816A external-priority patent/JP2001279006A/en
Priority claimed from JP2000202609A external-priority patent/JP2002020510A/en
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of DE60014549D1 publication Critical patent/DE60014549D1/en
Application granted granted Critical
Publication of DE60014549T2 publication Critical patent/DE60014549T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/065—Preparatory processes
    • C08G73/0655—Preparatory processes from polycyanurates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
DE60014549T 1999-11-04 2000-11-03 High permeability layers or prepregs, their manufacture and use in printed circuit boards Expired - Fee Related DE60014549T2 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP31324499A JP2001131309A (en) 1999-11-04 1999-11-04 High-dielectric constant b-stage sheet and printed wiring board using the same
JP31324499 1999-11-04
JP2000092815A JP2001279005A (en) 2000-03-30 2000-03-30 Prepreg having high dielectric constant
JP2000092815 2000-03-30
JP2000092816A JP2001279006A (en) 2000-03-30 2000-03-30 Method for producing prepreg having high dielectric constant
JP2000092816 2000-03-30
JP2000202609 2000-07-04
JP2000202609A JP2002020510A (en) 2000-07-04 2000-07-04 High relative dielectric constant prepreg having excellent strength and printed circuit board using the same

Publications (2)

Publication Number Publication Date
DE60014549D1 true DE60014549D1 (en) 2004-11-11
DE60014549T2 DE60014549T2 (en) 2005-10-13

Family

ID=27480091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60014549T Expired - Fee Related DE60014549T2 (en) 1999-11-04 2000-11-03 High permeability layers or prepregs, their manufacture and use in printed circuit boards

Country Status (5)

Country Link
US (1) US6562179B1 (en)
EP (1) EP1097959B1 (en)
KR (1) KR100682612B1 (en)
DE (1) DE60014549T2 (en)
TW (1) TWI230718B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1251530A3 (en) * 2001-04-16 2004-12-29 Shipley Company LLC Dielectric laminate for a capacitor
JP4006618B2 (en) * 2001-09-26 2007-11-14 日鉱金属株式会社 Manufacturing method of copper foil with carrier and printed board using copper foil with carrier
US6866919B2 (en) * 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
JP4148501B2 (en) * 2002-04-02 2008-09-10 三井金属鉱業株式会社 Dielectric filler-containing resin for forming a built-in capacitor layer of a printed wiring board, double-sided copper-clad laminate having a dielectric layer formed using the dielectric filler-containing resin, and method for producing the double-sided copper-clad laminate
US6790305B2 (en) * 2002-10-08 2004-09-14 International Business Machines Corporation Method and structure for small pitch z-axis electrical interconnections
KR20050019214A (en) * 2003-08-18 2005-03-03 한국과학기술원 Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using the same
KR101321700B1 (en) * 2005-12-06 2013-10-25 아이솔라 유에스에이 코프 Laminates for high speed and high frequency printed circuit boards
US7658988B2 (en) * 2006-04-03 2010-02-09 E. I. Du Pont De Nemours And Company Printed circuits prepared from filled epoxy compositions
US7858172B2 (en) * 2006-05-25 2010-12-28 Mitsubishi Engineering-Plastics Corporation Fiber-reinforced thermoplastic resin molded article
US8227703B2 (en) * 2007-04-03 2012-07-24 Sumitomo Bakelite Company, Ltd. Multilayered circuit board and semiconductor device
CN101980862A (en) * 2008-03-26 2011-02-23 住友电木株式会社 Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
JP5453016B2 (en) * 2009-08-18 2014-03-26 日本碍子株式会社 Film-like electrical connection body and manufacturing method thereof
US8609558B2 (en) 2009-11-25 2013-12-17 United Technologies Corporation Tackifier composition
JP2013000995A (en) * 2011-06-17 2013-01-07 Panasonic Corp Metal-clad laminated plate and printed wiring board
JP5909808B2 (en) * 2012-01-30 2016-04-27 日立化成株式会社 Pre-preg for heat and pressure molding and laminate
CN103374217A (en) * 2012-04-24 2013-10-30 苏州汉扬精密电子有限公司 Glass fibre reinforced polyphenyl ether resin
KR101320451B1 (en) * 2013-01-30 2013-10-23 주식회사 에스아이 플렉스 The pth plating method of printed circuit boards
JP6026347B2 (en) * 2013-04-23 2016-11-16 日東電工株式会社 Photosensitive epoxy resin composition, curable film for forming optical waveguide core layer, optical waveguide using the same, mixed flexible printed wiring board for optical / electrical transmission
JP6318820B2 (en) * 2014-04-24 2018-05-09 三菱瓦斯化学株式会社 Resin composition, prepreg, resin sheet and metal foil-clad laminate
US20170226302A1 (en) * 2014-09-09 2017-08-10 Panasonic Intellectual Property Management Co., Ltd. Curable composition, prepreg, metal foil with resin, metal-clad laminate and printed wiring board
WO2017154167A1 (en) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 Multilayer laminate plate and production method for multilayered printed wiring board using same
KR102141636B1 (en) * 2016-05-09 2020-08-05 주식회사 엘지화학 Electrochromic device
WO2018033950A1 (en) * 2016-08-15 2018-02-22 日立化成株式会社 Adhesive film for multilayer printed-wiring board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352999A (en) * 1976-10-22 1978-05-13 Seiko Instr & Electronics Ltd Manufacturing method of porcelain dielectric
JPS5711026A (en) * 1980-06-24 1982-01-20 Mitsubishi Gas Chem Co Inc Manufacture of laminate
JPS61167547A (en) 1985-01-22 1986-07-29 住友ベークライト株式会社 Thermosetting resin laminated board
JPH02286723A (en) * 1989-04-28 1990-11-26 Matsushita Electric Works Ltd Laminating resin composition and laminate
JPH10158472A (en) * 1996-11-28 1998-06-16 Hitachi Chem Co Ltd Epoxy resin composition, epoxy resin varnish, epoxy resin prepreg and multilayer printed wiring board made by using this epoxy resin prepreg as prepreg for bonding
JPH11171975A (en) * 1997-12-12 1999-06-29 Taiyo Ink Mfg Ltd Thermosetting resin composition

Also Published As

Publication number Publication date
TWI230718B (en) 2005-04-11
EP1097959B1 (en) 2004-10-06
EP1097959A1 (en) 2001-05-09
KR100682612B1 (en) 2007-02-15
DE60014549T2 (en) 2005-10-13
KR20010070184A (en) 2001-07-25
US6562179B1 (en) 2003-05-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee