DE60000432T2 - Vorrichtung zur wärmeübertragung für einen laptop-rechner - Google Patents

Vorrichtung zur wärmeübertragung für einen laptop-rechner

Info

Publication number
DE60000432T2
DE60000432T2 DE60000432T DE60000432T DE60000432T2 DE 60000432 T2 DE60000432 T2 DE 60000432T2 DE 60000432 T DE60000432 T DE 60000432T DE 60000432 T DE60000432 T DE 60000432T DE 60000432 T2 DE60000432 T2 DE 60000432T2
Authority
DE
Germany
Prior art keywords
heat transfer
laptop computer
laptop
computer
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60000432T
Other languages
English (en)
Other versions
DE60000432D1 (de
Inventor
L Dilley
E Kiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AlliedSignal Inc filed Critical AlliedSignal Inc
Application granted granted Critical
Publication of DE60000432D1 publication Critical patent/DE60000432D1/de
Publication of DE60000432T2 publication Critical patent/DE60000432T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE60000432T 1999-01-19 2000-01-18 Vorrichtung zur wärmeübertragung für einen laptop-rechner Expired - Fee Related DE60000432T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/233,387 US6052280A (en) 1999-01-19 1999-01-19 Carbon/carbon heat spreader
PCT/US2000/001056 WO2000043830A1 (en) 1999-01-19 2000-01-18 Heat transfer unit for a laptop computer

Publications (2)

Publication Number Publication Date
DE60000432D1 DE60000432D1 (de) 2002-10-17
DE60000432T2 true DE60000432T2 (de) 2003-04-30

Family

ID=22877035

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60000432T Expired - Fee Related DE60000432T2 (de) 1999-01-19 2000-01-18 Vorrichtung zur wärmeübertragung für einen laptop-rechner

Country Status (6)

Country Link
US (1) US6052280A (de)
EP (1) EP1145074B1 (de)
JP (1) JP2002535718A (de)
AU (1) AU2414800A (de)
DE (1) DE60000432T2 (de)
WO (1) WO2000043830A1 (de)

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JP2000010661A (ja) * 1998-06-18 2000-01-14 Mitsubishi Electric Corp 携帯型情報処理装置および携帯型情報処理装置用カバー、卓上型情報処理装置
JP3330558B2 (ja) * 1999-02-25 2002-09-30 インターナショナル・ビジネス・マシーンズ・コーポレーション ケーブルおよび放熱装置
US6226178B1 (en) * 1999-10-12 2001-05-01 Dell Usa, L.P. Apparatus for cooling a heat generating component in a computer
JP2001119460A (ja) * 1999-10-20 2001-04-27 Fujitsu Ltd 折りたたみ型携帯電話機及びフレキシブルケーブル
US6286591B1 (en) * 1999-11-08 2001-09-11 Space Systems/Loral, Inc. Thermal harness using thermal conductive fiber and polymer matrix material
WO2001067019A1 (en) * 2000-03-08 2001-09-13 Thermal Corp. Matrix heat sink with extending fibers
US6515857B2 (en) 2001-05-15 2003-02-04 International Business Machines Corporation Visual heat sink for computers and method of use
KR100723742B1 (ko) * 2002-01-14 2007-05-30 엘지전자 주식회사 시스템내 발열을 이용한 엘시디 밝기 제어 장치 및 그 방법
US6542370B1 (en) * 2002-05-02 2003-04-01 Waffer Technology Corporation Heat dissipating device for a CPU
TWI250203B (en) * 2002-12-31 2006-03-01 Hon Hai Prec Ind Co Ltd Thermal interface material
JP2005141194A (ja) * 2003-10-14 2005-06-02 Seiko Epson Corp 補強構造体、表示装置、及び電子機器
TWI231878B (en) * 2004-04-09 2005-05-01 Au Optronics Corp Driving method for driving an OCB mode LCD device
WO2006002157A1 (en) * 2004-06-21 2006-01-05 Honeywell International Inc. Woven carbon-fiber heat spreader constructions and methods of forming heat spreader constructions
US7743763B2 (en) * 2007-07-27 2010-06-29 The Boeing Company Structurally isolated thermal interface
US8257075B2 (en) 2008-11-10 2012-09-04 Apple Inc. Carbon composite mold design
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
JP5287541B2 (ja) * 2009-06-24 2013-09-11 セイコーエプソン株式会社 電気光学装置、および電子機器
US20120033384A1 (en) * 2010-08-06 2012-02-09 Pillai Unnikrishnan G Graphite wrapped heat spreading pillow
US8675363B2 (en) * 2011-07-26 2014-03-18 Hewlett-Packard Development Company, L.P. Thermal conductors in electronic devices
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
EP3087247A1 (de) 2013-12-27 2016-11-02 Halliburton Energy Services, Inc. Verbesserung der zuverlässigkeit in einer hochtemperaturumgebung
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
US10120423B1 (en) * 2015-09-09 2018-11-06 Amazon Technologies, Inc. Unibody thermal enclosure
EP3531811A4 (de) * 2016-11-25 2019-10-30 Huawei Technologies Co., Ltd. Wärmeableitungstafel, wärmeableitungsvorrichtung und elektronische vorrichtung
US10488898B2 (en) * 2017-03-31 2019-11-26 Microsoft Technology Licensing, Llc Flexible heat spreader
CN109699151B (zh) 2017-10-20 2020-02-14 华为技术有限公司 膜状散热构件、可折弯显示装置以及终端设备
CN207939941U (zh) * 2018-03-27 2018-10-02 京东方科技集团股份有限公司 用于显示面板的散热装置和显示装置
US11206748B2 (en) * 2019-12-13 2021-12-21 Intel Corporation Flexible hinge to accommodate a flexible heat spreader

Family Cites Families (18)

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US3829556A (en) * 1972-03-24 1974-08-13 Bell Telephone Labor Inc Growth of gallium nitride crystals
JPS6050759B2 (ja) * 1982-07-14 1985-11-09 財団法人 半導体研究振興会 ＺｎＳｅのエピタキシヤル成長法及び成長装置
US4603731A (en) * 1984-11-21 1986-08-05 Ga Technologies Inc. Graphite fiber thermal radiator
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
US4987289A (en) * 1988-07-21 1991-01-22 Rockwell International Corporation Liquid crystal display heating system
US5077637A (en) * 1989-09-25 1991-12-31 The Charles Stark Draper Lab., Inc. Solid state directional thermal cable
US5255109A (en) * 1992-04-23 1993-10-19 Pc Tech Inc. Heat dissipating LCD display
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US5559614A (en) * 1995-05-01 1996-09-24 Motorola, Inc. Liquid crystal display with integral heater and method of fabricating same
US5621613A (en) * 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device
TW326087B (en) * 1995-09-29 1998-02-01 Intel Corp Cooling system for computer systems
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
US5822187A (en) * 1996-10-25 1998-10-13 Thermal Corp. Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices
US5818693A (en) * 1997-01-09 1998-10-06 Thermal Corp. Heat dissipating computer case having oriented fibers and heat pipe
US5796581A (en) * 1997-07-30 1998-08-18 International Business Machines Corporation Rotational joint for hinged heat pipe cooling of a computer
US5847925A (en) * 1997-08-12 1998-12-08 Compaq Computer Corporation System and method for transferring heat between movable portions of a computer

Also Published As

Publication number Publication date
EP1145074A1 (de) 2001-10-17
US6052280A (en) 2000-04-18
WO2000043830A1 (en) 2000-07-27
AU2414800A (en) 2000-08-07
EP1145074B1 (de) 2002-09-11
JP2002535718A (ja) 2002-10-22
DE60000432D1 (de) 2002-10-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee