DE59903492D1 - DEVICE FOR populating circuit boards - Google Patents

DEVICE FOR populating circuit boards

Info

Publication number
DE59903492D1
DE59903492D1 DE59903492T DE59903492T DE59903492D1 DE 59903492 D1 DE59903492 D1 DE 59903492D1 DE 59903492 T DE59903492 T DE 59903492T DE 59903492 T DE59903492 T DE 59903492T DE 59903492 D1 DE59903492 D1 DE 59903492D1
Authority
DE
Germany
Prior art keywords
circuit boards
populating circuit
populating
boards
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE59903492T
Other languages
German (de)
Inventor
Hans-Werner Lueckehe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens Production and Logistics Systems AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Production and Logistics Systems AG filed Critical Siemens Production and Logistics Systems AG
Application granted granted Critical
Publication of DE59903492D1 publication Critical patent/DE59903492D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE59903492T 1998-09-18 1999-08-26 DEVICE FOR populating circuit boards Expired - Fee Related DE59903492D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19842951A DE19842951C1 (en) 1998-09-18 1998-09-18 Automatic placement machine with identification device for component containers
PCT/DE1999/002676 WO2000018207A1 (en) 1998-09-18 1999-08-26 Insertion device for circuit carriers

Publications (1)

Publication Number Publication Date
DE59903492D1 true DE59903492D1 (en) 2003-01-02

Family

ID=7881508

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19842951A Expired - Fee Related DE19842951C1 (en) 1998-09-18 1998-09-18 Automatic placement machine with identification device for component containers
DE59903492T Expired - Fee Related DE59903492D1 (en) 1998-09-18 1999-08-26 DEVICE FOR populating circuit boards

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19842951A Expired - Fee Related DE19842951C1 (en) 1998-09-18 1998-09-18 Automatic placement machine with identification device for component containers

Country Status (7)

Country Link
US (1) US20010020325A1 (en)
EP (1) EP1114576B1 (en)
JP (1) JP2002525883A (en)
KR (1) KR20010075161A (en)
CN (1) CN1328764A (en)
DE (2) DE19842951C1 (en)
WO (1) WO2000018207A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19945932A1 (en) * 1999-09-24 2001-04-12 Siemens Ag Card reading arrangement for the assembly control of electronic components
KR101074253B1 (en) * 2003-08-26 2011-10-14 파나소닉 주식회사 Component Verification Method and Apparatus
JP2006202911A (en) * 2005-01-19 2006-08-03 Matsushita Electric Ind Co Ltd Apparatus for identifying holding tool, part feeding method and part mounting machine
JP2006327591A (en) * 2005-05-23 2006-12-07 Matsushita Electric Ind Co Ltd Carrier tape package for feeding electronic component
DE112006001104T5 (en) 2005-05-23 2008-05-08 Matsushita Electric Industrial Co., Ltd., Kadoma A carrier tape unit for supplying electronic components, apparatus for supplying electronic components, method for managing component information in an electronic component feeding apparatus, electronic component mounting apparatus, and method for managing component information in an electronic component mounting apparatus
JP4541237B2 (en) * 2005-06-29 2010-09-08 リンテック株式会社 Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus using the same, and semiconductor wafer processing apparatus
JP6060171B2 (en) * 2012-10-15 2017-01-11 富士機械製造株式会社 Tape feeder parts verification system
HUE054773T2 (en) * 2013-09-18 2021-09-28 Mycronic AB Method, system and device for handling pallets in a smt system
WO2019030818A1 (en) * 2017-08-08 2019-02-14 株式会社Ｆｕｊｉ Production system and production system control method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667403A (en) * 1984-05-16 1987-05-26 Siemens Aktiengesellschaft Method for manufacturing electronic card modules
JP2568623B2 (en) * 1988-04-12 1997-01-08 松下電器産業株式会社 Electronic component mounting method
EP0360985B1 (en) * 1988-06-29 1995-01-25 Matsushita Electric Industrial Co., Ltd. Electronic parts engaging apparatus
FR2661310B1 (en) * 1990-04-20 1996-08-23 Eurosoft Robotique COMPONENT LOADER FOR AN AUTOMATIC LAYING MACHINE FOR ELECTRONIC COMPONENTS AND METHOD FOR TRACKING AND IDENTIFYING SUCH A LOADER.
US5235164A (en) * 1990-09-19 1993-08-10 Matsushita Electric Industrial Co., Ltd. Parts supply device, parts supply method, parts managing system, and parts managing apparatus
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
JP3058708B2 (en) * 1991-04-09 2000-07-04 松下電器産業株式会社 Component mounting machine
JPH066084A (en) * 1992-06-19 1994-01-14 Olympus Optical Co Ltd Automatic electronic part installation equipment
JPH06302992A (en) * 1993-04-14 1994-10-28 Toshiba Corp Cartridge structure and manufacture system for components mounting machine
JP3568217B2 (en) * 1993-07-08 2004-09-22 松下電器産業株式会社 Management method of component supply device information
DE19853205A1 (en) * 1998-11-18 2000-06-15 Siemens Ag Process for controlling technical processes
DE19940584A1 (en) * 1999-08-26 2001-03-22 Siemens Ag Method and system for assembling circuit carriers arranged in an assembly unit

Also Published As

Publication number Publication date
DE19842951C1 (en) 2000-06-21
CN1328764A (en) 2001-12-26
EP1114576A1 (en) 2001-07-11
WO2000018207A1 (en) 2000-03-30
KR20010075161A (en) 2001-08-09
EP1114576B1 (en) 2002-11-20
JP2002525883A (en) 2002-08-13
US20010020325A1 (en) 2001-09-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SIEMENS AG, 80333 MUENCHEN, DE

8339 Ceased/non-payment of the annual fee