DE502004010068D1 - BRECHVORRICHTUNG FüR DAS VEREINZELN VON KERAMIKLEITERPLATTEN - Google Patents

BRECHVORRICHTUNG FüR DAS VEREINZELN VON KERAMIKLEITERPLATTEN

Info

Publication number
DE502004010068D1
DE502004010068D1 DE502004010068T DE502004010068T DE502004010068D1 DE 502004010068 D1 DE502004010068 D1 DE 502004010068D1 DE 502004010068 T DE502004010068 T DE 502004010068T DE 502004010068 T DE502004010068 T DE 502004010068T DE 502004010068 D1 DE502004010068 D1 DE 502004010068D1
Authority
DE
Germany
Prior art keywords
assembly
breaking device
ceramic pcb
pcb
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE502004010068T
Other languages
English (en)
Inventor
Josef Konrad
Gerhard Kredler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baumann GmbH
Original Assignee
Baumann GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baumann GmbH filed Critical Baumann GmbH
Priority claimed from PCT/EP2004/002677 external-priority patent/WO2004082911A1/de
Publication of DE502004010068D1 publication Critical patent/DE502004010068D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
DE502004010068T 2003-03-17 2004-03-15 BRECHVORRICHTUNG FüR DAS VEREINZELN VON KERAMIKLEITERPLATTEN Expired - Lifetime DE502004010068D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10311692 2003-03-17
DE10314179A DE10314179A1 (de) 2003-03-17 2003-03-28 Brechvorrichtung für das Vereinzeln von Keramikleiterplatten
PCT/EP2004/002677 WO2004082911A1 (de) 2003-03-17 2004-03-15 Brechvorrichtung für das vereinzeln von keramikleiterplatten

Publications (1)

Publication Number Publication Date
DE502004010068D1 true DE502004010068D1 (de) 2009-10-29

Family

ID=32945928

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10314179A Ceased DE10314179A1 (de) 2003-03-17 2003-03-28 Brechvorrichtung für das Vereinzeln von Keramikleiterplatten
DE502004010068T Expired - Lifetime DE502004010068D1 (de) 2003-03-17 2004-03-15 BRECHVORRICHTUNG FüR DAS VEREINZELN VON KERAMIKLEITERPLATTEN

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10314179A Ceased DE10314179A1 (de) 2003-03-17 2003-03-28 Brechvorrichtung für das Vereinzeln von Keramikleiterplatten

Country Status (2)

Country Link
AT (1) ATE442946T1 (de)
DE (2) DE10314179A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004040671B4 (de) * 2004-08-20 2006-05-11 Sieghard Schiller Gmbh & Co. Kg Verfahren und Vorrichtung zum Brechen eines dünnen, plattenförmigen Gegenstands
DE102005023238B3 (de) * 2005-05-20 2006-06-22 Sieghard Schiller Gmbh & Co. Kg Vorrichtung zum Brechen eines dünnen, plattenförmigen Gegenstands
DE102006015142B4 (de) * 2006-03-31 2014-02-20 Asys Automatisierungssysteme Gmbh Vorrichtung zum Brechen von Halbleiterscheiben
CN107696135A (zh) * 2017-10-25 2018-02-16 上海御渡半导体科技有限公司 一种集成电路板的红外超声波切割机构及其使用方法
CN108704959B (zh) * 2018-06-05 2023-12-15 江苏杰士德精密工业有限公司 用以对fpc板进行折弯的半自动折弯设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2132937B (en) * 1982-12-31 1986-04-03 Leslie Albert Whalley Tile holder for tile trimming
IT1218088B (it) * 1988-06-16 1990-04-12 Aisa Spa Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
DE29919961U1 (de) * 1999-11-15 2000-03-23 Baumann Gmbh Vorrichtung zum Vereinzeln von elektrischen oder elektronischen Substraten aus eine Vielzahl solcher Substrate aufweisenden Mehrfachsubstraten
DE10007642C2 (de) * 2000-02-19 2002-03-14 Bosch Gmbh Robert Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen

Also Published As

Publication number Publication date
DE10314179A1 (de) 2004-10-07
ATE442946T1 (de) 2009-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition