DE502004007661D1 - A method of making chillers or cooler elements consisting of plate stacks, with joining means on internal surfaces of the plate apertures or apertures - Google Patents

A method of making chillers or cooler elements consisting of plate stacks, with joining means on internal surfaces of the plate apertures or apertures

Info

Publication number
DE502004007661D1
DE502004007661D1 DE502004007661T DE502004007661T DE502004007661D1 DE 502004007661 D1 DE502004007661 D1 DE 502004007661D1 DE 502004007661 T DE502004007661 T DE 502004007661T DE 502004007661 T DE502004007661 T DE 502004007661T DE 502004007661 D1 DE502004007661 D1 DE 502004007661D1
Authority
DE
Germany
Prior art keywords
apertures
plate
chillers
making
internal surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004007661T
Other languages
German (de)
Inventor
Juergen Dr.-Ing. Schulz-Harder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovac AG
Original Assignee
Electrovac AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovac AG filed Critical Electrovac AG
Publication of DE502004007661D1 publication Critical patent/DE502004007661D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE502004007661T 2004-01-12 2004-12-21 A method of making chillers or cooler elements consisting of plate stacks, with joining means on internal surfaces of the plate apertures or apertures Active DE502004007661D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004001772 2004-01-12
DE102004002494 2004-01-17
DE102004002841A DE102004002841B3 (en) 2004-01-12 2004-01-19 Process for production of plate-like stack elements, especially of coolers, cooler elements or heat sinks made from such elements useful for cooling high power electrical components or modules

Publications (1)

Publication Number Publication Date
DE502004007661D1 true DE502004007661D1 (en) 2008-09-04

Family

ID=34424592

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102004002841A Expired - Lifetime DE102004002841B3 (en) 2004-01-12 2004-01-19 Process for production of plate-like stack elements, especially of coolers, cooler elements or heat sinks made from such elements useful for cooling high power electrical components or modules
DE502004007661T Active DE502004007661D1 (en) 2004-01-12 2004-12-21 A method of making chillers or cooler elements consisting of plate stacks, with joining means on internal surfaces of the plate apertures or apertures

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102004002841A Expired - Lifetime DE102004002841B3 (en) 2004-01-12 2004-01-19 Process for production of plate-like stack elements, especially of coolers, cooler elements or heat sinks made from such elements useful for cooling high power electrical components or modules

Country Status (3)

Country Link
JP (1) JP2009065206A (en)
DE (2) DE102004002841B3 (en)
HK (1) HK1079036A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2091684A1 (en) 2006-11-07 2009-08-26 Perkinelmer Optoelectronics GmbH & Co. Kg Method for bonding metal surfaces by applying a first oxidised metal layer and a second oxidised metal layer object having cavities or structure of a light emitting diode produced through the last method
WO2008128949A2 (en) 2007-04-24 2008-10-30 Ceramtec Ag Method for producing a composite including at least one non-flat component
JP5307702B2 (en) * 2009-12-21 2013-10-02 浜松ホトニクス株式会社 heatsink
DE102020104493B4 (en) 2020-02-20 2022-08-04 Rogers Germany Gmbh Method for manufacturing a cooling element and cooling element manufactured with such a method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630323C1 (en) * 1986-09-05 1987-09-03 Kernforschungsanlage Juelich Gmbh, 5170 Juelich, De
JPH11325763A (en) * 1998-05-18 1999-11-26 Matsushita Electric Ind Co Ltd Lamination type heat-exchanger and manufacture thereof
JP2003100970A (en) * 2001-09-20 2003-04-04 Ntt Advanced Technology Corp Composite heat radiation member

Also Published As

Publication number Publication date
DE102004002841B3 (en) 2005-05-04
JP2009065206A (en) 2009-03-26
HK1079036A1 (en) 2006-03-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition