DE502004000318D1 - Scheibengalvanisiervorrichtung - Google Patents

Scheibengalvanisiervorrichtung

Info

Publication number
DE502004000318D1
DE502004000318D1 DE502004000318T DE502004000318T DE502004000318D1 DE 502004000318 D1 DE502004000318 D1 DE 502004000318D1 DE 502004000318 T DE502004000318 T DE 502004000318T DE 502004000318 T DE502004000318 T DE 502004000318T DE 502004000318 D1 DE502004000318 D1 DE 502004000318D1
Authority
DE
Germany
Prior art keywords
sealing ring
scheibengalvanisiervorrichtung
siphon
metallized
sic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502004000318T
Other languages
German (de)
Inventor
Juergen Gutekunst
Vasile-Adrian Bojan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rena Sondermaschinen GmbH
Original Assignee
Rena Sondermaschinen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Sondermaschinen GmbH filed Critical Rena Sondermaschinen GmbH
Publication of DE502004000318D1 publication Critical patent/DE502004000318D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Abstract

Device for electroplating conductive and metallized nonconductive plates consisting of a receiver (1), a sealing ring (3), screw cap (4) for pressing on the sealing ring, an elastic element for equalizing large variations (sic) and the pressure on lower sealing ring (10), siphon (9), and O- rings (6) and (7) to prevent electrolyte flowing inwards.
DE502004000318T 2003-07-19 2004-07-16 Scheibengalvanisiervorrichtung Active DE502004000318D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10333068A DE10333068A1 (en) 2003-07-19 2003-07-19 Device including sealing rings, a screw cap, an elastic element, a siphon, and O-rings useful for electroplating conductive and metallized nonconductive plates

Publications (1)

Publication Number Publication Date
DE502004000318D1 true DE502004000318D1 (en) 2006-04-27

Family

ID=34042003

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10333068A Withdrawn DE10333068A1 (en) 2003-07-19 2003-07-19 Device including sealing rings, a screw cap, an elastic element, a siphon, and O-rings useful for electroplating conductive and metallized nonconductive plates
DE502004000318T Active DE502004000318D1 (en) 2003-07-19 2004-07-16 Scheibengalvanisiervorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10333068A Withdrawn DE10333068A1 (en) 2003-07-19 2003-07-19 Device including sealing rings, a screw cap, an elastic element, a siphon, and O-rings useful for electroplating conductive and metallized nonconductive plates

Country Status (6)

Country Link
US (1) US20050045473A1 (en)
EP (1) EP1510601B9 (en)
CN (1) CN100339511C (en)
AT (1) ATE318945T1 (en)
CA (1) CA2474830A1 (en)
DE (2) DE10333068A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130306465A1 (en) * 2012-05-17 2013-11-21 Applied Materials, Inc. Seal rings in electrochemical processors
JP6713916B2 (en) * 2016-12-01 2020-06-24 株式会社荏原製作所 Substrate holder, plating apparatus, and substrate holder manufacturing method
CN109158713A (en) * 2018-09-27 2019-01-08 格林美（武汉）城市矿产循环产业园开发有限公司 A kind of micro- plating reparation positioning device of relay screw thread

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5405518A (en) * 1994-04-26 1995-04-11 Industrial Technology Research Institute Workpiece holder apparatus
JP3578811B2 (en) * 1994-10-12 2004-10-20 シチズン時計株式会社 Plating method of semiconductor wafer
US5578167A (en) * 1996-01-31 1996-11-26 Motorola, Inc. Substrate holder and method of use
JP3106418B2 (en) * 1996-07-30 2000-11-06 株式会社東京精密 Polishing equipment
JP3366193B2 (en) * 1996-09-10 2003-01-14 ヤマハ発動機株式会社 Sealing equipment in surface treatment equipment
US6080291A (en) * 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6248222B1 (en) * 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6228233B1 (en) * 1998-11-30 2001-05-08 Applied Materials, Inc. Inflatable compliant bladder assembly
DE19923871C2 (en) * 1999-05-25 2003-11-13 Rossendorf Forschzent Device for the sealed mounting of thin panes
US6673216B2 (en) * 1999-08-31 2004-01-06 Semitool, Inc. Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
JP2001158993A (en) * 1999-11-30 2001-06-12 Honda Motor Co Ltd Plating apparatus of cylindrical member
JP2001260065A (en) * 2000-03-17 2001-09-25 Advantest Corp Parts retainer
US6685815B2 (en) * 2002-01-14 2004-02-03 Applied Materials Inc. Electroplating of semiconductor wafers
US7147232B2 (en) * 2003-06-30 2006-12-12 Hydra-Lock Corporation Workpiece holder

Also Published As

Publication number Publication date
ATE318945T1 (en) 2006-03-15
CN1614100A (en) 2005-05-11
EP1510601B1 (en) 2006-03-01
DE10333068A1 (en) 2005-02-10
CA2474830A1 (en) 2005-01-19
US20050045473A1 (en) 2005-03-03
CN100339511C (en) 2007-09-26
EP1510601A1 (en) 2005-03-02
EP1510601B9 (en) 2006-11-15

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