DE4441436A1 - Carrier substrate for electronic components or circuits e.g. for motor vehicles electronic equipment - Google Patents

Carrier substrate for electronic components or circuits e.g. for motor vehicles electronic equipment

Info

Publication number
DE4441436A1
DE4441436A1 DE19944441436 DE4441436A DE4441436A1 DE 4441436 A1 DE4441436 A1 DE 4441436A1 DE 19944441436 DE19944441436 DE 19944441436 DE 4441436 A DE4441436 A DE 4441436A DE 4441436 A1 DE4441436 A1 DE 4441436A1
Authority
DE
Germany
Prior art keywords
carrier substrate
base material
substrate according
circuits
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19944441436
Other languages
German (de)
Inventor
Frank Hoppert
Guido Bachmann
Michael Zimmermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mannesmann VDO AG
Original Assignee
Mannesmann VDO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann VDO AG filed Critical Mannesmann VDO AG
Priority to DE19944441436 priority Critical patent/DE4441436A1/en
Publication of DE4441436A1 publication Critical patent/DE4441436A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core

Abstract

A carrier substrate for electronic components or circuits consisting of at least one base material is designed to provide reliable electromagnetic suppression for the electronic components or circuits arranged on a carrier substrate, and now the base material, and/or a substance binding the base material, contains inclusions of a material which absorbs electromagnetic interference radiation. The absorbing material is specifically a ferrite and the base material is laminated or resin-bonded paper.

Description

Die Erfindung betrifft ein Trägersubstrat für elektronische Bauelemente oder Schal­ tungen, insbesondere für elektronische Geräte in Kraftfahrzeugen, welches aus mindestens einem Basismaterial besteht.The invention relates to a carrier substrate for electronic components or scarf tion, in particular for electronic devices in motor vehicles, which there is at least one base material.

Es ist bekannt, daß bei der Verwendung von Mikroprozessoren oder hochintegrier­ ten, anwendungsspezifischen Schaltkreisen Störstrahlungen entstehen, die den Betrieb anderer elektronischer Systeme beeinflussen oder den Rundfunkempfang oder den Funkverkehr erschweren. Gleichzeitig sind die vom Mikroprozessor bzw. den hochintegrierten Schaltkreisen erzeugten Impulsfolgen aber auch empfindlich gegen Störungen von außen. Solche Störungen können aus anderen elektronischen Systemen, z. B. der Hochspannungszündanlage in Kraftfahrzeugen oder von star­ ken Rundfunk- oder Fernsehsendern im Nahbereich herrühren.It is known that when using microprocessors or highly integrated Application-specific circuits produce interference radiation that Operation of other electronic systems or affect radio reception or complicate radio communication. At the same time, the microprocessor or the highly integrated circuits also produce sensitive pulse trains against external interference. Such interference can come from other electronic Systems, e.g. B. the high-voltage ignition system in motor vehicles or star ken radio or television stations come from close range.

Üblicherweise werden solche elektronischen Bauelemente oder Schaltungen, die auf einem Trägersubstrat, beispielsweise einer Leiterplatte angeordnet sind, mittels Abschirmgehäusen gegen solche Störeinflüsse geschützt.Such electronic components or circuits are usually used are arranged on a carrier substrate, for example a printed circuit board, protected against such interference by means of shielding housings.

Gemäß bekannten Anordnungen (DE 35 20 531 A1) werden auf die Leiterplatte aufsetzbare Zusatzelemente zur Bildung individueller Abschirmkammern aufge­ setzt. According to known arrangements (DE 35 20 531 A1) are on the circuit board attachable additional elements to form individual shielding chambers puts.  

Nachteilig bei diesen Anordnungen ist die zeit- und kostenaufwendige individuelle Montage der einzelnen Abschirmungen sowie der zusätzliche Platzbedarf auf der Leiterplatte.A disadvantage of these arrangements is the time-consuming and costly individual Installation of the individual shields and the additional space required on the Circuit board.

Der Erfindung liegt somit die Aufgabe zugrunde, eine zuverlässige elektromagne­ tische Entstörung für elektronische Baugruppen oder Schaltungen, die auf einem Trägersubstrat angeordnet sind, anzugeben, welche einfach und kostengünstig herstellbar ist.The invention is therefore based on the object of a reliable electromagnetic Interference suppression for electronic assemblies or circuits based on one Carrier substrate are arranged to indicate which is simple and inexpensive can be produced.

Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß das Basismaterial und/oder ein das Basismaterial verbindender Stoff Einlagerungen von einem Material enthält, welches die elektromagnetische Störstrahlung absorbiert.According to the invention the object is achieved in that the base material and / or a substance connecting the base material contains deposits of a material, which absorbs the electromagnetic interference radiation.

Der Vorteil der Erfindung besteht darin, daß sowohl die elektromagnetische Störabstrahlung der auf dem Trägersubstrat befindlichen leitenden Verbindungen vermindert als auch deren elektromagnetische Einstrahlfestigkeit erhöht wird, da ein Teil der hochfrequenten elektromagnetischen Störenergie in Verluste durch Bewegung träger elektrisch polarisierter Partikel bzw. von Partikeln mit magneti­ schem Moment umgesetzt wird. Auch Materialien, welche unter Einwirkung eines elektromagnetischen Feldes Wirbelstromverluste aufweisen, sind zur Entstörung geeignet. Auf zusätzliche Abschirmmaßnahmen kann weitgehend verzichtet wer­ den.The advantage of the invention is that both the electromagnetic Interference radiation of the conductive connections located on the carrier substrate is reduced as well as their electromagnetic radiation resistance is increased because some of the high frequency electromagnetic interference energy is lost through Movement of inert electrically polarized particles or of particles with magneti moment is implemented. Even materials that are influenced by a electromagnetic field eddy current losses are to be suppressed suitable. Additional shielding measures can largely be dispensed with the.

Vorzugsweise besteht das absorbierende Material aus Ferriten oder Dielektrika aus polarisierten Partikeln.The absorbent material preferably consists of ferrites or dielectrics polarized particles.

Die Einlagerung des die elektromagnetische Störstrahlung absorbierenden Materials erfolgt während des Herstellungsprozesses des Trägersubstrates und ist somit kostengünstig zu realisieren.The storage of the material absorbing the electromagnetic interference radiation takes place during the manufacturing process of the carrier substrate and is thus to implement inexpensively.

Ein so hergestelltes Trägersubstrat ist zur Entstörung von Frequenzbereichen von ca. 1 MHz bis 10 GHz vorteilhaft einsetzbar.A carrier substrate produced in this way is used to suppress frequency ranges from 1 MHz to 10 GHz can be used advantageously.

Weitere Ausgestaltungen des Trägersubstrats sind in den Unteransprüchen ge­ kennzeichnet. Further configurations of the carrier substrate are ge in the subclaims indicates.  

Die Erfindung läßt zahlreiche Ausführungsbeispiele zu. Eines davon soll am Beispiel des Einsatzes in Kombinationsinstrumenten für Kraftfahrzeuge näher erläutert wer­ den. In solchen Kombinationsinstrumenten für Kraftfahrzeuge, die zur Bestimmung und Anzeige von Betriebsparametern dienen, finden hochempfindliche Präzisions­ bauelemente, z. B. Mikroprozessoren Anwendung, deren Arbeitsweise durch elek­ tromagnetische Störstrahlung negativ beeinflußt wird. Diese Präzisionsbauele­ mente sind aber auch selbst Quelle von Störabstrahlungen. Diese Bauelemente sind als diskrete Bauelemente, als Dickschichthybridschaltungen oder direkt als Halbleiterchip bzw. Multichipmodule auf einem Trägersubstrat in Form einer Leiter­ platte angeordnet und über die auf der Leiterplatte vorhandenen Leitbahnen, vor­ zugsweise Kupferleitbahnen, mit elektrischen Potentialen bzw. anderen elektri­ schen Schaltungen verbunden.The invention allows numerous exemplary embodiments. One of these should be based on the example the use in combination instruments for motor vehicles explained in more detail the. In such combination instruments for motor vehicles, for determination and display of operating parameters, find highly sensitive precision components, e.g. B. microprocessors application, the operation of which by elek tromagnetic interference is negatively affected. These precision components However, elements are themselves a source of interference radiation. These components are as discrete components, as thick-film hybrid circuits or directly as Semiconductor chip or multichip modules on a carrier substrate in the form of a conductor plate arranged and on the existing on the printed circuit board, before preferably copper interconnects, with electrical potentials or other electri connected circuits.

Die Leiterplatte besteht aus einer Keramikverbindung, welche als Einlagerungen Ferrite aufweist. Die Ferrite enthalten elektrisch geladene Partikel mit einem Spin, wodurch diese Partikel ein magnetisches Moment erhalten. Sie richten sich beim Auftreten von elektromagnetischer Strahlung entsprechend der Feldrichtung aus. Dabei wird Energie umgesetzt, was eine Dämpfung der elektromagnetischen Stör­ strahlung nach sich zieht.The circuit board consists of a ceramic connection, which is used as an insert Has ferrites. The ferrites contain electrically charged particles with a spin, which gives these particles a magnetic moment. You align yourself with Occurrence of electromagnetic radiation according to the field direction. This converts energy, which dampens electromagnetic interference radiation.

Alternativ können die Einlagerungen Dielektrika elektrisch polarisierter Partikel sein.Alternatively, the inclusions of dielectrics of electrically polarized particles his.

Besteht die Leiterplatte aus Hartpapier oder Glas als Basismaterial, werden die Fer­ rite bzw. Dielektrika den jeweils verwendeten Bindemitteln, z. B. Epoxydharz oder Phenolharz beigemischt.If the circuit board consists of hard paper or glass as the base material, the Fer rite or dielectrics the binders used, z. B. epoxy or Phenolic resin added.

Die Ferrite bzw. Dielektrika können aber auch direkt den Substraten von Dick­ schichthybridschaltungen, Multichipmodulen und Halbleiterchips zugegeben wer­ den.The ferrites or dielectrics can also be used directly on Dick's substrates Layer hybrid circuits, multichip modules and semiconductor chips are added the.

Claims (10)

1. Trägersubstrat für elektronische Bauelemente oder Schaltungen, insbeson­ dere für elektronische Geräte in Kraftfahrzeugen, welches aus mindestens einem Basismaterial besteht, dadurch gekennzeichnet, daß das Basismate­ rial und/oder ein das Basismaterial verbindender Stoff Einlagerungen von einem Material enthält, welches die elektromagnetische Störstrahlung absorbiert.1. carrier substrate for electronic components or circuits, in particular for electronic devices in motor vehicles, which consists of at least one base material, characterized in that the base material rial and / or a material connecting the base material contains deposits of a material which absorbs the electromagnetic interference radiation . 2. Trägersubstrat nach Anspruch 1, dadurch gekennzeichnet, daß das die elektromagnetische Strahlung absorbierende Material ein Dielektrikum elek­ trisch polarierter Partikel ist.2. Carrier substrate according to claim 1, characterized in that the electromagnetic radiation absorbing material a dielectric elek is polarized particles. 3. Trägersubstrat nach Anspruch 1, dadurch gekennzeichnet, daß das die elektromagnetische Strahlung absorbierende Material Ferrite sind.3. carrier substrate according to claim 1, characterized in that the electromagnetic radiation absorbing material are ferrites. 4. Trägersubstrat nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß das Basismaterial Hartpapier ist.4. Carrier substrate according to one of claims 1 to 3, characterized in that the base material is hard paper. 5. Trägersubstrat nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß das Basismaterial Glas ist.5. Carrier substrate according to one of claims 1 to 3, characterized in that the base material is glass. 6. Trägersubstrat nach einem der Ansprüche 4 oder 5, dadurch gekennzeich­ net, daß das Basismaterial mit Epoxydharz als Bindemittel verbunden ist. 6. carrier substrate according to one of claims 4 or 5, characterized net that the base material is connected with epoxy resin as a binder.   7. Trägersubstrat nach einem der Ansprüche 4 oder 5, dadurch gekennzeich­ net, daß das Basismaterial mit Phenolharz als Bindemittel verbunden ist.7. carrier substrate according to one of claims 4 or 5, characterized in net that the base material is connected with phenolic resin as a binder. 8. Trägersubstrat nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß das Basismaterial aus einer Keramikverbindung besteht.8. carrier substrate according to one of claims 1 to 3, characterized in that the base material consists of a ceramic compound. 9. Trägersubstrat nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Abschirmung im Frequenzbereich von 1 MHz bis 10 GHz wirksam ist.9. Carrier substrate according to one of the preceding claims, characterized characterized in that the shielding in the frequency range from 1 MHz to 10 GHz is effective. 10. Trägersubstrat nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß das Substrat eine Leiterplatte ist und die leitende Ver­ bindung als Kupferbahnen ausgeführt sind.10. carrier substrate according to any one of the preceding claims, characterized characterized in that the substrate is a printed circuit board and the conductive Ver bond are designed as copper tracks.
DE19944441436 1994-11-23 1994-11-23 Carrier substrate for electronic components or circuits e.g. for motor vehicles electronic equipment Withdrawn DE4441436A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19944441436 DE4441436A1 (en) 1994-11-23 1994-11-23 Carrier substrate for electronic components or circuits e.g. for motor vehicles electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19944441436 DE4441436A1 (en) 1994-11-23 1994-11-23 Carrier substrate for electronic components or circuits e.g. for motor vehicles electronic equipment

Publications (1)

Publication Number Publication Date
DE4441436A1 true DE4441436A1 (en) 1996-05-30

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ID=6533790

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19944441436 Withdrawn DE4441436A1 (en) 1994-11-23 1994-11-23 Carrier substrate for electronic components or circuits e.g. for motor vehicles electronic equipment

Country Status (1)

Country Link
DE (1) DE4441436A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0878984A1 (en) * 1996-09-05 1998-11-18 Tokin Corporation Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
WO1999002373A1 (en) * 1997-07-05 1999-01-21 Robert Bosch Gmbh Electric controller, in particular for a motor vehicle
DE19729951A1 (en) * 1997-07-12 1999-02-04 Mannesmann Vdo Ag Electromagnetic compatibility circuit arrangement for electronic control apparatus
WO1999038366A1 (en) * 1998-01-22 1999-07-29 Robert Bosch Gmbh Multilayered substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0878984A1 (en) * 1996-09-05 1998-11-18 Tokin Corporation Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
EP0878984A4 (en) * 1996-09-05 2000-08-16 Tokin Corp Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg
WO1999002373A1 (en) * 1997-07-05 1999-01-21 Robert Bosch Gmbh Electric controller, in particular for a motor vehicle
DE19729951A1 (en) * 1997-07-12 1999-02-04 Mannesmann Vdo Ag Electromagnetic compatibility circuit arrangement for electronic control apparatus
DE19729951C2 (en) * 1997-07-12 2002-10-02 Siemens Ag Circuit arrangement for improving the electromagnetic compatibility of an electronic device
WO1999038366A1 (en) * 1998-01-22 1999-07-29 Robert Bosch Gmbh Multilayered substrate

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: MANNESMANN VDO AG, 60326 FRANKFURT, DE

8139 Disposal/non-payment of the annual fee