DE2503717C3 - Damping device for disruptive vibration signals in the supply lines of circuits - Google Patents

Description

connected with each other. The supply lines apply certain DC voltage levels to the electronic components in the circuits, and they carry switchable DC currents of various strengths from a few milliamperes to a few amperes. In some circuit cards, the various conductor tracks are arranged on their surfaces. In order to achieve a decoupling between the supply and signal lines, the supply lines are located on one side and the signal lines on the other side of the surface of the circuit boards.

By striving to produce even more economical, faster, To produce smaller and cheaper devices, the packing density of the chips and modules was increased increases the number of circuit boards, which also means that more lines can be accommodated on one circuit board are. With this more compact design, the various lines are except on the two surfaces a circuit board formed from several layers also between the insulating layers of the Circuit card housed. Such multilayer circuit cards can also be electrically conductive Contain intermediate layers that are used for stress distribution, as a general ground or as a shield serve. Such complex circuit arrangements are, however, much more expensive than circuit cards where the lines are only arranged on their surfaces.

In the case of multilayer circuit cards, which allow a greater packing density, exist in comparison to the simple circuit cards still the differences that the capacitance between the signal conductors and ground is relatively greater that the supply lines have a relatively low impedance, which is also referred to as impedance, and that the line attenuation is low. For example in circuit arrangements for memory contain the semiconductor elements, due to the large switching operations gradually decaying high frequency noise currents generated when a number of circuits are operating simultaneously is switched. These unwanted interference currents, which have large amplitudes at the beginning, cause interference signals in the supply lines of the circuits, which affect the operational function and thus adversely affect the safety of the circuits. The supply lines, which are mostly a low one Direct voltage and relatively large currents have a low ohmic resistance to to obtain the lowest possible voltage changes and low energy losses. It follows that these supply lines, which form high-frequency resonance systems in the circuit arrangements, have a relatively high circular quality, i.e. a low damping. With such a circuit arrangement the decoupling of the supply lines is difficult, complex and expensive. Especially for the circuits that interact with storage elements.

To reduce the interfering vibrations that occur in the switching circuits and to decouple the lines, it is common practice to use decoupling capacitors in the circuits to arrange. However, this decoupling measure is not ideal or fully satisfactory since the Capacitor connections increase the inductance of the line; moreover, it is usually not possible to use this To accommodate decoupling capacitors in the most favorable place in the circuit arrangement. This Decoupling capacitors also improve the circular quality of the resonance system formed by the line, and they only bring about a localized reduction in the interference signals, as the rest of the line still has a high reactance. In order to achieve a satisfactory attenuation of the interfering signals it is necessary to have a larger number of decoupling capacitors distributed over the length of the lines or in the circuits at certain

ίο to arrange places. This decoupling measure is complex, therefore also expensive, and requires a relatively large amount of space.

Another possibility for line decoupling or for line attenuation and interference signal reduction results from the »D. C. Power Distribution System «, which, however, shows only a partial solution to the present problem according to that described in the US patent Distribution system, the supply lines are on a ferromagnetic base plate; through this the conductivity of these conductors is inversely proportional to the frequency. Through a lossy dielectric these supply lines are separated from the ferromagnetic base plate The behavior of this Distribution system is analogous to that of a parallel resonance circuit. In this known distribution system, the ferromagnetic material The inductance of the lines increases, and due to the lossy dielectric, a Damping or loss mechanism formed. This known distribution system accordingly has one lower factor of the circular quality, because the line inductance is high and because of the lossy Dielectric a frequency-dependent loss resistance was formed. With this known distribution system a better vibration behavior is achieved, but there is a disadvantage of instability of the circuits and a poorer interaction of the circuits compared to the original distribution system. In addition, the supply voltage requires tighter tolerances because of the known Distribution system, the immunity of the circuits to external interference signals is reduced. The application this known distribution system requires great care and is therefore expensive.

US Pat. No. 3,541,473 relates to a device for suppressing electromagnetic interference in supply lines, which are used to transmit electrical energy at a mains frequency of 60 Hz serve. In these supply lines, a large impedance is sought to avoid the high-frequency To filter out interfering signals. In this line system, the conductors have a highly permeable layer surrounded, which is provided to prevent magnetic saturation with at least one gap. This line system is mainly used to suppress interference caused by the radio frequencies and it is limited to a relatively discrete range of a few 6c broadcast frequencies. The frequency spectrum of pulses, how they are used in digital circuit systems is much broader in comparison. This line system based on the US patent is in contrast to the requirements made of the 15 supply lines in the integrated circuits where a low proportion of the effective resistance is required from the impedance is to ensure the lowest possible loss of transmission of

Receive direct current.

As the techniques, systems and measures for suppressing interference signals discussed above and for decoupling supply lines in integrated circuits are too expensive and the do not fully meet modern demands, the object of the invention is a new and better one Damping device for suppressing interference signals in the supply lines of integrated To create circuits that can be mass-produced economically and that ensure operational reliability the circuits improved. The new damping device should be designed so that the lower ohmic Resistance of the supply lines for direct current transmission is maintained and that the optimum of the interference signal attenuation or suppression is preferred occurs at the resonance frequency of the supply lines.

This object is achieved according to the invention in that very closely above or below the interference suppression Supply conductor loops congruent with these a thin, electrically good conductive, non-ferromagnetic one Conductive layer is arranged.

The present invention presents a new technique for decoupling the supply lines especially for integrated circuit arrangements on circuit cards, by means of which the occurrence of Interfering vibrations or interfering signals, which are caused by switching processes, as far as possible is suppressed or attenuated without the transmission of DC power is affected. The new damping device causes the entire The impedance of the supply lines is reduced by reducing the inductance of the supply lines becomes a little smaller and its capacity increases a little.

This invention, or more specifically, the new damping device, is of various constructions to realize. For example, the electrically conductive layer made of a thin metal disc can be more specific Thickness exist on the surface of a carrier plate that has a number of integrated Circuits may contain, is arranged. Such carrier plates are also known to those skilled in the art The name "Chip" is known. Alternatively, the conductive layer in a carrier plate can also consist of a semiconductor layer exist, in which the damping loops are formed by the fact that the semiconductor layer on the surface of which are the supply lines arranged in a loop, below the to attenuating supply lines contains a high level of doping. Or instead of a metallic conductive layer a highly doped semiconductor layer is also suitable in order to achieve the desired damping effect achieve.

In the case of the three exemplary embodiments described briefly above, in each case Damping device a reduction of the factor of the circular quality for the individual loops of the supply lines, which vibration systems represent. With the new damping device, the The amplitudes of parasitic oscillations induced by the switching processes in the supply lines limited a negligible minimum value, and their oscillation time is significantly shortened, so that the residual interfering signals can no longer impair the correct function of the circuits. the

.ίο

Damping loops in the conductive layer cause energy to be withdrawn from the high-frequency interfering vibrations.

The theory and mode of operation of the new damping device according to the invention is explained in more detail below using exemplary embodiments with reference to drawings (FIGS. 1 to 7). Of the Drawings represents

1 shows a simplified view of a circuit arrangement, which contains the damping device, wherein on the top of an insulating base or Support plate, the supply lines are arranged side by side, separated by a dielectric layer the metallic conductive layer is arranged so as to cover the supply lines,

F i g. 2 the plan view of a simplified circuit arrangement which contains a line loop, by means of the measurements made on the impedance, to support the theory of the invention to be able to confirm

F i g. 3 shows a diagram, the two curves of which show the effective resistance value in ohms as a component of the Specify the impedance as a function of the frequency, which in the conductor loop according to FIG was measured;

F i g. 4 shows a diagram, the two curves of which have the inductive reactance in ohms as a component of the impedance as a function of the frequency, which in the conductor loop according to FIG was measured;

Fig. 5 is a top view of a typical DC voltage or power distribution system with supply lines, as it is used in principle in integrated circuit arrangements;

F i g. 6a, 6b and 6c are graphic illustrations of signals which are present in the supply lines of FIG Test arrangement according to FIG. 5 show interference voltage signals generated with and without a damping device if, as shown in FIG. 6a, on the Lei'erschleife a relative slow current cut-off pulse occurs;

Figures 7a, 7b, 7c and 7d are graphic illustrations those in the supply lines of the test arrangementnunj = according to FIG. 5 with and without a damping device or with a known capacitive decoupling device interference voltage signals generated when the conductor loop shows a relatively steep current cut-off pulse according to FIG. 7a occurs.

With reference to FIG. 1, it is assumed in this embodiment that in a scarf management card, which carries integrated circuits, di <supply lines through the attenuation device are to be suppressed, whereby the supply lines fell all on one surface side of the circuit board condition. The signal lines can also lie on this surface side, if this is expedient. to Achievement of the desired damping effect is al Leitschicht a thin metal disc, which example may consist of copper or aluminum, i a very small distance above the supply line these arranged overlapping. This conductive layer, also referred to as a damping disk, is not m Ground or connected to a voltage potential.

This damping washer has to fulfill a threefold function: First, it considerably reduces di Inductance values of the supply lines distributed over the base or inertia plate.

Second, it increases the effective resistance de for alternating currents, especially at high frequencies

Supply lines by taking the vibrational energy absorbs, this absorption phenomenon does not occur with direct current or direct voltage, so that no losses in the direct current energy to be transmitted occur due to this damping device.

Thirdly, it has the effect that at all points of the supply lines there is a uniform, somewhat results in higher capacity. This capacity doubles when the damping disc is connected to the Ground potential of the direct current supply source is connected.

This conductive layer, also called damping disk, does not change the inductance values and Loss of connection lines leading to the loops of the supply lines on the carrier plate or the circuit card, since the electromagnetic emanating from these connecting lines Flow is not coupled to the damping disc. The metallic damping disc can be used together with the Supply lines serve as a ground layer for the signals or the signal conductors when these signal conductors are on are arranged on the opposite surface side of the circuit board. The damping washer for the supply ladder causes a barely noticeable and negligible attenuation or change in the Signals on the signal lines, and there is practically no increase in the effective resistance in these signal lines, because the distance between the damping disk and the signal lines is due to the insulating layer in between the circuit card is relatively very large. When the supporting insulating layer of the circuit board is sufficiently thick, the capacitance of the signal lines can be kept at a fairly low value become, which is essential in the case of the circuit cards which contain a number of semiconductor elements as a memory is.

To expand the application of the damping device, it is not necessary that the Conductive layer or damping disk forms a continuous surface or that it has a uniform thickness; however, it is important that it allow dampening loops to form, and hence the loops the supply lines to be suppressed covered.

In the following, the damping device is explained by means of a theoretical consideration, which serves to to be able to determine the thickness of the conductive layer. With a simple closed loop of a utility line an apparent resistance or an impedance results

50

If the loop of the supply line is provided with the damping device, then results for this loop has an impedance

Z '= Λ

55

The above-mentioned relationships of the impedances Z and Z 'apply only at low frequencies, where the capacities of the supply managers are negligible. In this consideration, it was deemed expedient ho considers that only a single attenuation loop is assumed in the conductive layer, since the electromagnetic Coupling field in the immediate vicinity between the primary conductor loop and the secondary Attenuation loop at its greatest is this simplified arrangement of opposite one another Cable and damping loops are therefore the most essential part of a damping device for Circuits. With this simplification, the damping device becomes the structure of a transformer converted, and this results in the following relationship for the voltage or the current:

(R ₁ + sL _n ) .SL ₁₂ I ₂ sL 2 (R ₂ + sL _22] ^K > V ₂ It means:

V _{2 is} the voltage in which the shorted

Damping loop of the conductive layer,

Li2 and L22 the mutual and self-inductance of the Damping loop in the conductive layer,

/? 2 is the ohmic resistance of the

Damping loop in the conductive layer,

s is the abbreviation of j ω L.

The effective resistance in the changes due to the influence of the damping loop in the conductive layer Loop of the supply line according to the following relationship derived from Formula 1:

IR =

Rl + (

The influence of the damping loop in the conductive layer thus results in an effective resistance Ri '= Ri + AR in the loop for the supply line. The width of the attenuation loop in the conductive layer has an approximate width W _g - W + 2d, where W is the width of the loop for the supply line and d is the distance between the conductors and the conductive layer. For good electrical conductors and at a sufficiently low frequency, the result is a small R ₂ , so that the increase in the effective resistance in the loop of the supply line is calculated according to the relationship:

IR = R ₂ #.

By differentiating according to R ₂ , formula (2) shows that for /? ₂ = ωί ₂₂ the transformed resistance value for the loop of the supply line at the given angular frequency ω is a maximum. With these states, the new value of the effective resistance in ohms for the loop of the supply line is calculated according to the relationship:

j2

R '= R \ + R ₂ ^ TT ">

/ L ₂₂

if one sets for (.1

(3)

(4)

'22

From the above relationships it can be seen that the desired attenuation or interference suppression in dt Loops of the supply lines can be maintained or adjusted by two different types:

First, the frequency ί = ω / 2π can be chosen so! be that it is close to the frequency with d oscillate the interfering signals in the loop of the supply line.

Second, the resistance value R _{2 of} the damping loop in the conductive layer can be selected by a corresponding thickness of the conductive layer or the damping disk so that it satisfies the conditions of formula (4). The effective resistance R ₂ is determined by the thickness and the specific resistance value of the conductive layer and by the loop dimensions W _g , which were defined above. In the experiments to confirm the theory of the new damping device, a very thin copper sheet was used as the conductive layer.

As already mentioned, the resistor AR transformed into the loop of a supply line does not cause any loss of the direct current energy to be transmitted. This can also be seen from equation (2), if ω = 0 (direct voltage) is set, then AR = O. With direct current operation, no resistance is additionally transformed into the loop of a supply line, or in other words: Es no electrical energy is withdrawn from the supply line by the damping loop in the case of direct current operation.

In a similar way to how the transformed, additional effective resistance AR was calculated for the loop of the supply line, the change in line inductance AL can also be calculated from equation (1):

IL =

in ² Lr _n L ₂₂

ΪΓ, ... 2.2

(5)

AL is the imaginary component (reactance) of the input impedance (apparent resistance) of a loop of the supply line, which is transformed into the loop of the supply line by the attenuation loop in the conductive layer. If the angular frequency ω is sufficiently large or if R ₂ <wL ₂₂ , then equation (5) is simplified and the relationship for the transformed additional inductance results:

In the case of a supply line which is provided with a damping device, a total inductance L _n '= Ln + AL results for the conductor loop, the value of which is considerably lower than the inductance which the conductor loop has without a damping device.

The determination of the impedance (apparent resistance) of a conductor loop according to FIG. 2 was also carried out by measurements; a vector impedance meter was used for this. If the supply line was not provided with a damping device, an inductance of Lw = 149 nH was measured for the conductor loop of FIG.

If the supply line with the damping * means so complete that serves as a conductive copper disk mm is isolated in a distance of 10 · ΙΟ- ³ was on the supply lines, wherein the gap was filled in by a polyimide insulation as the dielectric, and also has the The inductance L ₂ i of the damping loop was also chosen so that it corresponded to the inductance Ln of the supply line, i.e. L22 = Lu, then at a maximum frequency to be damped of 5 MIl / an effective resistance /? 2 = 4.7 ohms was calculated for the damping loop. In the experimental sample, whose damping disk or conductive layer had a thickness of 0.76 × 10 " ³ mm, an effective resistance value K ₂ = 3.4 ohms was determined for the damping loop of the conductive layer. The maximum damping was at a frequency / = 3.7 MHz The increase in the effective resistance AR = 1.55 Ohm is thus greater by a factor of eight than the effective resistance R \ in the loop of the supply line. The effective resistance Ri of the conductor loop is quite large for a power supply line.

The total capacitance value C _u between the conductor loop and the damping disk can be found by simple calculation using the formula for parallel plates or by measurement. A total capacitance Cn = 0.74 nF was determined in the experimental sample.

The diagram in FIG. 3 shows on the ordinate the values of the effective resistance R \ in ohms for the loop of a supply line with and without a damping device as a function of the frequency. This effective resistance of the conductor loop increases in the frequency range of 100 MHz as a result of the skin effect, whereby this additional resistance supports the damping of the higher-frequency vibration signals. The diagram of FIG. 4 shows the proportion of reactance in the impedance as a function of frequency on two comparison curves. The lower curve, which is assigned to a conductor loop with a damping device, clearly shows that this has a lower reactance, which is due to the reduction in the line inductance which was caused by the damping device.

is with the experiment pattern of the damping device Further measurements were carried out to determine their influence on the damping effect, which results when the conductive layer (in the present example a metal disk) in the center with a hole to is provided, which has the dimensions 38.1 mm 31.75 mm. Under this in the Damping disk or conductive layer located hole should be on the circuit card or the chip Signal lines are arranged, which should not be influenced by the attenuation device. The measured values produced the result that the same damping effect in the loop of the supply line occurs regardless of whether the conductive layer is completely closed or with the central hole is provided. It is thus possible to arrange the signal lines in the area of the hole without a Impairment of the control signals is to be feared.

In this embodiment, the supply lines, which also act as transmission lines 5S of switching signals of the DC voltage or de; Serve direct current, an apparent resistance (impedance) less than five ohms.

With integrated circuit arrangements is also dei Influence and behavior of the undesired in the f> o pulse-shaped interference voltage signals except for de: Size of their amplitude also depends on the time of particular interest, this being impulsför moderate interfering signals can be generated by various interfering signal sources. For test purposes we wBfde deshall <> <> a typical loop-shaped arrangement of Versor investigated, which in Fig. 5 in principle [ is shown. In this circuit arrangement, a single transistor was used to simulate the load

Branch of the supply lines, the so-called finger 3, arranged. For integrated circuits, whose supply lines are not provided with a damping device, generate the These supply lines induced interference voltage signals, the characteristics of which are shown in FIGS. 6b and 7b is recorded, as a result of their large amplitudes and their chronological sequence, incorrect shutdowns of the DC current or DC voltage supply in these circuits, which, as can be seen, is insufficient Have attenuation or interference suppression. The behavior of utility lines is shown below discussed when these lines are operated with and without a damping device according to the invention will.

The diagrams of FIGS. 6 and 7 show the various interference voltage signals that occur in the supply lines of the aforementioned test arrangement of an integrated circuit when this circuit is provided with and without a damping device, depending on the slope of a cutoff current in one of these supply lines is. The F i g. 6a and 7a show the characteristics of the disconnection of a direct current in a supply line, the disconnection edges being the lines for generating the in FIGS. 6b, 6c, 7b, 7c, 7d trigger the interference voltage signals shown. The curve of FIG. 6b shows a relatively slow current cut-off in comparison with the frequency of the parasitic oscillation signals (FIG. 6b) of a circuit with field effect transistors occurring in this supply line. Curve 7a shows a steeper flank of the current cut-off, and curve 7b shows the resulting parasitic oscillation signals in an undamped supply line of a bipolar circuit.

In the test circuit according to F1 g. 5 for example Interfering vibrations occurring at branch 4 of the supply line, which are shown in Fig. 6b, were determined with a probe, this probe being provided with a capacity of 160 pF. From the two curves in FIG. 6a and 6b can be seen that the direct current to be switched off has not yet reached the The zero value has decayed and that the high-frequency Interfering signal already has a high voltage level again, which switch the transistor into the conductive state can. In FIG. 6b, the dashed curve denotes the calculated course of an interfering oscillation in FIG Supply line of a simple circuit according to FIG. 5, while the fully drawn curve through the Measurement was determined. The deviation of the two parasitic oscillation curves from one another in FIG. 6b is due to the fact that the damping influence in the circuit caused by the skin effect in the Calculation was not taken into account.

The F i g. 6c shows the considerably reduced and damped interference oscillations or the interference voltage signal Vj as a function of time, a 1.27 χ 10 " ⁱ mm thick copper disk being used as the damping device in the test circuit. This very thin copper disk was at one point with the As FIG. 5 shows, the copper disk was provided with etched holes on both sides in which the electronic components or load components are to be accommodated. The copper disk serving as a conductive layer was from the surface the loop-shaped arrangement of supply lines through a 10.1 χ 10- ³ mm thick dielectric layer of polyimide separately. by this damping device a remarkable reduction of the Störspannungssignals was achieved, because the maximum amplitude is only about a quarter of the original Ampiitudenwertes, and sound vibrations practically within b of a period.

ίο The F i g. 7b shows the higher-frequency interference voltage signal a supply line without a special damping device. Interference voltage oscillations this line, whose frequency is around 100 MHz, are due to the skin effect, which leads to the ohmic

is resistance of the line added, relatively very strong muffled. However, this parasitic oscillation signal still has inadmissibly large initial amplitudes, which, as the interference voltage signal of FIG. 7b shows, impair the operational reliability of the integrated circuits. The F i g. 7c shows a very greatly reduced interference voltage signal which results when this Supply line is provided with a damping device according to the invention.

Another interesting curve of an interference voltage signal on the same supply line of the previous embodiment, which is provided with a capacitive damping device, is shown in FIG. 7d. In the test circuit according to FIG. 5, the fifth branch of the loop-shaped supply lines was equipped with a 0.1 μΡ capacitor to block the voltage Vi. This resulted in the profile of the interference voltage signal shown in FIG. 7d. In the next branch of the supply line but a Störspannungssignal was determined, the voltage amplitude previous year is great again, as shown in the Störspannungssignal shown in Fig.7d. This means that a capacitive damping device requires a large number of capacitors to suppress the interference voltage or to dampen it to the extent that the same good result (FIG. 7c) is obtained as with the copper washer Damping device.

Damping devices according to the invention are except in the above-mentioned embodiments can also be used very appropriately in other applications, and depending on the existing operating requirements or conditions by means of simple measures familiar to the skilled person still to be improved. For example, alternating current resistances of different sizes can be used in series be used in the conductor loops of the supply lines if they have different voltages values and the frequencies of the interference voltage

ss voltage vibrations are of different sizes. the Damping of the interfering vibrations can of course also be integrated on just one supply line Circuit arrangement are limited. Damping devices according to the invention are also advantageous

<> u can be used to decouple loop-shaped designed signal lines or arranged for attenuation voi outside of the integrated circuits Supply lines that carry the energy or DC voltage from the power supply source to the circuit;

lead the arrangement. Also in measurement technology and i Such damping devices are advantageous for test purposes in order to ensure that they are not adulterated To obtain measurement results. To with liner such

i.

Damping device to get the best effect should be advised to follow the instructions below get noticed:

The power supply source, which feeds the lines to be damped, which are arranged in a loop, should have as low an impedance as possible. This requirement is met by the meets most of the power sources currently in use. Also, the total impedance should of the circuit, by placing particular emphasis on good attenuation or interference suppression.

The integrated circuits which are connected to the branches of the supply lines arranged in a loop according to FIG. 5 are connected, there are special requirements. It should be noted that currents of up to ten amperes can occur in the branches of the power supply lines if several circuits are connected in parallel and activated, as is possible in the case of semiconductor memories. It is believed that in the future circuits containing field effect transistors. Generate pulses with a rise time in the range of about one nanosecond. These can be logic or memory circuits, the supply lines of which are also high-frequency oscillation systems that either all oscillate at one frequency or at different frequencies. In the case of the new damping device, care must also be taken to ensure that the base or carrier plate on which the loop-shaped supply lines are arranged are not made of a ferromagnetic material; However, ceramic or other insulating materials are well suited as a support layer.

For this purpose 3 sheets of drawings

Claims (9)

Patent claims: 1. Damping device for negative pressure .ig the high-frequency caused by switching operations Interfering vibrations in the loop-shaped supply lines for voltage or Power supply of switching elements ei.thaltenden circuit arrangements, their preferably printed Supply lines are arranged on a surface side of a carrier plate and which in particular contain integrated circuits in module technology, characterized in that that very close above or below the supply conductor loops to be suppressed congruent a thin, electrically conductive, non-ferromagnetic conductive layer is arranged next to them. 2. Damping device according to claim 1, characterized in that the conductive layer has a Supply conductor loops on the carrier plate overlapping damping disc is separated arranged by a dielectric at a certain distance above the supply lines is. 3. Damping device according to claim 1 or 2, characterized in that the conductive layer consists of consists of a metal foil, which is acted upon as a dielectric by a very thin insulating foil inserted in between rests on the supply lines. 4. Damping device according to one of claims 1 to 3, characterized in that the Conductive layer consists of copper or aluminum. 5. Damping device according to one of claims 1 to 4, characterized in that the Places where there are signal lines or switching elements in the circuit arrangement, the disk-shaped Conductive layer is provided with corresponding holes or cutouts. 6. Damping device according to claim 1, characterized characterized in that the conductive layer consists of a highly doped semiconductor material and in the Structure of the carrier plate is included that this conductive layer one of the supply conductor loops has on the carrier plate covering surface and that on the top of the conductive layer the loops of the supply lines to be suppressed are arranged as conductor tracks. 7. Damping device according to one of claims 1 to 6, characterized in that in integrated circuits, the conductive layer for the formation of closed damping loops only the locations and is congruent with the interference-suppression supply line loops that Lead direct currents or direct voltages. 8. Damping device according to claim 6 or 7, characterized in that the semiconductor material existing conductive layer in the areas where signal lines of the integrated circuits are located are located, is accordingly provided with lightly doped areas. f »o 9. Damping device according to one of claims 1 to 4 or 6 to 7, characterized in that the supply line to be suppressed of the circuit arrangement on one surface side of the Carrier plates or circuit cards arranged <> 5 and that the signal lines are on their other surface side. This invention relates to a damper to suppress the high-frequency interfering vibrations in the Loop-shaped supply lines for voltage or power supply of switching elements containing circuit arrangements, their preferably printed supply lines on a surface side of a carrier plate are arranged and in particular contain integrated circuits in modular technology, which in addition to the Switching elements, the supply lines and the signal lines and other electrical components may contain. This damping device according to the invention aims an improvement in high-speed circuits in that they improve their operational reliability significantly increased or that these circuits can process even steeper pulse edges than so far and that an operation in higher frequency ranges is possible. When switching off a direct current in a supply line of an integrated circuit, which takes place in the nanosecond range, become undesirable and disrupt the operational function gradually decaying vibration signals generated on the lines. These supply lines, at which a low ohmic resistance is required have a certain inductance and capacitance on, and they thereby form resonance systems, for example by such a shutdown process are triggered and thereby generate the undesired parasitic oscillations, the first oscillations can have unacceptably large amplitudes, so that, for example, transistors in the Circuits carry out undesired incorrect switching. The damping device according to the invention reduces the inductance of the supply lines and their capacity is increased, so that a higher-frequency resonance system results, which in his high resonance frequency has a particularly high effective resistance. This effective resistance is a Ohmic resistance, which can also be referred to as loss resistance. Through this apparent high resistance and the damping device makes the line resonance system fast the energy is withdrawn, and the generation of relatively large disruptive oscillation amplitudes is thereby prevented. Circuits with supply lines arranged in a loop, which have such a damping device are advantageous in electronic Can be used in very large numbers in high-speed computers or in data processing equipment. Also In the devices for telecommunications systems and control technology, there are those with a damping device provided circuits expediently applicable. Electronic digital computers contain a very large number of in their circuit arrangement Circuits that are integrated in semiconductor wafers, the so-called "chips" are included. Several of these chips are electronic too Building blocks, the so-called modules, summarized on a carrier plate of a so-called circuit board or plug-in circuit card are attached. These are chips, modules and circuit cards through supply lines and through signal lines