DE4424984A1 - Flexible circuit board for SMD components - Google Patents

Flexible circuit board for SMD components

Info

Publication number
DE4424984A1
DE4424984A1 DE4424984A DE4424984A DE4424984A1 DE 4424984 A1 DE4424984 A1 DE 4424984A1 DE 4424984 A DE4424984 A DE 4424984A DE 4424984 A DE4424984 A DE 4424984A DE 4424984 A1 DE4424984 A1 DE 4424984A1
Authority
DE
Germany
Prior art keywords
circuit board
components
solder
slots
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4424984A
Other languages
German (de)
Inventor
Dieter Busch
Hans-Joachim Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mannesmann VDO AG
Original Assignee
Mannesmann VDO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann VDO AG filed Critical Mannesmann VDO AG
Priority to DE4424984A priority Critical patent/DE4424984A1/en
Publication of DE4424984A1 publication Critical patent/DE4424984A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The flexible circuit board has components (3) attached to it, preferably by surface mounting. The components (3) are arranged in areas (2) on the circuit board (1) which are defined by slits (5, 6, 7) in the circuit board (1). Preferably, the components are each placed in a solder island (2) and the slits (5, 6, 7) at least partly surround the islands (2). In the preferred arrangement, the slits (5, 6, 7) frame the islands of solder (2) and are only interrupted to allow for the passage of a conductive tracks (10). The slits (5, 6, 7) allow the circuit board (1) to be bent without the areas containing the components (3) being bent and displacing the components (3).

Description

Die Erfindung betrifft eine flexible Leiterplatte mit darauf insbesondere durch Oberflächenmontage befestigten Bauteilen.The invention relates to a flexible printed circuit board attached to it in particular by surface mounting Components.

Vor allem bei durch Oberflächenmontage befestigten Bau­ teilen auf flexiblen Leiterplatten tritt das Problem auf, daß die Bauteile von der Leiterplatte abplatzen, wenn man diese im Bereich der Bauteile biegt. Es macht sich hier bei flexiblen Leiterplatten der Effekt negativ bemerkbar, den man beispielsweise bei Preisauszeichnungsgeräten po­ sitiv nutzt, um Etikette von einer Trägerfolie zu lösen. Die Etikette machen eine starke Biegung der Trägerfolie nicht mit und heben sich dabei von ihr ab.Especially in the case of construction secured by surface mounting sharing on flexible circuit boards the problem occurs that the components flake off the circuit board if one this bends in the area of the components. It's going on here the effect is noticeable on flexible printed circuit boards, which, for example, in price labeling devices po sitiv used to detach labels from a carrier film. The labels make a strong bend in the carrier film not with and stand out from her.

Die Zeitschrift "Markt & Technik" Nr. 36 erläutert auf Seite 72, daß bei flexiblen Leiterplatten im Biegebereich aus leicht einsehbaren Gründen keine Bauelemente plaziert werden dürfen. Oftmals ist jedoch nicht vorherzubestim­ men, wo Biegebereiche liegen. Als Alternative dazu, in Biegebereichen keine Bauteile anzuordnen, schlägt die Zeitschrift vor, auf flexiblen Leiterplatten die Bestüc­ kungsbereiche zu versteifen, führt jedoch dazu an, daß eine solche Versteifungslösung sehr arbeitsintensiv und teuer sei.The magazine "Markt & Technik" No. 36 explains Page 72 that with flexible printed circuit boards in the bending area no components placed for easily visible reasons may be. However, it is often not possible to determine in advance where there are bending areas. As an alternative, in Bending areas not to arrange components, suggests Magazine before, the assembly on flexible printed circuit boards stiffening areas leads to the fact that such a stiffening solution is very labor intensive and is expensive.

Der Erfindung liegt das Problem zugrunde, eine flexible Leiterplatte der eingangs genannten Art so auszubilden, daß sie im Hinblick auf ein Biegen der Leiterplatte in beliebigen Bereichen mit Bauteilen bestückt werden kann, ohne daß die Gefahr eines Abplatzens der Bauteile be­ steht.The invention is based on the problem of being flexible To design printed circuit boards of the type mentioned at the beginning that they are in terms of bending the circuit board in can be equipped with components in any area, without the risk of the components flaking stands.

Dieses Problem wird erfindungsgemäß dadurch gelöst, daß die Bauteile auf durch Schlitze in der Leiterplatte be­ grenzte Bereiche der Leiterplatte angeordnet sind.This problem is solved according to the invention in that the components on through slots in the PCB limited areas of the circuit board are arranged.

Die Erfindung lehrt somit genau das Gegenteil von dem, was die eingangs genannte Zeitschrift "Markt & Technik" vorschlägt. Statt die Bereiche, in denen Bauteile pla­ ziert werden, zu versteifen, um dort ein Biegen der Lei­ terplatte auszuschließen, werden gemäß der Erfindung diese Bereiche durch Schlitze so leicht verformbar, daß beim Biegen der Leiterplatte die Bauteile ein Biegen der Bereiche, in denen sie mit der Leiterplatte verbunden sind, ausschließen können. Die Leiterplatten werden also in bestimmten Bereichen geschwächt, so daß sie sich dort verstärkt biegen, nicht jedoch in den Verbindungsberei­ chen der Bauelemente. Auf diese Weise kann man mit sehr geringem Aufwand der Gefahr eines Abplatzens von Bautei­ len auf flexiblen Leiterplatten begegnen.The invention thus teaches the exact opposite of what the initially mentioned magazine "Markt & Technik" proposes. Instead of the areas in which components pla be decorated to stiffen to bend the lei there Exclude terplatte are according to the invention these areas so easily deformable by slots that when bending the circuit board the components are bending the Areas where they are connected to the circuit board are excluded. So the circuit boards weakened in certain areas so that they are there bend more, but not in the connection area chen of the components. This way you can be very low cost of the risk of chipping of building components len on flexible printed circuit boards.

Wenn bei flexiblen Leiterplatten die Bauteile jeweils auf Lötinseln plaziert sind, dann ist es vorteilhaft, wenn die Schlitze die Lötinseln zumindest teilweise umgeben. Hierdurch braucht man ein Biegen der Leiterplatte nur in den eng begrenzten Bereichen auszuschließen, die für die Lötverbindungen oberflächenmontierter Bauteile notwendig sind. If the components of flexible PCBs are open Solder pads are placed, it is advantageous if the slots at least partially surround the solder islands. This only requires bending the circuit board in to exclude the narrowly defined areas Solder connections of surface-mounted components necessary are.  

Die flexible Leiterplatte kann optimal in beliebige Rich­ tungen gebogen werden, ohne daß die Gefahr eines Abplat­ zens von Bauteilen besteht, wenn gemäß einer anderen vor­ teilhaften Weiterbildung der Erfindung die Schlitze die Lötinseln rahmenartig umschließen und lediglich zur Weg­ führung einer Leiterbahn unterbrochen sind.The flexible circuit board can optimally in any Rich lines are bent without the risk of flattening zens of components exists if according to another partial development of the invention the slots Enclose solder islands like a frame and only to the way routing of a conductor track are interrupted.

Die Erfindung läßt zahlreiche Ausführungsformen zu. Eine davon ist in der Zeichnung dargestellt und wird nachfol­ gend beschrieben. Diese zeigt inThe invention permits numerous embodiments. A of which is shown in the drawing and will follow described below. This shows in

Fig. 1 einen Schnitt durch einen Teilbereich einer erfindungsgemäßen Leiterplatte, Fig. 1 shows a section through a part of a printed circuit board according to the invention,

Fig. 2 eine Draufsicht auf einen Teilbereich der Leiterplatte. Fig. 2 is a plan view of a portion of the circuit board.

Die Fig. 1 zeigt eine flexible Leiterplatte 1 mit einer Lötinsel 2, auf der ein elektronisches Bauteil 3 mittels Lötzinn 4 oberflächenmontiert wurde. Zu beiden Seiten der Lötinsel 2 erkennt man in Fig. 2 Schlitze 5, 6 in der Leiterplatte 1. Diese bewirken, daß bei einem Biegen der Leiterplatte 1 im Bereich der Lötinsel 2 keine wesentli­ chen Biegespannungen auftreten, die zu einem Verformen der flexiblen Leiterplatte 1 im Bereich der Lötinsel 2 und damit zu einem Abplatzen des Bauteils 3 führen könn­ ten. Fig. 1 shows a flexible printed circuit board 1 with a solder pad 2 on which an electronic component is surface mounted by solder 3. 4 On both sides of the solder island 2 , slots 5 , 6 can be seen in the printed circuit board 1 in FIG. 2. These have the effect that when bending the circuit board 1 in the area of the solder island 2 no material bending stresses occur which could lead to a deformation of the flexible circuit board 1 in the area of the solder island 2 and thus to chipping of the component 3 .

Die Fig. 2 zeigt zwei Lötinseln 2, 2b, auf der das dort strichpunktiert dargestellte Bauteil 3 gelötet ist. Wei­ terhin ist in Fig. 2 zu sehen, daß die Schlitze 5, 6 durch einen diese miteinander verbindenden Schlitz 7 und kurze Schlitzstücke 8, 9 einen Rahmen bilden, der die Lötinsel 2 weitgehend einfaßt. Nur zum Abführen einer Leiterbahn 10 ist die Leiterplatte 1 nicht unterbrochen. FIG. 2 shows two soldering pads 2 , 2 b on which the component 3 shown there in dash-dotted lines is soldered. Wei terhin can be seen in Fig. 2 that the slots 5 , 6 form a frame connecting these interconnecting slot 7 and short slot pieces 8 , 9 , which largely surrounds the solder island 2 . The circuit board 1 is not interrupted only for removing a conductor track 10 .

Zwischen den Lötinseln 2, 2b verlaufen auf der Leiter­ platte 1 zwei Leiterbahnen 11, 12 aus Kupfer.Between the solder pads 2 , 2 b run on the circuit board 1, two conductor tracks 11 , 12 made of copper.

Claims (3)

1. Flexible Leiterplatte mit darauf insbesondere durch Oberflächenmontage befestigten Bauteilen, dadurch gekenn­ zeichnet, daß die Bauteile (3) auf durch Schlitze (5, 6, 7) in der Leiterplatte (1) begrenzte Bereiche der Leiter­ platte (1) angeordnet sind.1. Flexible circuit board having mounted thereon, in particular by means of surface mounting components, characterized in that the components (3) plate on limited by slots (5, 6, 7) in the circuit board (1) regions of the conductor (1) are arranged. 2. Flexible Leiterplatte nach Anspruch 1, bei denen die Bauteile jeweils auf Lötinseln plaziert sind, dadurch ge­ kennzeichnet, daß die Schlitze (5, 6, 7) die Lötinseln (2) zumindest teilweise umgeben.2. Flexible printed circuit board according to claim 1, in which the components are each placed on soldering pads, characterized in that the slots ( 5 , 6 , 7 ) at least partially surround the soldering pads ( 2 ). 3. Flexible Leiterplatte nach Anspruch 2, dadurch gekenn­ zeichnet, daß die Schlitze (5, 6, 7) die Lötinseln (2) rahmenartig umschließen und lediglich zur Wegführung einer Leiterbahn (10) unterbrochen sind.3. Flexible printed circuit board according to claim 2, characterized in that the slots ( 5 , 6 , 7 ) enclose the solder islands ( 2 ) frame-like and are only interrupted to lead away a conductor track ( 10 ).
DE4424984A 1994-07-15 1994-07-15 Flexible circuit board for SMD components Withdrawn DE4424984A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4424984A DE4424984A1 (en) 1994-07-15 1994-07-15 Flexible circuit board for SMD components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4424984A DE4424984A1 (en) 1994-07-15 1994-07-15 Flexible circuit board for SMD components

Publications (1)

Publication Number Publication Date
DE4424984A1 true DE4424984A1 (en) 1996-01-18

Family

ID=6523220

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4424984A Withdrawn DE4424984A1 (en) 1994-07-15 1994-07-15 Flexible circuit board for SMD components

Country Status (1)

Country Link
DE (1) DE4424984A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1496728A1 (en) * 2003-07-10 2005-01-12 Delphi Technologies, Inc. Circuit assemby having compliant substrate stuctures for mounting circuit devices
EP2434846A1 (en) * 2010-09-24 2012-03-28 Manfred Herrler Wiring element, power distributor, and vehicle battery

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1496728A1 (en) * 2003-07-10 2005-01-12 Delphi Technologies, Inc. Circuit assemby having compliant substrate stuctures for mounting circuit devices
EP2434846A1 (en) * 2010-09-24 2012-03-28 Manfred Herrler Wiring element, power distributor, and vehicle battery
DE102010041369A1 (en) * 2010-09-24 2012-03-29 Manfred Herrler Wiring element, power distributor and vehicle battery

Similar Documents

Publication Publication Date Title
DE10325550B4 (en) Electrical contacting method
DE3790315C2 (en)
DE4430798A1 (en) Lead frame for connecting electrical components
DE4305793A1 (en) Power module
CH667562A5 (en) PROCEDURE FOR MODIFYING A FLAT ELECTRICAL ASSEMBLY.
EP0519200B1 (en) Connection of LLCCC structural elements for the space electronics
DE3607049A1 (en) METHOD FOR PRODUCING CIRCUIT BOARDS WITH ELECTRONIC COMPONENTS WITH A CIRCUIT ARRANGED ON ONE SIDE
DE19961116A1 (en) PCB arrangement
DE4236268A1 (en) Mother and daughter circuit board arrangement - has lugs formed on daughter board locating in holes in mother board for connections
DE3903615C2 (en)
EP0613331A1 (en) Method of attaching a hybrid circuit on a pcb
DE4424984A1 (en) Flexible circuit board for SMD components
EP0489958A1 (en) Circuit board for electronic control apparatus and method of making this circuit board
DE19540814A1 (en) Board for printed circuit with surface mount technology (SMT) components
DE3545527A1 (en) FLEXIBLE ELECTRICAL CONNECTING DEVICE AND METHOD FOR THEIR PRODUCTION
DE102004052495B4 (en) Printed circuit board for the construction of arbitrary circuits with SMD components
DE10228152A1 (en) Self-adhesive flexible repair circuit
DE10249575B3 (en) Electrical printed circuit board device has conductor paths connected to surface-mounted devices and associated contact elements having contact pins cooperating with corresponding electrical conductors
DE4416096A1 (en) Contacting of actuating and display means
DE4118308C2 (en) Circuit carrier for SMD components
EP0410426B1 (en) Device for strain relief
DE3831961A1 (en) Holder for hybrid boards having electronic components
EP0304902B1 (en) Arrangement for modifying and/or repairing a flat module when inserting surface-mounted components
EP1336329B1 (en) Printed circuit board assembly and method of producing it
EP0838133B1 (en) Device for mounting electrical components on printed-circuit boards

Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: MANNESMANN VDO AG, 60326 FRANKFURT, DE

8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: SIEMENS AG, 80333 MUENCHEN, DE

8139 Disposal/non-payment of the annual fee