DE4323064A1 - Verfahren zur Herstellung einer lötbereiten gedruckten Schaltung - Google Patents
Verfahren zur Herstellung einer lötbereiten gedruckten SchaltungInfo
- Publication number
- DE4323064A1 DE4323064A1 DE4323064A DE4323064A DE4323064A1 DE 4323064 A1 DE4323064 A1 DE 4323064A1 DE 4323064 A DE4323064 A DE 4323064A DE 4323064 A DE4323064 A DE 4323064A DE 4323064 A1 DE4323064 A1 DE 4323064A1
- Authority
- DE
- Germany
- Prior art keywords
- compound
- printed circuit
- solder mask
- solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- 238000005476 soldering Methods 0.000 title claims description 23
- 230000008569 process Effects 0.000 title description 10
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 150000001875 compounds Chemical class 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 21
- 239000000243 solution Substances 0.000 claims description 17
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- 239000000049 pigment Substances 0.000 claims description 10
- -1 silyl compound Chemical class 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 239000003505 polymerization initiator Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 238000006884 silylation reaction Methods 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000012670 alkaline solution Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
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- 238000006116 polymerization reaction Methods 0.000 claims description 4
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- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 2
- MTRFEWTWIPAXLG-UHFFFAOYSA-N 9-phenylacridine Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 MTRFEWTWIPAXLG-UHFFFAOYSA-N 0.000 description 2
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
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- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
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- 229920001971 elastomer Polymers 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
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- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 2
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- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
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- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
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- 230000037361 pathway Effects 0.000 description 1
- 125000001791 phenazinyl group Chemical class C1(=CC=CC2=NC3=CC=CC=C3N=C12)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical compound C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 125000002294 quinazolinyl group Chemical class N1=C(N=CC2=CC=CC=C12)* 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012089 stop solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 150000003549 thiazolines Chemical class 0.000 description 1
- OKYDCMQQLGECPI-UHFFFAOYSA-N thiopyrylium Chemical class C1=CC=[S+]C=C1 OKYDCMQQLGECPI-UHFFFAOYSA-N 0.000 description 1
- RLGKSXCGHMXELQ-ZRDIBKRKSA-N trans-2-styrylquinoline Chemical compound C=1C=C2C=CC=CC2=NC=1\C=C\C1=CC=CC=C1 RLGKSXCGHMXELQ-ZRDIBKRKSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000004953 trihalomethyl group Chemical group 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
- G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4323064A DE4323064A1 (de) | 1993-07-10 | 1993-07-10 | Verfahren zur Herstellung einer lötbereiten gedruckten Schaltung |
| EP94109156A EP0633717A1 (de) | 1993-07-10 | 1994-06-15 | Verfahren zur Herstellung einer lötbaren gedruckten Schaltung |
| TW083105520A TW245878B (enExample) | 1993-07-10 | 1994-06-17 | |
| MX9404928A MX9404928A (es) | 1993-07-10 | 1994-06-29 | Metodo para la produccion de un circuito impreso listo para soldar. |
| KR1019940015742A KR950005126A (ko) | 1993-07-10 | 1994-07-01 | 땝납 직전의 인쇄 회로를 제조하는 방법 |
| CA002127634A CA2127634A1 (en) | 1993-07-10 | 1994-07-08 | Method for the production of a printed circuit which is ready for soldering |
| JP6156895A JPH07307555A (ja) | 1993-07-10 | 1994-07-08 | はんだ付けに適するプリント回路及びその製造方法 |
| CN94107553A CN1111898A (zh) | 1993-07-10 | 1994-07-11 | 一种可随时用于焊接的印刷电路的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4323064A DE4323064A1 (de) | 1993-07-10 | 1993-07-10 | Verfahren zur Herstellung einer lötbereiten gedruckten Schaltung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE4323064A1 true DE4323064A1 (de) | 1995-01-12 |
Family
ID=6492446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE4323064A Withdrawn DE4323064A1 (de) | 1993-07-10 | 1993-07-10 | Verfahren zur Herstellung einer lötbereiten gedruckten Schaltung |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0633717A1 (enExample) |
| JP (1) | JPH07307555A (enExample) |
| KR (1) | KR950005126A (enExample) |
| CN (1) | CN1111898A (enExample) |
| CA (1) | CA2127634A1 (enExample) |
| DE (1) | DE4323064A1 (enExample) |
| MX (1) | MX9404928A (enExample) |
| TW (1) | TW245878B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011083791A1 (de) * | 2011-09-29 | 2013-04-04 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Lötverbindung |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62263645A (ja) * | 1986-05-06 | 1987-11-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 電気的接点構造とその形成方法 |
| DE4142735A1 (de) * | 1991-12-21 | 1993-06-24 | Hoechst Ag | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstoppmaske |
-
1993
- 1993-07-10 DE DE4323064A patent/DE4323064A1/de not_active Withdrawn
-
1994
- 1994-06-15 EP EP94109156A patent/EP0633717A1/de not_active Withdrawn
- 1994-06-17 TW TW083105520A patent/TW245878B/zh active
- 1994-06-29 MX MX9404928A patent/MX9404928A/es unknown
- 1994-07-01 KR KR1019940015742A patent/KR950005126A/ko not_active Ceased
- 1994-07-08 JP JP6156895A patent/JPH07307555A/ja active Pending
- 1994-07-08 CA CA002127634A patent/CA2127634A1/en not_active Abandoned
- 1994-07-11 CN CN94107553A patent/CN1111898A/zh active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011083791A1 (de) * | 2011-09-29 | 2013-04-04 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Lötverbindung |
| US9041224B2 (en) | 2011-09-29 | 2015-05-26 | Robert Bosch Gmbh | Method for producing a solder joint |
Also Published As
| Publication number | Publication date |
|---|---|
| KR950005126A (ko) | 1995-02-18 |
| CN1111898A (zh) | 1995-11-15 |
| EP0633717A1 (de) | 1995-01-11 |
| JPH07307555A (ja) | 1995-11-21 |
| CA2127634A1 (en) | 1995-01-11 |
| TW245878B (enExample) | 1995-04-21 |
| MX9404928A (es) | 1995-01-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |