DE4291264T1 - - Google Patents

Info

Publication number
DE4291264T1
DE4291264T1 DE4291264T DE4291264T DE4291264T1 DE 4291264 T1 DE4291264 T1 DE 4291264T1 DE 4291264 T DE4291264 T DE 4291264T DE 4291264 T DE4291264 T DE 4291264T DE 4291264 T1 DE4291264 T1 DE 4291264T1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4291264T
Other languages
German (de)
Inventor
Todd G. Downers Grove Ill. Us Swikle
Mark A. Elmhurst Ill. Us Barabolak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE4291264T1 publication Critical patent/DE4291264T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B15/00Suppression or limitation of noise or interference
    • H04B15/02Reducing interference from electric apparatus by means located at or near the interfering apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE4291264T 1991-05-03 1992-04-06 Withdrawn DE4291264T1 (US20090163788A1-20090625-C00002.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/695,080 US5239127A (en) 1991-05-03 1991-05-03 Electrical interconnect apparatus

Publications (1)

Publication Number Publication Date
DE4291264T1 true DE4291264T1 (US20090163788A1-20090625-C00002.png) 1993-05-13

Family

ID=24791477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4291264T Withdrawn DE4291264T1 (US20090163788A1-20090625-C00002.png) 1991-05-03 1992-04-06

Country Status (9)

Country Link
US (1) US5239127A (US20090163788A1-20090625-C00002.png)
JP (1) JPH05508518A (US20090163788A1-20090625-C00002.png)
KR (1) KR960015905B1 (US20090163788A1-20090625-C00002.png)
AR (1) AR246665A1 (US20090163788A1-20090625-C00002.png)
CA (1) CA2083278A1 (US20090163788A1-20090625-C00002.png)
DE (1) DE4291264T1 (US20090163788A1-20090625-C00002.png)
GB (1) GB2261121B (US20090163788A1-20090625-C00002.png)
MX (1) MX9202049A (US20090163788A1-20090625-C00002.png)
WO (1) WO1992020207A1 (US20090163788A1-20090625-C00002.png)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5373101A (en) * 1991-05-03 1994-12-13 Motorola, Inc. Electrical interconnect apparatus
DE4223322C1 (US20090163788A1-20090625-C00002.png) * 1992-07-16 1993-07-29 Schroff Gmbh, 7541 Straubenhardt, De
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
JPH0818265A (ja) * 1994-06-29 1996-01-19 Molex Inc プリント回路基板上での電磁波等のシ−ルド方法 及びその為のシ−ルドカバ−
US5814762A (en) * 1995-04-12 1998-09-29 Digital Equipment Corporation Grounding for enclosures
US6625881B2 (en) * 2001-09-11 2003-09-30 Xytrans, Inc. Solderless method for transferring high frequency, radio frequency signals between printed circuit boards
US6829148B2 (en) * 2001-09-14 2004-12-07 Honeywell International Inc. Apparatus and method for providing a ground reference potential
US20040000428A1 (en) * 2002-06-26 2004-01-01 Mirng-Ji Lii Socketless package to circuit board assemblies and methods of using same
KR100625121B1 (ko) * 2003-07-01 2006-09-19 에스케이 텔레콤주식회사 통신핸드셋 장치에서의 sar 노출 감소 방법 및 장치
US20110255850A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Electronic subassemblies for electronic devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3523770A1 (de) * 1985-07-03 1987-01-08 Bosch Gmbh Robert Hochfrequenzdichtes gehaeuse
US4831498A (en) * 1987-07-23 1989-05-16 Uniden Corporation Shield structure for circuit on circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2241888B1 (US20090163788A1-20090625-C00002.png) * 1973-04-20 1976-04-23 Mecanique Ind Int
US4772218A (en) * 1987-06-12 1988-09-20 Don Ross Terminal block
DE3843412A1 (de) * 1988-04-22 1990-06-28 Bayer Ag Neue polythiophene, verfahren zu ihrer herstellung und ihre verwendung
US4890199A (en) * 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
US5043528A (en) * 1989-03-30 1991-08-27 Richard Mohr Device for providing electrical continuity between electrically conductive surfaces
US5053926A (en) * 1989-11-16 1991-10-01 Voice Data Image Corporation Inc. Electronic equipment cabinet cover panel with integrated connector assembly
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
US5124889A (en) * 1990-04-24 1992-06-23 Motorola, Inc. Electromagnetic shielding apparatus for cellular telephones

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3523770A1 (de) * 1985-07-03 1987-01-08 Bosch Gmbh Robert Hochfrequenzdichtes gehaeuse
US4831498A (en) * 1987-07-23 1989-05-16 Uniden Corporation Shield structure for circuit on circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Dipl.-Ing. (FH) Gerhard Hausmann, "Grundsätzli- ches zur Oberflächenmontagetechnik", Elektronik 15/24.7.87, S. 78-82 *

Also Published As

Publication number Publication date
KR960015905B1 (ko) 1996-11-23
GB2261121B (en) 1995-10-18
MX9202049A (es) 1992-11-01
GB9225966D0 (en) 1993-03-10
CA2083278A1 (en) 1992-11-04
AR246665A1 (es) 1994-09-30
GB2261121A (en) 1993-05-05
US5239127A (en) 1993-08-24
WO1992020207A1 (en) 1992-11-12
KR930701908A (ko) 1993-06-12
JPH05508518A (ja) 1993-11-25

Similar Documents

Publication Publication Date Title
DK0616505T3 (US20090163788A1-20090625-C00002.png)
EP0531653A3 (US20090163788A1-20090625-C00002.png)
EP0539116A3 (US20090163788A1-20090625-C00002.png)
EP0527469A3 (US20090163788A1-20090625-C00002.png)
EP0534777A3 (US20090163788A1-20090625-C00002.png)
DE4291264T1 (US20090163788A1-20090625-C00002.png)
EP0503606A3 (US20090163788A1-20090625-C00002.png)
FR2676353B1 (US20090163788A1-20090625-C00002.png)
FR2674176B1 (US20090163788A1-20090625-C00002.png)
FR2674288B1 (US20090163788A1-20090625-C00002.png)
FR2677119B1 (US20090163788A1-20090625-C00002.png)
FR2675000B1 (US20090163788A1-20090625-C00002.png)
FR2677254B1 (US20090163788A1-20090625-C00002.png)
FR2674583B1 (US20090163788A1-20090625-C00002.png)
FR2675750B1 (US20090163788A1-20090625-C00002.png)
FR2677334B1 (US20090163788A1-20090625-C00002.png)
FR2671715B1 (US20090163788A1-20090625-C00002.png)
FR2672342B1 (US20090163788A1-20090625-C00002.png)
IN173612B (US20090163788A1-20090625-C00002.png)
IN180857B (US20090163788A1-20090625-C00002.png)
EP0533178A3 (US20090163788A1-20090625-C00002.png)
EP0507249A3 (US20090163788A1-20090625-C00002.png)
EP0535630A3 (US20090163788A1-20090625-C00002.png)
EP0534678A3 (US20090163788A1-20090625-C00002.png)
EP0550128A3 (US20090163788A1-20090625-C00002.png)

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee