DE4238412A1 - Machining printed circuit boards - cooling machining location with continuous or pulsed gas jets - Google Patents

Machining printed circuit boards - cooling machining location with continuous or pulsed gas jets

Info

Publication number
DE4238412A1
DE4238412A1 DE4238412A DE4238412A DE4238412A1 DE 4238412 A1 DE4238412 A1 DE 4238412A1 DE 4238412 A DE4238412 A DE 4238412A DE 4238412 A DE4238412 A DE 4238412A DE 4238412 A1 DE4238412 A1 DE 4238412A1
Authority
DE
Germany
Prior art keywords
machining
printed circuit
circuit boards
continuous
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4238412A
Other languages
German (de)
Inventor
Josef Dipl Ing Kaesmaier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Wincor Nixdorf International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wincor Nixdorf International GmbH filed Critical Wincor Nixdorf International GmbH
Priority to DE4238412A priority Critical patent/DE4238412A1/en
Publication of DE4238412A1 publication Critical patent/DE4238412A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)

Abstract

Plastic and metal, partic. printed circuit boards are drilled or machined by a method in which the tool and the machining location are cooled by continuous or pulsed jets of gaseous N2, CO2, or O2, such that the cooling temp. of the medium is +10 deg.C to -150 deg.C. ADVANTAGE - Liquid cooling is not required, machining quality is improved.

Description

Die Erfindung betrifft ein Verfahren zum Bohren oder Fräsen von Kunststoff und Metall, insbesondere von Leiterplatten.The invention relates to a method for drilling or milling of plastic and metal, in particular of printed circuit boards.

Beim Bohren oder Fräsen von Metall oder Kunststoff ohne Flüssigkeitskühlung, wie z. B. beim Bohren von Leiterplatten, entstehen an der Bearbeitungsstelle z. B. im Bohrloch hohe Temperaturen, bis zu 200°C. Die Folge ist das Entstehen von Verschmierungen, sogenannten Bohrsmear, und ein hoher Bohrer­ verschleiß.When drilling or milling metal or plastic without Liquid cooling, such as B. when drilling circuit boards, arise at the processing point z. B. high in the borehole Temperatures up to 200 ° C. The result is the emergence of Smear, so-called Bohrsmear, and a high drill wear.

Aufgabe der vorliegenden Erfindung ist es, ein Bohr- bzw. Fräsverfahren ohne Flüssigkeitskühlung anzugeben, durch das die Temperatur an der Bearbeitungsstelle, z. B. Bohrloch, gesenkt werden kann.The object of the present invention is to provide a drilling or Milling process to specify without liquid cooling, by the the temperature at the processing point, e.g. B. borehole, can be lowered.

Gemäß der Erfindung wird zur Lösung dieser Aufgabe derart verfahren, daß der Bohrer bzw. Fräser und die Bearbeitungs­ stelle, z. B. das Bearbeitungsbohrloch während der Bearbeitung durch permanentes oder impulsgesteuertes Anblasen mit gas­ förmigem Stickstoff, Kohlendioxyd oder Sauerstoff gekühlt wird, und daß die Kühltemperatur des Mediums zwischen +10°C und -150°C einstellbar ist.According to the invention, this object is achieved in order to achieve this proceed that the drill or milling cutter and the machining place, e.g. B. the machining hole during machining through permanent or pulse-controlled gas blowing nitrogen, carbon dioxide or oxygen and that the cooling temperature of the medium is between + 10 ° C and -150 ° C is adjustable.

Durch diese Maßnahmen wird die Produktivität gesteigert, da die Werkzeugstandzeit wesentlich länger ist als bei ungekühl­ tem Verfahren und zudem die Vorschübe höher eingestellt werden können. Da weniger Smear erzeugt wird, wird auch die Lochqualität gleichzeitig verbessert. Dieses Bohr- und Fräs­ verfahren ist für das Bearbeiten von Kunststoffen und Metal­ len auch außerhalb der Leiterplattenfertigung anwendbar. Es ist außerdem auf vorhandene Bohr- und Fräsmaschinen in einfa­ cher Weise adaptierbar.These measures increase productivity, because the tool life is significantly longer than with uncooled tem process and also the feeds set higher can be. Since less smear is generated, so too Hole quality improved at the same time. This drilling and milling The procedure is for processing plastics and metal len can also be used outside of printed circuit board production. It  is also simple on existing drilling and milling machines Adaptable way.

Claims (1)

Verfahren zum Bohren oder Fräsen von Kunststoff und Metall, insbesondere bei Leiterplatten, dadurch gekennzeichnet, daß das Werkzeug (Bohrer, Fräser) und die Bearbeitungsstelle, z. B. das Bohrloch während der Bearbeitung durch permanentes oder impulsgesteuertes Anblasen mit gasförmigem Stickstoff, Kohlendioxyd oder Sauerstoff gekühlt wird, und daß die Kühl­ temperatur des Mediums zwischen +10°C und -150°C einstellbar ist.A method for drilling or milling plastic and metal, especially in the case of printed circuit boards, characterized in that the tool (drill, milling cutter) and the processing point, e.g. B. the borehole is cooled during processing by permanent or pulse-controlled blowing with gaseous nitrogen, carbon dioxide or oxygen, and that the cooling temperature of the medium between + 10 ° C and -150 ° C is adjustable.
DE4238412A 1992-11-13 1992-11-13 Machining printed circuit boards - cooling machining location with continuous or pulsed gas jets Withdrawn DE4238412A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4238412A DE4238412A1 (en) 1992-11-13 1992-11-13 Machining printed circuit boards - cooling machining location with continuous or pulsed gas jets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4238412A DE4238412A1 (en) 1992-11-13 1992-11-13 Machining printed circuit boards - cooling machining location with continuous or pulsed gas jets

Publications (1)

Publication Number Publication Date
DE4238412A1 true DE4238412A1 (en) 1994-05-19

Family

ID=6472849

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4238412A Withdrawn DE4238412A1 (en) 1992-11-13 1992-11-13 Machining printed circuit boards - cooling machining location with continuous or pulsed gas jets

Country Status (1)

Country Link
DE (1) DE4238412A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2724337A1 (en) * 1994-09-09 1996-03-15 Anhydride Carbonique Ind System for cooling material to be machined
EP2289664A1 (en) * 2009-09-01 2011-03-02 Spanolux N.V. Div. Balterio Method of manufacturing a covering panel with a profiled edge
WO2011097970A1 (en) * 2010-02-09 2011-08-18 深南电路有限公司 Method and device for processing pcb
WO2012013193A3 (en) * 2010-07-30 2012-03-15 Vestas Wind Systems A/S Cooled machining of resin impregnated fibrous sheet
CN103537724A (en) * 2013-09-18 2014-01-29 广州杰赛科技股份有限公司 Method for perforating multilayer printed board containing PTFE
US10052694B2 (en) 2016-05-04 2018-08-21 Kennametal Inc. Apparatus and method for cooling a cutting tool using super critical carbon dioxide

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3939374A1 (en) * 1989-11-29 1991-06-06 Rebo Plastic Gmbh & Co Kg Machining of thermoplastics - with application of liquefied gas coolant at the point of contact with machining tool

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3939374A1 (en) * 1989-11-29 1991-06-06 Rebo Plastic Gmbh & Co Kg Machining of thermoplastics - with application of liquefied gas coolant at the point of contact with machining tool

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DUBBELS Taschenbuch f. den Maschinenbaum Bd. 2, 12. Auflagem Springer-Verlag, 1966, S. 635/636 *
REBHAHN, D.: Entgroten mit frischen Stickstoff In: GAK, 12/1976-Jahrgang 29, S. 828-834 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2724337A1 (en) * 1994-09-09 1996-03-15 Anhydride Carbonique Ind System for cooling material to be machined
EP2289664A1 (en) * 2009-09-01 2011-03-02 Spanolux N.V. Div. Balterio Method of manufacturing a covering panel with a profiled edge
WO2011026864A2 (en) * 2009-09-01 2011-03-10 Spanolux N.V.- Div. Balterio Method of manufacturing a covering panel with a profiled edge
WO2011026864A3 (en) * 2009-09-01 2011-06-23 Spanolux N.V.- Div. Balterio Method of manufacturing a covering panel with a profiled edge
WO2011097970A1 (en) * 2010-02-09 2011-08-18 深南电路有限公司 Method and device for processing pcb
WO2012013193A3 (en) * 2010-07-30 2012-03-15 Vestas Wind Systems A/S Cooled machining of resin impregnated fibrous sheet
CN102958682A (en) * 2010-07-30 2013-03-06 维斯塔斯风力系统有限公司 Cooling machining of resin impregnation fibrous sheet
CN102958682B (en) * 2010-07-30 2016-01-20 维斯塔斯风力系统有限公司 To the cooling machining of the fibre sheet material of resin-dipping
US9914191B2 (en) 2010-07-30 2018-03-13 Vestas Wind Systems A/S Chamfering of laminate layers
CN103537724A (en) * 2013-09-18 2014-01-29 广州杰赛科技股份有限公司 Method for perforating multilayer printed board containing PTFE
US10052694B2 (en) 2016-05-04 2018-08-21 Kennametal Inc. Apparatus and method for cooling a cutting tool using super critical carbon dioxide

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OP8 Request for examination as to paragraph 44 patent law
8139 Disposal/non-payment of the annual fee