DE4237080A1 - Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material - Google Patents

Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material

Info

Publication number
DE4237080A1
DE4237080A1 DE19924237080 DE4237080A DE4237080A1 DE 4237080 A1 DE4237080 A1 DE 4237080A1 DE 19924237080 DE19924237080 DE 19924237080 DE 4237080 A DE4237080 A DE 4237080A DE 4237080 A1 DE4237080 A1 DE 4237080A1
Authority
DE
Germany
Prior art keywords
vapour
insulating material
thin film
interlayer
rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19924237080
Other languages
German (de)
Inventor
Des Erfinders Auf Nennung Verzicht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19924237080 priority Critical patent/DE4237080A1/en
Publication of DE4237080A1 publication Critical patent/DE4237080A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/051—Rolled

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

The chip is formed from layers of flexible thin film with the circuitry vapour-deposited on to them sufficiently thinly to enable the film to be bent and wound into a roll, with electrical connections projecting from its sides. A layer of insulating material is wound between the layers of film so that the circuits are mutually isolated when the roll is wound to a high packing density to make a compact chip. ADVANTAGE - Volume of chip is reduced so that more circuits can be compressed into small space.

Description

Die Erfindung betrifft ein Folien-IC nach dem Oberbegriff des Anspruchs 1. Das vorgegebene Folien-IC soll einen platzsparenden Aufbau von Halbleiterschaltungen ermöglichen. Es ist bekannt, daß handelsübliche IC durch ihren flachen Aufbau bedingt eine schwer zu unterschreitende Mindestgröße haben, was vor allem bei Mikroprozessoren Probleme bereitet. Der Erfindung liegt die Aufgabe zugrunde, den Platzbedarf eines IC zu verringern und somit das Unterbringen größerer Schaltleistungen auf kleinem Raum zu ermöglichen. Diese Aufgabe wird durch die im Patentan­ spruch 1 aufgeführten Merkmale gelöst. Ein Ausführungsbeispiel ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben. Es zeigenThe invention relates to a film IC according to the preamble of Claim 1. The specified film IC should save space Enable the construction of semiconductor circuits. It is known, that commercially available IC due to its flat structure requires a have a minimum size that is difficult to fall short of, what above all problems with microprocessors. The invention lies based on the task of reducing the space requirement of an IC and thus accommodating larger switching capacities on a small one To allow space. This task is accomplished by the in Patentan pronounced 1 solved characteristics. An embodiment is shown in the drawing and is described in more detail below described. Show it

Fig. 1 die Folie in nicht aufgerolltem Zustand, Fig. 2 das Folien-IC, Fig. 3 die Isolierschicht. Fig. 1, the film in a non-rolled up, Fig. 2, the film IC, Fig. 3, the insulating layer.

Claims (3)

1. Folien-IC aus mehreren Lagen gewickelten Schaltungsmaterials, dadurch gekennzeichnet, daß die Anschlüsse des gewickelten Chips an den Seiten der Rolle herausgeführt werden.1. Foil IC from several layers of wound circuit material, characterized in that the connections of the wound chip are led out on the sides of the roll. 2. Folien-IC nach Anspruch 1, dadurch gekennzeichnet, daß die auf das Folien-Trägermaterial aufgedampfte Schaltung so dünn ausgelegt wurde, daß sie biegsam und somit wickelbar ist.2. Foil IC according to claim 1, characterized in that the circuit evaporated onto the film substrate so thin was designed to be flexible and thus windable. 3. Folien-IC nach Anspruch 1, dadurch gekennzeichnet, daß zwischen dem Trägermaterial eine Isolierschicht eingewickelt ist.3. Foil IC according to claim 1, characterized in that between an insulating layer is wrapped around the carrier material.
DE19924237080 1992-11-03 1992-11-03 Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material Withdrawn DE4237080A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19924237080 DE4237080A1 (en) 1992-11-03 1992-11-03 Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19924237080 DE4237080A1 (en) 1992-11-03 1992-11-03 Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material

Publications (1)

Publication Number Publication Date
DE4237080A1 true DE4237080A1 (en) 1994-05-11

Family

ID=6471987

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19924237080 Withdrawn DE4237080A1 (en) 1992-11-03 1992-11-03 Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material

Country Status (1)

Country Link
DE (1) DE4237080A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19743365A1 (en) * 1997-09-30 1999-04-08 Siemens Ag Method for producing a multi-level wiring carrier (substrate), in particular for multichip modules
WO1999031943A1 (en) * 1997-12-18 1999-06-24 Michael Polus Circuit support packing and method for the production thereof
EP1023752A1 (en) * 1997-07-22 2000-08-02 Randice Lisa Altschul Disposable portable electronic devices and method of making

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1023752A1 (en) * 1997-07-22 2000-08-02 Randice Lisa Altschul Disposable portable electronic devices and method of making
EP1023752A4 (en) * 1997-07-22 2001-02-28 Randice Lisa Altschul Disposable portable electronic devices and method of making
DE19743365A1 (en) * 1997-09-30 1999-04-08 Siemens Ag Method for producing a multi-level wiring carrier (substrate), in particular for multichip modules
WO1999031943A1 (en) * 1997-12-18 1999-06-24 Michael Polus Circuit support packing and method for the production thereof

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Legal Events

Date Code Title Description
8133 Disposal/non-payment of the application fee