DE416422C - Process for producing a firmly adhering copper coating on aluminum - Google Patents

Process for producing a firmly adhering copper coating on aluminum

Info

Publication number
DE416422C
DE416422C DEG61418D DEG0061418D DE416422C DE 416422 C DE416422 C DE 416422C DE G61418 D DEG61418 D DE G61418D DE G0061418 D DEG0061418 D DE G0061418D DE 416422 C DE416422 C DE 416422C
Authority
DE
Germany
Prior art keywords
aluminum
copper
producing
firmly adhering
copper coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEG61418D
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DEG61418D priority Critical patent/DE416422C/en
Application granted granted Critical
Publication of DE416422C publication Critical patent/DE416422C/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Chemical Treatment Of Metals (AREA)

Description

Verfahren zur Erzeugung eines fest haftenden Kupferüberzuges auf Aluminium. Man hat bereits Aluminium zur Aufnahme galvanischer Niederschläge oder zum Löten in der-Weise vorbereitet, daß man auf der Aluminiumfläche eine Vorschicht von Kupfer erzeugte. Und zwar hat man schon diese Kupferschicht durch Behandeln mit Kupfersulfatlösung hergestellt, nachdem die Aluminiumfläche vorher der Einwirkung von Salpetersäure ausgesetzt war.Process for producing a firmly adhering copper coating on aluminum. You already have aluminum for receiving galvanic deposits or for soldering prepared in such a way that a pre-layer of copper is applied to the aluminum surface generated. You already have this copper layer by treating it with a copper sulphate solution made after the aluminum surface was previously exposed to nitric acid was exposed.

Nach Angaben des Erfinders führt dieses Verfahren zu keiner genügend dichten und fest haftenden Schicht. Dies gelingt aber ebenfalls nach Angaben des Erfinders, wenn man gemäß der vorliegenden Erfindung in folgender Weise verfährt. Zuerst wird der Aluminiumgegenstand auf kurze Zeit in eine kochende Lösung von Kupfernitrat gesteckt.According to the inventor, this method does not lead to sufficient results dense and firmly adhering layer. However, this also succeeds according to the Inventor when proceeding according to the present invention in the following manner. First, the aluminum object is briefly immersed in a boiling solution of copper nitrate plugged.

Das so vorbehandelte Stück bringt man dann nach kurzem Abspülen im frischen Wasser sofort in ein Bad von kochender, ziemlich konzentrierter Kupfersulfatlösung und läßt es hierin unter weiterem Kochen etwa eine viertel bis halbe Stunde. Es ist dann mit einem dichten, fest haftenden Kupferbelag überzogen, der sich leicht schleifen und polieren läßt, ohne zu zerreißen oder abzublättern. Es ist jedoch besonders darauf zu achten, daß das Stück vom Herausnehmen aus dem Kupfernitratbade bis zum Einlegen in das Kupfersulfatbad möglichst kurze Zeit der Luft ausgesetzt bleibt.After a short rinse, the piece that has been pretreated in this way is then taken to the fresh water immediately in a bath of boiling, fairly concentrated copper sulfate solution and leave it in it for about a quarter to a half hour while continuing to boil. It is then covered with a dense, firmly adhering copper coating that can easily be Can be grinded and polished without tearing or peeling. However, it is Pay special attention to the fact that the piece is removed from the copper nitrate bath exposed to air for as short a time as possible until it is placed in the copper sulphate bath remain.

Auf diese Kupferschicht läßt sich dann leicht der gewünschte metallische Überzug nach einem der bekannten Verfahren in beliebiger Dicke erzeugen.The desired metallic material can then easily be applied to this copper layer Produce coating according to one of the known methods in any thickness.

Ebenso ist es auf diese Weise möglich, Aluminium zu löten, indem man die erzeugte Kupferoberfläche durch Lot verbindet. Die Haftung ist eine metallische und sehr feste.It is also possible in this way to solder aluminum by the produced copper surface connects by solder. The adhesion is metallic and very solid.

Claims (1)

PATENTANSPRUCH: Verfahren zur Erzeugung eines fest haftenden Kupferüberzuges auf Aluminium durch Behandlung mit Kupfersulfatlösimg, dadurch gekennzeichnet, daß die Kupfersulfatlösung in kochendem und konzentriertem Zustand verwendet wird und der Aluminiumgegenstand vor Einbringen in die Kuptersulfatlösung kurze Zeit mit kochender Kupfernitratlösung behandelt war.PATENT CLAIM: Process for producing a firmly adhering copper coating on aluminum by treatment with copper sulfate solution, characterized in that the copper sulphate solution is used in a boiling and concentrated state and the aluminum object with it for a short time before it is placed in the copper sulfate solution boiling copper nitrate solution.
DEG61418D 1924-05-16 1924-05-16 Process for producing a firmly adhering copper coating on aluminum Expired DE416422C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEG61418D DE416422C (en) 1924-05-16 1924-05-16 Process for producing a firmly adhering copper coating on aluminum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEG61418D DE416422C (en) 1924-05-16 1924-05-16 Process for producing a firmly adhering copper coating on aluminum

Publications (1)

Publication Number Publication Date
DE416422C true DE416422C (en) 1925-07-15

Family

ID=7132733

Family Applications (1)

Application Number Title Priority Date Filing Date
DEG61418D Expired DE416422C (en) 1924-05-16 1924-05-16 Process for producing a firmly adhering copper coating on aluminum

Country Status (1)

Country Link
DE (1) DE416422C (en)

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