DE4137232C1 - - Google Patents

Info

Publication number
DE4137232C1
DE4137232C1 DE4137232A DE4137232A DE4137232C1 DE 4137232 C1 DE4137232 C1 DE 4137232C1 DE 4137232 A DE4137232 A DE 4137232A DE 4137232 A DE4137232 A DE 4137232A DE 4137232 C1 DE4137232 C1 DE 4137232C1
Authority
DE
Germany
Prior art keywords
temperature
radiation
bond
laser
hold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4137232A
Other languages
German (de)
English (en)
Inventor
Werner Dipl.-Chem. Dr. 7900 Ulm De Moeller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Deutsche Aerospace AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Aerospace AG filed Critical Deutsche Aerospace AG
Priority to DE4137232A priority Critical patent/DE4137232C1/de
Priority to FR9213488A priority patent/FR2683474B1/fr
Priority to GB9223711A priority patent/GB2261622B/en
Application granted granted Critical
Publication of DE4137232C1 publication Critical patent/DE4137232C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
DE4137232A 1991-11-13 1991-11-13 Expired - Fee Related DE4137232C1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE4137232A DE4137232C1 (ja) 1991-11-13 1991-11-13
FR9213488A FR2683474B1 (fr) 1991-11-13 1992-11-09 Procede et dispositif de commande de temperature pour le micro-usinage par laser de materiaux.
GB9223711A GB2261622B (en) 1991-11-13 1992-11-12 Method of and apparatus for temperature control in laser micro-processing of material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4137232A DE4137232C1 (ja) 1991-11-13 1991-11-13

Publications (1)

Publication Number Publication Date
DE4137232C1 true DE4137232C1 (ja) 1993-05-06

Family

ID=6444647

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4137232A Expired - Fee Related DE4137232C1 (ja) 1991-11-13 1991-11-13

Country Status (3)

Country Link
DE (1) DE4137232C1 (ja)
FR (1) FR2683474B1 (ja)
GB (1) GB2261622B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1806199A2 (en) * 2006-01-10 2007-07-11 Honeywell International Inc. System and Method for Blind Laser Brazing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112345115B (zh) * 2020-09-17 2021-09-14 燕山大学 一种基于双发光中心纳米晶近红外荧光的高灵敏测温方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4341942A (en) * 1978-10-31 1982-07-27 International Business Machines Corporation Method of bonding wires to passivated chip microcircuit conductors
US4845354A (en) * 1988-03-08 1989-07-04 International Business Machines Corporation Process control for laser wire bonding
US4873414A (en) * 1988-06-13 1989-10-10 Rolls Royce Inc. Laser drilling of components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5565287A (en) * 1978-06-28 1980-05-16 Teijin Ltd Heat-sensitive fluorescent material
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
DE4105875C1 (ja) * 1991-02-25 1992-08-13 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De
DE4105874C1 (ja) * 1991-02-25 1992-07-30 Messerschmitt-Boelkow-Blohm Gmbh, 8012 Ottobrunn, De

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4341942A (en) * 1978-10-31 1982-07-27 International Business Machines Corporation Method of bonding wires to passivated chip microcircuit conductors
US4845354A (en) * 1988-03-08 1989-07-04 International Business Machines Corporation Process control for laser wire bonding
US4873414A (en) * 1988-06-13 1989-10-10 Rolls Royce Inc. Laser drilling of components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1806199A2 (en) * 2006-01-10 2007-07-11 Honeywell International Inc. System and Method for Blind Laser Brazing
EP1806199A3 (en) * 2006-01-10 2007-08-22 Honeywell International Inc. System and Method for Blind Laser Brazing

Also Published As

Publication number Publication date
GB2261622A (en) 1993-05-26
FR2683474B1 (fr) 1995-11-24
FR2683474A1 (fr) 1993-05-14
GB2261622B (en) 1995-01-11
GB9223711D0 (en) 1992-12-23

Similar Documents

Publication Publication Date Title
DE3851767T2 (de) Verfahren zum Sintern, Verfahren zur Schmelzschweissung, Höckerherstellung und Fühler.
DE3587109T2 (de) Optische temperaturmesstechnik.
DE102013013296B4 (de) Konverter-Kühlkörperverbund mit metallischer Lotverbindung und Verfahren zu dessen Herstellung
EP2803961B1 (de) Hermetisch gasdichtes optoelektronisches oder elektrooptisches Bauteil sowie Verfahren zu seiner Herstellung
DE2900356A1 (de) Halbleiterlaser-vorrichtung
DE69508713T2 (de) Verfahren zur Kennzeichnung von integrierten Schaltungen mit einem Laser
DE4421065A1 (de) Vorrichtung zur Temperaturmessung
DE102010016628A1 (de) Verfahren und Anordnung zum stoffschlüssigen Verbinden von Materialien
DE3701013C2 (ja)
DE102012107578B4 (de) Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements sowie Messvorrichtung mit einem lichtemittierenden, optoelektronischen Bauelement
DE4137232C1 (ja)
EP0308749A2 (de) Elektrooptische Baugruppe
EP4028198A1 (de) Vorrichtung zum erwärmen und bestimmen einer ist-temperatur eines bondwerkzeugs eines ultraschallbonders
EP2288902B1 (de) Vorrichtung zur bestimmung der elementbelegung auf einer glasoberfläche mittels fluoreszenz
DE2742556C2 (ja)
DE3903860A1 (de) Verfahren und vorrichtung zum lasermikroloeten
DE2104264A1 (de) Thermolumineszenz Ablesegerat
DE69029492T2 (de) Bilderzeugender Schirm für die Elektrophorese und Vorrichtung zur Bildwiedergabe
EP1711784A1 (de) Verfahren und vorrichtung zum ermitteln von schwingungen an einem rotierenden schaufelrad einer turbine
DE3739333C2 (de) Verfahren zur Herstellung von Klebeverbindungen für Elektronik- und Mikroelektronikanwendungen
EP2795274B1 (de) Infrarotlichtsensorchip mit hoher messgenauigkeit und verfahren zum herstellen des infrarotlichtsensorchips
DE3390451C2 (de) Verfahren zum Laser-L¦ten
JP3083120B2 (ja) はんだ濡れ性評価方法とその装置
WO2021259635A1 (de) Verfahren zur überwachung eines laserlötprozesses und laserlötsystem unter verwendung einer spektroskopeinrichtung
DE102013204470A1 (de) Wärmeübergangsmessgerät

Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILB

8320 Willingness to grant licenses declared (paragraph 23)
8339 Ceased/non-payment of the annual fee