DE3935272A1 - Kuehlblech fuer elektronische bauelemente - Google Patents

Kuehlblech fuer elektronische bauelemente

Info

Publication number
DE3935272A1
DE3935272A1 DE3935272A DE3935272A DE3935272A1 DE 3935272 A1 DE3935272 A1 DE 3935272A1 DE 3935272 A DE3935272 A DE 3935272A DE 3935272 A DE3935272 A DE 3935272A DE 3935272 A1 DE3935272 A1 DE 3935272A1
Authority
DE
Germany
Prior art keywords
cooling plate
frame part
circuit board
heat sink
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3935272A
Other languages
German (de)
English (en)
Other versions
DE3935272C2 (https=
Inventor
Heinz Dipl Ing Kraus
Heinrich Dipl Ing Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Loewe Opta GmbH
Original Assignee
Loewe Opta GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loewe Opta GmbH filed Critical Loewe Opta GmbH
Priority to DE3935272A priority Critical patent/DE3935272A1/de
Publication of DE3935272A1 publication Critical patent/DE3935272A1/de
Application granted granted Critical
Publication of DE3935272C2 publication Critical patent/DE3935272C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE3935272A 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente Granted DE3935272A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3935272A DE3935272A1 (de) 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3935272A DE3935272A1 (de) 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente

Publications (2)

Publication Number Publication Date
DE3935272A1 true DE3935272A1 (de) 1991-04-25
DE3935272C2 DE3935272C2 (https=) 1991-10-10

Family

ID=6392017

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3935272A Granted DE3935272A1 (de) 1989-10-24 1989-10-24 Kuehlblech fuer elektronische bauelemente

Country Status (1)

Country Link
DE (1) DE3935272A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416460C2 (de) * 1994-05-10 1996-04-11 Hella Kg Hueck & Co Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
DE7908303U1 (de) * 1979-03-24 1979-07-12 Loewe Opta Gmbh, 1000 Berlin Halter für Kühlbleche für elektronische Bauteile in einem Gerätechassis
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
DE8707370U1 (de) * 1987-05-22 1987-07-23 TA Triumph-Adler AG, 8500 Nürnberg Vorrichtung zum Befestigen eines elektronischen Bauelementes an einem Kühlblech

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
DE7908303U1 (de) * 1979-03-24 1979-07-12 Loewe Opta Gmbh, 1000 Berlin Halter für Kühlbleche für elektronische Bauteile in einem Gerätechassis
DE8707370U1 (de) * 1987-05-22 1987-07-23 TA Triumph-Adler AG, 8500 Nürnberg Vorrichtung zum Befestigen eines elektronischen Bauelementes an einem Kühlblech

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor

Also Published As

Publication number Publication date
DE3935272C2 (https=) 1991-10-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee