DE3882035D1 - Verfahren zur packung eines mikrowellen-rohrmodulators. - Google Patents
Verfahren zur packung eines mikrowellen-rohrmodulators.Info
- Publication number
- DE3882035D1 DE3882035D1 DE8888310282T DE3882035T DE3882035D1 DE 3882035 D1 DE3882035 D1 DE 3882035D1 DE 8888310282 T DE8888310282 T DE 8888310282T DE 3882035 T DE3882035 T DE 3882035T DE 3882035 D1 DE3882035 D1 DE 3882035D1
- Authority
- DE
- Germany
- Prior art keywords
- packing
- microwave tube
- tube modulator
- modulator
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Amplifiers (AREA)
- Constitution Of High-Frequency Heating (AREA)
- Amplitude Modulation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/156,175 US4841258A (en) | 1988-02-16 | 1988-02-16 | Method for packaging a microwave tube modulator |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3882035D1 true DE3882035D1 (de) | 1993-07-29 |
DE3882035T2 DE3882035T2 (de) | 1993-09-30 |
Family
ID=22558430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88310282T Expired - Fee Related DE3882035T2 (de) | 1988-02-16 | 1988-11-01 | Verfahren zur Packung eines Mikrowellen-Rohrmodulators. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4841258A (de) |
EP (1) | EP0328815B1 (de) |
CA (1) | CA1282467C (de) |
DE (1) | DE3882035T2 (de) |
IL (1) | IL88143A (de) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4577166A (en) * | 1984-08-22 | 1986-03-18 | The United States Of America As Represented By The Secretary Of The Air Force | Miniature high performance pulsed modulator apparatus |
US4584595A (en) * | 1985-02-07 | 1986-04-22 | Reliance Electric Company | Arrangement of field effect transistors for operation in the switched mode at high frequency |
JPS62150871A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | 半導体装置 |
-
1988
- 1988-02-16 US US07/156,175 patent/US4841258A/en not_active Expired - Lifetime
- 1988-10-25 IL IL8888143A patent/IL88143A/xx not_active IP Right Cessation
- 1988-11-01 DE DE88310282T patent/DE3882035T2/de not_active Expired - Fee Related
- 1988-11-01 EP EP88310282A patent/EP0328815B1/de not_active Expired - Lifetime
- 1988-11-07 CA CA000582433A patent/CA1282467C/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
IL88143A0 (en) | 1989-06-30 |
IL88143A (en) | 1992-02-16 |
DE3882035T2 (de) | 1993-09-30 |
CA1282467C (en) | 1991-04-02 |
EP0328815B1 (de) | 1993-06-23 |
US4841258A (en) | 1989-06-20 |
EP0328815A2 (de) | 1989-08-23 |
EP0328815A3 (en) | 1990-04-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |