DE3804070A1 - Electroplating installation for printed-circuit boards - Google Patents

Electroplating installation for printed-circuit boards

Info

Publication number
DE3804070A1
DE3804070A1 DE3804070A DE3804070A DE3804070A1 DE 3804070 A1 DE3804070 A1 DE 3804070A1 DE 3804070 A DE3804070 A DE 3804070A DE 3804070 A DE3804070 A DE 3804070A DE 3804070 A1 DE3804070 A1 DE 3804070A1
Authority
DE
Germany
Prior art keywords
circuit boards
printed
electroplating
anodes
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3804070A
Other languages
German (de)
Other versions
DE3804070C3 (en
DE3804070C2 (en
Inventor
Hans-Hermann Di Merkenschlager
Gergely Ing Grad Szolnoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE3804070A priority Critical patent/DE3804070C3/en
Publication of DE3804070A1 publication Critical patent/DE3804070A1/en
Application granted granted Critical
Publication of DE3804070C2 publication Critical patent/DE3804070C2/de
Publication of DE3804070C3 publication Critical patent/DE3804070C3/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

The invention relates to an electroplating installation for printed-circuit boards containing through-connections (interfacial connections, feedthroughs), stationary (fixed) anodes and cathodes. During electroplating, hitherto either the articles to be electroplated, the anodes or the electrolyte were moved. This, however, involves very complex construction. By arranging nozzles which are moved directly past the surface of the articles to be electroplated, an improvement in the through-metallization (through-plating) of printed-circuit boards is achieved. <IMAGE>

Description

Die Erfindung betrifft eine Galvanisieranlage für Leiterplatten mit stationären Anoden und Kathoden.The invention relates to an electroplating system for printed circuit boards with stationary anodes and cathodes.

Zur Durchmetallisierung von Leiterplatten wird das Galvanisier­ gut z.B. die Leiterplatte in einen zwischen zwei Anoden befind­ lichen Elektrolyten eingehängt wo sie gleichzeitig die Kathode darstellt. Um die Durchkontaktierung zu beschleunigen und zu verbessern kann dabei entweder der Elektrolyt, die Kathode oder die Anode bewegt werden.Electroplating is used to metallize printed circuit boards good e.g. the circuit board is located in between two anodes electrolytes hooked up where they are simultaneously the cathode represents. To accelerate the via and to can either improve the electrolyte, the cathode or the anode is moved.

Die Bewegung des Elektrolyten kann entweder mechanisch oder durch Lufteinblasung erfolgen.The movement of the electrolyte can either be mechanical or by blowing in air.

In beiden Fällen ist ein beachtlicher apparativer Aufwand er­ forderlich.In both cases, it requires considerable equipment conducive.

Aufgabe der vorliegenden Erfindung ist es, eine Galvanikanlage zu schaffen, bei der die Durchmetallisierung von Leiterplatten unter Verrringerung des apparativen Aufwandes verbessert wird.The object of the present invention is a galvanic system to create the through-metallization of printed circuit boards is improved while reducing the outlay on equipment.

Zur Lösung dieser Aufgabe wird die Galvanikanlage gemäß der Erfindung derart ausgebildet, daß im Elektrolyten bewegliche Düsen so angeordnet sind, daß sie unmittelbar an der Oberfläche des als Kathode dienenden Galvanisiergutes in wechselnder Rich­ tung entlang fahrbar sind.To solve this problem, the electroplating system according to the Invention designed such that movable in the electrolyte Nozzles are arranged so that they are directly on the surface of the plating material serving as cathode in alternating directions are mobile along.

Durch diese Maßnahme wird erreicht, daß im Zeittakt der Frequenz der Düsenbewegung der Elektrolyt in den Bohrungen voll erneuert wird und für die Metallabscheidung frischer Elektro­ lyt zur Verfügung steht. Die bisher erforderliche Elektrolyt- und Warenbewegungsvorrichtung kann entfallen, was eine wesent­ liche Vereinfachung der Galvanikanlage zur Folge hat. Die Anla­ ge ist besonders geeignet für die Durchkontaktierung von Lei­ terplatten, bei denen das Verhältnis Lochdurchmesser zur Lei­ terplattendicke besonders ungünstig ist.This measure ensures that the Frequency of nozzle movement of the electrolyte in the holes is full is renewed and for the deposition of fresh electrical metal lyt is available. The previously required electrolyte and goods moving device can be omitted, which is an essential  simplification of the electroplating system. The plant ge is particularly suitable for the through-plating of lei terplatten in which the ratio of hole diameter to Lei plate thickness is particularly unfavorable.

Um günstige Flutungsverhältnisse zu erreichen, können die Düsen auch schräg zur Kathode angeordnet sein.The nozzles can be used to achieve favorable flooding conditions also be arranged at an angle to the cathode.

Anhand des Ausführungsbeispiels wird die Erfindung näher er­ läutert.Based on the embodiment, the invention he he purifies.

Die Figur zeigt einen Galvanisierbottich, bei dem links und rechts entlang den Seitenwänden stationäre Anoden 1 ange­ ordnet sind. In der Mitte zwischen den beiden Anoden befindet sich das als Kathode 2 wirkende Galvanisiergut. Kathode und Anode sind vom Elektrolyten 3 umgeben. In unmittelbarer Nähe der Kathodenoberfläche sind bewegliche Düsen 4 angeordnet die mit einstellbarer Frequenz an der Galvanisiergutoberfläche auf und ab bewegt werden.The figure shows a galvanizing tub, in which stationary anodes 1 are arranged on the left and right along the side walls. The electroplating material acting as cathode 2 is located in the middle between the two anodes. The cathode and anode are surrounded by the electrolyte 3 . Movable nozzles 4 are arranged in the immediate vicinity of the cathode surface and are moved up and down on the surface of the electroplated material with an adjustable frequency.

Claims (2)

1. Galvanisieranlage für Leiterplatten mit stationären Anoden und Kathoden dadurch gekennzeichnet, daß im Elektrolyten bewegliche Düsen (4) so angeordnet sind, daß sie unmittelbar an der Oberfläche des als Kathode (2) die­ nenden Galvanisiergutes in wechselnder Richtung entlang fahrbar sind.1. Electroplating system for printed circuit boards with stationary anodes and cathodes, characterized in that movable nozzles ( 4 ) are arranged in the electrolyte so that they are directly on the surface of the as the cathode ( 2 ) the nating electroplating material can be moved along in an alternating direction. 2. Galvanisieranlage nach Anspruch 1, dadurch ge­ kennzeichnet, daß die Düsen (4) schräg zur Katho­ de (2) angeordnet sind.2. Electroplating system according to claim 1, characterized in that the nozzles ( 4 ) are arranged obliquely to the Katho de ( 2 ).
DE3804070A 1988-02-10 1988-02-10 Electroplating system for printed circuit boards Expired - Fee Related DE3804070C3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3804070A DE3804070C3 (en) 1988-02-10 1988-02-10 Electroplating system for printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3804070A DE3804070C3 (en) 1988-02-10 1988-02-10 Electroplating system for printed circuit boards

Publications (3)

Publication Number Publication Date
DE3804070A1 true DE3804070A1 (en) 1989-08-17
DE3804070C2 DE3804070C2 (en) 1992-06-04
DE3804070C3 DE3804070C3 (en) 1994-02-24

Family

ID=6347085

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3804070A Expired - Fee Related DE3804070C3 (en) 1988-02-10 1988-02-10 Electroplating system for printed circuit boards

Country Status (1)

Country Link
DE (1) DE3804070C3 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008148578A1 (en) * 2007-06-06 2008-12-11 Atotech Deutschland Gmbh Apparatus and method for the electrolytic treatment of a plate-shaped product

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1431022A (en) * 1921-03-02 1922-10-03 Jr Thomas H Mumford Agitating apparatus for tanks
CH215409A (en) * 1939-11-03 1941-06-30 Rausser Emil Method and device for the production of galvanic coatings.
US4372825A (en) * 1981-11-06 1983-02-08 Micro-Plate, Inc. Plating sparger and method
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
DE3317970A1 (en) * 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen DEVICE AND METHOD FOR GALVANIC DEPOSITION OF METALS
DE3643746A1 (en) * 1986-12-20 1988-06-30 Stohrer Doduco Gmbh & Co DIVING METHOD AND DEVICE FOR ELECTROLYTICALLY COATING PLATES, ESPECIALLY ELECTRIC CIRCUITS

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1431022A (en) * 1921-03-02 1922-10-03 Jr Thomas H Mumford Agitating apparatus for tanks
CH215409A (en) * 1939-11-03 1941-06-30 Rausser Emil Method and device for the production of galvanic coatings.
US4372825A (en) * 1981-11-06 1983-02-08 Micro-Plate, Inc. Plating sparger and method
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
DE3317970A1 (en) * 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen DEVICE AND METHOD FOR GALVANIC DEPOSITION OF METALS
DE3643746A1 (en) * 1986-12-20 1988-06-30 Stohrer Doduco Gmbh & Co DIVING METHOD AND DEVICE FOR ELECTROLYTICALLY COATING PLATES, ESPECIALLY ELECTRIC CIRCUITS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008148578A1 (en) * 2007-06-06 2008-12-11 Atotech Deutschland Gmbh Apparatus and method for the electrolytic treatment of a plate-shaped product
US8545687B2 (en) 2007-06-06 2013-10-01 Atotech Deutschland Gmbh Apparatus and method for the electrolytic treatment of a plate-shaped product

Also Published As

Publication number Publication date
DE3804070C3 (en) 1994-02-24
DE3804070C2 (en) 1992-06-04

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG, 4790 PADER

8366 Restricted maintained after opposition proceedings
8305 Restricted maintenance of patent after opposition
D4 Patent maintained restricted
8339 Ceased/non-payment of the annual fee