DE2925367A1 - Chemical or electroplating appts. - for depositing metal in holes in printed circuit boards via several solns. fed successively through hole - Google Patents

Chemical or electroplating appts. - for depositing metal in holes in printed circuit boards via several solns. fed successively through hole

Info

Publication number
DE2925367A1
DE2925367A1 DE19792925367 DE2925367A DE2925367A1 DE 2925367 A1 DE2925367 A1 DE 2925367A1 DE 19792925367 DE19792925367 DE 19792925367 DE 2925367 A DE2925367 A DE 2925367A DE 2925367 A1 DE2925367 A1 DE 2925367A1
Authority
DE
Germany
Prior art keywords
holes
printed circuit
hole
chemical
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19792925367
Other languages
German (de)
Other versions
DE2925367C2 (en
Inventor
Gerhard Balla
Wolfgang Gebauer
Georg Mueller
Edgar Roith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19792925367 priority Critical patent/DE2925367C2/en
Publication of DE2925367A1 publication Critical patent/DE2925367A1/en
Application granted granted Critical
Publication of DE2925367C2 publication Critical patent/DE2925367C2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle

Abstract

A nozzle is aligned on each side of the board so the nozzles are coaxial with a hole to be metallised; and a control appts. is connected to each nozzle. The two control units are used for the selective feeding of liqs. via pumps from storage tanks, so each liq. flows through the hole in the board and is then returned to its tank, i.e. each liq. flows in a closed circuit. One of the nozzles contains an anode, which can be connected to a d.c. supply when electroplating is required. Modern boards may contain up to 25 holes/sq.cm; and not all the holes are completely metallised when they are pressed in laminated boards. The invention is used to correct any faulty boards, i.e. where some holes are not completely metallised.

Description

Vorrichtung zur chemischen und galvanischen Metallab-Device for chemical and galvanic metal removal

scheidung an einzelnen Bohrungswandungen von Leiterplatten.separation on the individual bore walls of printed circuit boards.

Die Erfindung betrifft eine Vorrichtung zur chemischen und galvanischen Metallabscheidung an einzelnen Bohrungswandungen von Leiterplatten.The invention relates to a device for chemical and galvanic Metal deposition on individual bore walls of printed circuit boards.

Bei der Herstellung von hochwertigen Leiterplatten, die zur zur Zeit bis zu25 Bohrungen /cm aufweisen können, kommt es in der Praxis vor, daß einzelne Bohrungen oder auch nur eine einzige Bohrung nicht metallisiert wurde, bzw. daß die Metallisierung beim Fertigungsdurchlauf aus geätzt wird.In the production of high quality printed circuit boards at present can have up to 25 holes / cm, it happens in practice that individual Holes or just a single hole was not metallized, or that the metallization is etched off during the production run.

Insbesondere bei der Anwendung des sogenannten Tenting-Verfahrens, bei dem die Durchkontaktierungen beim Ätzprozeß nur durch eine Resistfolie abgedeckt sind, ist diese Gefahr#besonders groß.Especially when using the so-called tenting process, in which the plated-through holes are only covered by a resist film during the etching process this danger is particularly great.

Leiterplatten, die einen wesentlichen Teil der Fertigungsschritte bereits durchlaufen haben, müssen verworfen werden.Printed circuit boards, which are an essential part of the manufacturing steps have already passed through must be discarded.

Aufgabe der vorliegenden Erfindung ist es, eine Vorrichtung zur Einzeldurchkontaktierung für fehlerhaft durchkontaktierte Bohrungen von Leiterplatten zu schaffen.The object of the present invention is to provide a device for single through-hole plating for incorrectly plated through holes in printed circuit boards.

Zur Lösung dieser Aufgabe wird die Vorrichtung gemäß der Erfindung derart ausgebildet, daß ein Steuerkopf vorgesehen ist, der auf der zu metallisierenden Leiterplatte aufgesetzt und auf die jeweilige Bohrung justiert wird, daß mittels einer Steuerenrichtung, die für die chemische Kupferabscheidung notwendigen Medien über Förderpumpen, sowie eine Zulauf- und eine Ablaufdüse getrennt zu- bzw. abgeführt werden, und daß zur galvanischen Kupferverstärkung eine Anode am Steuerkopf angebracht ist, die mit einem elektrischen Gleichstromkreis verbindbar ist.The device according to the invention is used to achieve this object designed such that a control head is provided on the to be metallized Printed circuit board is placed and adjusted to the respective hole that means a control direction, the media necessary for the chemical copper deposition Separately supplied and discharged via feed pumps as well as an inlet and an outlet nozzle and that an anode is attached to the control head for galvanic copper reinforcement which can be connected to an electrical direct current circuit.

Durch diese Maßnahmen erhält man ein rationelles Verfahren, das es in einfacher Weise ermöglicht, fehlerhaft durchkontaktierte Bohrungen nachträglich gänzlich durchzukontaktieren, so daß der Ausschuß an fehlerhaft durchkontaktierten Leiterplatten erheblich verringert wird.These measures give a rational process that it in a simple way enables faulty plated-through holes to be retrofitted to be completely plated through, so that the rejects of faulty plated through holes Printed circuit boards is significantly reduced.

Anhand der schematischen Darstellung nach der FIG wird die Erfindung näher erläutert.The invention is illustrated by the schematic representation according to the FIG explained in more detail.

Auf der Leiterplatte 15, die eine nicht vollständig oder gar nicht durchkontaktierte Bohrung 13 enthält, wird ein Steuerkopf, der eine Zulaufdüse 11 und eine Ablaufdüse 12 enthält, aufgebracht und auf die Bohrung Eine nicht näher dargestellte Steuereinrichtung 9, 10 sorgt dafür, daß die für den Prozeß der chemischen Kupferabscheidung notwendigen Medien mittels Förderpumpen Ib bis 7b getrennt zugeführt bzw. abgeführt werden. Die entsprechenden Medien sind in den Vorratsgefäßen 1a bis 7a gespeichert. Zum Wegspülen von Rückständen ist ein eigener Spülkreis mit einem Absperrventil 8 für den Spülwasserzulauf vorgesehen. Das Spülwasser wird über den Ablauf 16 wieder abgeführt.On the circuit board 15, which one is incomplete or not at all Contains plated-through hole 13, a control head, which has an inlet nozzle 11 and includes a drain nozzle 12 applied to and onto the bore One Control device 9, 10, not shown in more detail, ensures that the for the process the chemical copper deposition necessary media by means of feed pumps Ib to 7b can be supplied or discharged separately. The corresponding media are in the Storage vessels 1a to 7a are stored. To rinse away residues is a separate one Rinsing circuit provided with a shut-off valve 8 for the rinsing water supply. The rinse water is discharged again via the drain 16.

Ein eigener Gleichstromkreis 14 sorgt dafür, daß die am Steuerkopf befindliche Anode 17 mit Gleichstrom versorgt wird.A separate DC circuit 14 ensures that the control head located anode 17 is supplied with direct current.

1 Patentanspruch 1 FIG1 claim 1 FIG

Claims (1)

Patentanspruch Vorrichtung zur chemischen und galvanischen Metallabscheidung an einzelnen Bohrungswandungen von Leiterplatten, d a d u r c h g e k e n n z e i c h n e t daß ein Steuerkopf vorgesehen ist, der auf der zu metallisierenden Leiterplatte (15) aufgesetzt und auf die jeweilige Bohrung (13) justiert wird, daß mittels einer Steuereinrichtung (9, 10) die für die chemische Kupferabscheidung notwendigen Medien über Förderpumpen (Ib bis 7b),sowie eine Zulauf- (ii) und eine Ablaufdüse (12) getrennt zu- bzw. abgeführt werden, und daß zur galvanischen Kupferverstärkung eine Anode (17) am Steuerkopf angebracht ist, die mit einem elektrischen Gleichstromkreis (14) verbindbar ist.Device for chemical and galvanic metal deposition on individual bore walls of printed circuit boards i c h n e t that a control head is provided on the printed circuit board to be metallized (15) is placed and adjusted to the respective bore (13) that by means of a Control device (9, 10) the media necessary for the chemical copper deposition Separately via feed pumps (Ib to 7b) and an inlet nozzle (ii) and an outlet nozzle (12) are supplied or discharged, and that an anode for galvanic copper reinforcement (17) is attached to the control head, which is connected to an electrical direct current circuit (14) is connectable.
DE19792925367 1979-06-22 1979-06-22 Device for chemical and galvanic metal deposition on individual bore walls of printed circuit boards Expired DE2925367C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19792925367 DE2925367C2 (en) 1979-06-22 1979-06-22 Device for chemical and galvanic metal deposition on individual bore walls of printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792925367 DE2925367C2 (en) 1979-06-22 1979-06-22 Device for chemical and galvanic metal deposition on individual bore walls of printed circuit boards

Publications (2)

Publication Number Publication Date
DE2925367A1 true DE2925367A1 (en) 1981-01-15
DE2925367C2 DE2925367C2 (en) 1982-06-09

Family

ID=6073954

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19792925367 Expired DE2925367C2 (en) 1979-06-22 1979-06-22 Device for chemical and galvanic metal deposition on individual bore walls of printed circuit boards

Country Status (1)

Country Link
DE (1) DE2925367C2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0169456A2 (en) * 1984-07-26 1986-01-29 International Business Machines Corporation Method of eliminating short circuits in electrical circuitry
WO1989010680A1 (en) * 1988-04-22 1989-11-02 Hans Höllmüller Maschinenbau GmbH & Co Machine for cleaning and/or rinsing holes in printed circuit boards

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3916694A1 (en) * 1989-05-23 1990-11-29 Schering Ag ARRANGEMENT FOR CHEMICAL TREATMENT AND / OR CLEANING OF GOODS, ESPECIALLY BOLTED PCBS AND RELATED METHOD

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0169456A2 (en) * 1984-07-26 1986-01-29 International Business Machines Corporation Method of eliminating short circuits in electrical circuitry
EP0169456A3 (en) * 1984-07-26 1987-08-05 International Business Machines Corporation Method and apparatus for eliminating short circuits on electrical circuitry
WO1989010680A1 (en) * 1988-04-22 1989-11-02 Hans Höllmüller Maschinenbau GmbH & Co Machine for cleaning and/or rinsing holes in printed circuit boards

Also Published As

Publication number Publication date
DE2925367C2 (en) 1982-06-09

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8381 Inventor (new situation)

Free format text: BALLA, GERHARD GEBAUER, WOLFGANG, 8900 AUGSBURG, DE MUELLER, GEORG, 8901 RETTENBERGEN, DE ROITH, EDGAR, 8901 KOENIGSBRUNN, DE

8327 Change in the person/name/address of the patent owner

Owner name: MUELLER, GEORG, 86368 GERSTHOFEN, DE

8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE

8339 Ceased/non-payment of the annual fee