DE3787429D1 - Minimierung von Anschlussinseln des Typs "Engineering Change". - Google Patents

Minimierung von Anschlussinseln des Typs "Engineering Change".

Info

Publication number
DE3787429D1
DE3787429D1 DE87107230T DE3787429T DE3787429D1 DE 3787429 D1 DE3787429 D1 DE 3787429D1 DE 87107230 T DE87107230 T DE 87107230T DE 3787429 T DE3787429 T DE 3787429T DE 3787429 D1 DE3787429 D1 DE 3787429D1
Authority
DE
Germany
Prior art keywords
minimization
connection terminals
engineering change
engineering
change
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87107230T
Other languages
English (en)
Other versions
DE3787429T2 (de
Inventor
Harsaran Singh Bhatia
Mario Enrique Ecker
Harry Jordan Jones
Shashi Dhar Malaviya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3787429D1 publication Critical patent/DE3787429D1/de
Publication of DE3787429T2 publication Critical patent/DE3787429T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/22—Means for limiting or controlling the pin/gate ratio
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382—Adaptable interconnections, e.g. for engineering changes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
DE87107230T 1986-07-03 1987-05-19 Minimierung von Anschlussinseln des Typs "Engineering Change". Expired - Fee Related DE3787429T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/881,755 US4746815A (en) 1986-07-03 1986-07-03 Electronic EC for minimizing EC pads

Publications (2)

Publication Number Publication Date
DE3787429D1 true DE3787429D1 (de) 1993-10-21
DE3787429T2 DE3787429T2 (de) 1994-04-21

Family

ID=25379140

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87107230T Expired - Fee Related DE3787429T2 (de) 1986-07-03 1987-05-19 Minimierung von Anschlussinseln des Typs "Engineering Change".

Country Status (4)

Country Link
US (1) US4746815A (de)
EP (1) EP0257201B1 (de)
JP (1) JPH0744222B2 (de)
DE (1) DE3787429T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6348854A (ja) * 1986-08-19 1988-03-01 Toshiba Corp システムｌｓｉ
US4866309A (en) * 1988-07-18 1989-09-12 Western Digital Corporation Multiplexed bus architecture for configuration sensing
USRE36443E (en) * 1988-10-31 1999-12-14 Sgs-Thomson Microelectronics, Inc. Dialer with internal option select circuit programmed with externally hardwired address
US5060116A (en) * 1990-04-20 1991-10-22 Grobman Warren D Electronics system with direct write engineering change capability
US5243140A (en) * 1991-10-04 1993-09-07 International Business Machines Corporation Direct distribution repair and engineering change system
US5294754A (en) * 1992-12-24 1994-03-15 Iternational Business Machines Corporation Direct write EC single metal layer
US7299102B2 (en) * 2004-12-02 2007-11-20 Norman Ken Ouchi Method and system for engineering change implementation
US8002760B2 (en) * 2005-08-02 2011-08-23 The Procter & Gamble Company Barrier cuff for a unitary disposable absorbent article having intermediate bond for sustained fit
CN108574484B (zh) * 2017-03-08 2021-05-11 深圳三地一芯电子有限责任公司 一种接口电路、包含接口电路的芯片及其制作方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3170071A (en) * 1960-03-30 1965-02-16 Ibm Error correction device utilizing spare substitution
US3815025A (en) * 1971-10-18 1974-06-04 Ibm Large-scale integrated circuit testing structure
JPS56118352A (en) * 1980-02-22 1981-09-17 Fujitsu Ltd Preparation of output circuit of integrated circuit
US4445048A (en) * 1980-04-04 1984-04-24 Rolm Corporation High speed ribbon cable bus
US4357703A (en) * 1980-10-09 1982-11-02 Control Data Corporation Test system for LSI circuits resident on LSI chips
JPS5772362A (en) * 1980-10-23 1982-05-06 Nec Corp Semiconductor device
US4417203A (en) * 1981-05-26 1983-11-22 International Business Machines Corporation System for contactless electrical property testing of multi-layer ceramics
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
US4485472A (en) * 1982-04-30 1984-11-27 Carnegie-Mellon University Testable interface circuit
US4549200A (en) * 1982-07-08 1985-10-22 International Business Machines Corporation Repairable multi-level overlay system for semiconductor device
JPS59122234A (ja) * 1982-12-28 1984-07-14 Mitsubishi Electric Corp Ｌｓｉ装置
US4526859A (en) * 1983-12-12 1985-07-02 International Business Machines Corporation Metallization of a ceramic substrate
US4659942A (en) * 1985-06-03 1987-04-21 The Charles Stark Draper Laboratory, Inc. Fault-tolerant power distribution system

Also Published As

Publication number Publication date
DE3787429T2 (de) 1994-04-21
JPH0744222B2 (ja) 1995-05-15
EP0257201A2 (de) 1988-03-02
US4746815A (en) 1988-05-24
JPS6315441A (ja) 1988-01-22
EP0257201B1 (de) 1993-09-15
EP0257201A3 (en) 1989-11-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee