DE3774690D1 - Lueftungsvorrichtung fuer in reihen auf einer platte angeordnete bausteine. - Google Patents

Lueftungsvorrichtung fuer in reihen auf einer platte angeordnete bausteine.

Info

Publication number
DE3774690D1
DE3774690D1 DE8787402948T DE3774690T DE3774690D1 DE 3774690 D1 DE3774690 D1 DE 3774690D1 DE 8787402948 T DE8787402948 T DE 8787402948T DE 3774690 T DE3774690 T DE 3774690T DE 3774690 D1 DE3774690 D1 DE 3774690D1
Authority
DE
Germany
Prior art keywords
plate
ventilation device
modules arranged
modules
ventilation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787402948T
Other languages
English (en)
Inventor
Jean Bonnefoy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Bull SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SA filed Critical Bull SA
Application granted granted Critical
Publication of DE3774690D1 publication Critical patent/DE3774690D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE8787402948T 1986-12-30 1987-12-22 Lueftungsvorrichtung fuer in reihen auf einer platte angeordnete bausteine. Expired - Fee Related DE3774690D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8618322A FR2609233A1 (fr) 1986-12-30 1986-12-30 Dispositif de ventilation de composants disposes en rangees sur une plaque

Publications (1)

Publication Number Publication Date
DE3774690D1 true DE3774690D1 (de) 1992-01-02

Family

ID=9342406

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787402948T Expired - Fee Related DE3774690D1 (de) 1986-12-30 1987-12-22 Lueftungsvorrichtung fuer in reihen auf einer platte angeordnete bausteine.

Country Status (5)

Country Link
US (1) US4835658A (de)
EP (1) EP0276607B1 (de)
JP (1) JPH0719992B2 (de)
DE (1) DE3774690D1 (de)
FR (1) FR2609233A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140571A (en) * 1992-08-06 2000-10-31 Pfu Limited Heat-generating element cooling device
EP1056130B1 (de) * 1992-08-06 2003-10-29 Pfu Limited Kühlvorrichtung für ein wärmeerzeugendes Bauelement
US5760333A (en) * 1992-08-06 1998-06-02 Pfu Limited Heat-generating element cooling device
JP3144135B2 (ja) * 1993-03-31 2001-03-12 株式会社日立製作所 電子装置
US8136577B2 (en) * 2005-05-31 2012-03-20 Sensis Corporation Method and apparatus for dissipating heat, and radar antenna containing heat dissipating apparatus
US8279131B2 (en) * 2006-09-21 2012-10-02 Raytheon Company Panel array
US9172145B2 (en) 2006-09-21 2015-10-27 Raytheon Company Transmit/receive daughter card with integral circulator
US9019166B2 (en) 2009-06-15 2015-04-28 Raytheon Company Active electronically scanned array (AESA) card
US7671696B1 (en) * 2006-09-21 2010-03-02 Raytheon Company Radio frequency interconnect circuits and techniques
US8210243B2 (en) * 2008-07-21 2012-07-03 International Business Machines Corporation Structure and apparatus for cooling integrated circuits using cooper microchannels
US7859835B2 (en) * 2009-03-24 2010-12-28 Allegro Microsystems, Inc. Method and apparatus for thermal management of a radio frequency system
US8537552B2 (en) * 2009-09-25 2013-09-17 Raytheon Company Heat sink interface having three-dimensional tolerance compensation
US8508943B2 (en) 2009-10-16 2013-08-13 Raytheon Company Cooling active circuits
US8427371B2 (en) 2010-04-09 2013-04-23 Raytheon Company RF feed network for modular active aperture electronically steered arrays
US8363413B2 (en) 2010-09-13 2013-01-29 Raytheon Company Assembly to provide thermal cooling
US8810448B1 (en) 2010-11-18 2014-08-19 Raytheon Company Modular architecture for scalable phased array radars
US8355255B2 (en) 2010-12-22 2013-01-15 Raytheon Company Cooling of coplanar active circuits
US9124361B2 (en) 2011-10-06 2015-09-01 Raytheon Company Scalable, analog monopulse network
JP5972803B2 (ja) * 2013-01-22 2016-08-17 日立オートモティブシステムズ株式会社 車載用制御装置
JP5897482B2 (ja) * 2013-02-26 2016-03-30 株式会社東芝 防滴空冷冷却構造

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1263119B (de) * 1964-01-20 1968-03-14 Siemens Ag Gestell zur Aufnahme einschiebbarer Flachbaugruppen fuer Fernmelde-, insbesondere Fernsprechvermittlungsanlagen
FR2157094A5 (de) * 1971-10-18 1973-06-01 Thomson Csf
US3893910A (en) * 1972-03-09 1975-07-08 Harry E Robson Process for reforming naphthas with novel chyrsotile catalyst compositions
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4233644A (en) * 1979-06-28 1980-11-11 International Business Machines Corporation Dual-pull air cooling for a computer frame
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
JPS5954994U (ja) * 1982-09-14 1984-04-10 富士通株式会社 電子部品冷却装置
US4449164A (en) * 1982-09-27 1984-05-15 Control Data Corporation Electronic module cooling system using parallel air streams
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
JPS6057138U (ja) * 1983-09-26 1985-04-20 富士通株式会社 半導体素子の冷却構造
DE3335365A1 (de) * 1983-09-29 1985-04-18 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum loesbaren befestigen eines kuehlkoerpers auf einem integrierten baustein
FR2570920B1 (fr) * 1984-09-26 1994-09-30 Nec Corp Appareil de refroidissement par air de dispositifs electroniques
US4879632A (en) * 1985-10-04 1989-11-07 Fujitsu Limited Cooling system for an electronic circuit device

Also Published As

Publication number Publication date
JPS63177588A (ja) 1988-07-21
FR2609233A1 (fr) 1988-07-01
EP0276607A1 (de) 1988-08-03
JPH0719992B2 (ja) 1995-03-06
US4835658A (en) 1989-05-30
EP0276607B1 (de) 1991-11-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee