DE3766421D1 - Verfahren und apparat zur loetnivellierung. - Google Patents

Verfahren und apparat zur loetnivellierung.

Info

Publication number
DE3766421D1
DE3766421D1 DE8787108172T DE3766421T DE3766421D1 DE 3766421 D1 DE3766421 D1 DE 3766421D1 DE 8787108172 T DE8787108172 T DE 8787108172T DE 3766421 T DE3766421 T DE 3766421T DE 3766421 D1 DE3766421 D1 DE 3766421D1
Authority
DE
Germany
Prior art keywords
level leveling
leveling
level
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787108172T
Other languages
English (en)
Inventor
John P Simpson
Gary L Newman
James M Larnerd
Alan J Emerick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3766421D1 publication Critical patent/DE3766421D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/40—Application of doors, windows, wings or fittings thereof for gates
    • E05Y2900/402—Application of doors, windows, wings or fittings thereof for gates for cantilever gates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE8787108172T 1986-06-11 1987-06-05 Verfahren und apparat zur loetnivellierung. Expired - Fee Related DE3766421D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87331886A 1986-06-11 1986-06-11

Publications (1)

Publication Number Publication Date
DE3766421D1 true DE3766421D1 (de) 1991-01-10

Family

ID=25361396

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787108172T Expired - Fee Related DE3766421D1 (de) 1986-06-11 1987-06-05 Verfahren und apparat zur loetnivellierung.

Country Status (3)

Country Link
EP (1) EP0249168B1 (de)
JP (1) JPS62292262A (de)
DE (1) DE3766421D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
CN115302040B (zh) * 2022-09-08 2023-10-20 无锡富乐电子有限公司 变压器自动化生产线及治具系统
CN116511632B (zh) * 2023-04-14 2024-01-16 山东乾元半导体科技有限公司 一种led生产涂锡设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2723922A (en) * 1952-12-31 1955-11-15 Sylvania Electric Prod Lead tinning machine
US2821159A (en) * 1956-01-23 1958-01-28 Acf Ind Inc Notch tinner
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3989179A (en) * 1975-09-09 1976-11-02 Blackstone Corporation Methods of dip soldering
FR2347959A1 (fr) * 1976-04-12 1977-11-10 Bertin & Cie Procede d'egouttage de pieces sorties de bains de galvanisation a chaud et machines appliquant le procede
EP0062692B1 (de) * 1981-04-15 1986-12-30 Siemens-Albis Aktiengesellschaft Verfahren und Einrichtung zum Entfernen des Lotes aus den Bohrlöchern von mit Lot beschichteten unbestückten Leiterplatten
EP0166817B1 (de) * 1984-06-07 1987-08-19 Roederstein Spezialfabriken für Bauelemente der Elektronik und Kondensatoren der Starkstromtechnik GmbH Verfahren und Vorrichtung zum Verlöten von Anschlussdrähten von elektrischen Bauteilen sowie Anordnung aus elektrischen Bauteilen

Also Published As

Publication number Publication date
EP0249168B1 (de) 1990-11-28
JPH0527512B2 (de) 1993-04-21
JPS62292262A (ja) 1987-12-18
EP0249168A2 (de) 1987-12-16
EP0249168A3 (en) 1989-01-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee